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XCKU5P-1FFVB676I

Xilinx

XCKU5P-1FFVB676I by Xilinx

Xilinx XCKU5P-1FFVB676I FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. With a supply voltage range of 0.825V to 0.876V, it is ideal for industrial applications requiring high-performance computing in a compact form factor. The package style is grid array with a square shape and ball terminals, suitable for surface mount assembly processes.

Median Price

$2,480.440

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 870 parts In-Stock

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$2,416.810

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Digiode

USA . 393 parts In-Stock

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VNN

France . 773 parts In-Stock

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Vyrian

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MARBEL Systems

Belgium . 420 parts In-Stock

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$16.729

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AZTECH Wire

Italy . 877 parts In-Stock

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Texas Native Microelectronics

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$19.229

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$17.883

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$16.922

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$16.922

Kenton Components

USA . 2,378 parts In-Stock

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$23.075

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Aztec Data Supply Inc.

USA . 2,330 parts In-Stock

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$38.619

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Qasali Group International

UK . 58 parts In-Stock

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Modulus Dynamics

Lithuania . 697 parts In-Stock

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Corohmni

South Africa . 67 parts In-Stock

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Vigor

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One Stop Electronics

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Semicontronic

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$2,152.760

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Corphita

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$2,349.891

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Continental Prestige Electronics

USA . 6,951 parts In-Stock

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Argo Parts USA

USA . 1,907 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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A-Z Elektronik GmbH

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Overview

Unleash the power of innovation with the XCKU5P-1FFVB676I by Xilinx. As a leading manufacturer in the Field Programmable Gate Arrays (FPGA) category, Xilinx delivers unparalleled quality and reliability. With 474600 logic cells and 27120 CLBs, this FPGA offers endless possibilities for your next project. From industrial applications to cutting-edge technology, the XCKU5P-1FFVB676I provides the flexibility and performance you need to stay ahead of the curve. Experience the value and benefits that only Xilinx can offer, and unlock your full potential today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 474600

Offers high logic capacity for complex designs and applications.

Surface Mount: YES

Allows for easy and secure mounting on a PCB.

Maximum Supply Voltage: 0.876 V

Efficient power consumption at a maximum voltage level.

No. of CLBs: 27120

Provides a large number of Configurable Logic Blocks for flexible programming.

No. of Inputs: 304

Offers ample input channels for data processing and communication.

Package Shape: SQUARE

Optimizes space utilization on the PCB.

Form Of Terminal: BALL

Facilitates easy soldering and connectivity.

Nominal Supply Voltage (V): 0.85

Stable and reliable voltage supply for consistent performance.

No. of Terminals: 676

Provides multiple connection points for versatile applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Enables custom logic design and reprogrammability according to user requirements.

Package Style (Meter): GRID ARRAY

Offers a well-organized and easy-to-manage terminal layout.

Minimum Supply Voltage: 0.825 V

Allows for low-power operation at a minimum voltage level.

Maximum Operating Temperature: 100 °C

Can withstand high operating temperatures for industrial applications.

Pitch Of Terminal: 1 mm

Defines the spacing between terminals for accurate connections.

Organization: 27120 CLBS

Clearly outlines the number of Configurable Logic Blocks for design implementation.

Minimum Operating Temperature: -40 °C

Ensures operation in harsh environments with low temperatures.

Finishing Of Terminal Used: TIN SILVER COPPER

Improves conductivity and reliability of terminal connections.

Position Of Terminal: BOTTOM

Simplifies PCB layout and integration with other components.

Moisture Sensitivity Level (MSL): 4

Indicates the level of moisture protection for extended product lifespan.

Maximum Seated Height: 3.52 mm

Maintains a low profile for space-constrained applications.

Width: 27 mm

Defines the physical width of the FPGA for PCB layout considerations.

No. of Outputs: 304

Provides multiple output channels for data transmission and processing.

Maximum Time At Peak Reflow Temperature (s): 30

Specifies the duration of reflow process during assembly.

Peak Reflow Temperature °C: 250

Ensures proper soldering and component integrity during assembly.

Length: 27 mm

Defines the physical length of the FPGA for PCB layout considerations.

Grading Of Temperature: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU5P-1FFVB676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

474600

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

27120

Organization:

27120 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.52 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Trade Compliance

XCKU5P-1FFVB676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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