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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCKU060-2FFVA1517E by Xilinx

XCKU060-2FFVA1517E

Xilinx

Xilinx XCKU060-2FFVA1517E FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for applications requiring high-performance computing and complex algorithm processing in fields like telecommunications, aerospace, and industrial automation. Operating temperature range from 0 to 100°C with a compact square package style.

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU060-2FFVA1517I by Xilinx

XCKU060-2FFVA1517I

Xilinx

Xilinx XCKU060-2FFVA1517I FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Package style is grid array with moisture sensitivity level of 4.

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU060-3FFVA1156E by Xilinx

XCKU060-3FFVA1156E

Xilinx

Xilinx XCKU060-3FFVA1156E FPGA features 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.97V to 1.03V, making it suitable for various industrial environments.

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XCKU060-3FFVA1517E by Xilinx

XCKU060-3FFVA1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU060-L1FFVA1156I by Xilinx

XCKU060-L1FFVA1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

Also Operates at 0.95 V nominal supply

.9

.873 V

.927 V

0.9 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1156

S-PBGA-B1156

e1

No

XCKU060-L1FFVA1517I by Xilinx

XCKU060-L1FFVA1517I

Xilinx

Xilinx XCKU060-L1FFVA1517I FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. Package style is grid array with a square shape and plastic/epoxy material.

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

Also Operates at 0.95 V nominal supply

.9

.873 V

.927 V

0.9 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-1FLVA1517C by Xilinx

XCKU115-1FLVA1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-1FLVA1517I by Xilinx

XCKU115-1FLVA1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-1FLVA2104C by Xilinx

XCKU115-1FLVA2104C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-1FLVB1760C by Xilinx

XCKU115-1FLVB1760C

Xilinx

Xilinx XCKU115-1FLVB1760C FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package with PLASTIC/EPOXY material. Operating temperature range of 0-85°C makes it suitable for various industrial uses.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU115-1FLVB1760I by Xilinx

XCKU115-1FLVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU115-1FLVB2104C by Xilinx

XCKU115-1FLVB2104C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-1FLVB2104I by Xilinx

XCKU115-1FLVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-1FLVD1517C by Xilinx

XCKU115-1FLVD1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-1FLVD1517I by Xilinx

XCKU115-1FLVD1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-1FLVD1924C by Xilinx

XCKU115-1FLVD1924C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-1FLVD1924I by Xilinx

XCKU115-1FLVD1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-1FLVF1924C by Xilinx

XCKU115-1FLVF1924C

Xilinx

Xilinx XCKU115-1FLVF1924C FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing and complex algorithm processing in fields like aerospace, telecommunications, and industrial automation. Package style: grid array with plastic/epoxy material, operating at -40 to 85°C temperature range.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-1FLVF1924I by Xilinx

XCKU115-1FLVF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-2FLVA1517E by Xilinx

XCKU115-2FLVA1517E

Xilinx

Xilinx XCKU115-2FLVA1517E FPGA boasts 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 100°C. Package style is grid array with a square shape and ball terminals.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-2FLVA1517I by Xilinx

XCKU115-2FLVA1517I

Xilinx

Xilinx XCKU115-2FLVA1517I FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact package with a max operating temperature of 100°C. The grid array package style with bottom-positioned terminals ensures efficient power delivery and connectivity.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-2FLVA2104E by Xilinx

XCKU115-2FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-2FLVA2104I by Xilinx

XCKU115-2FLVA2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-2FLVB1760E by Xilinx

XCKU115-2FLVB1760E

Xilinx

Xilinx XCKU115-2FLVB1760E FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 100°C.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU115-2FLVB1760I by Xilinx

XCKU115-2FLVB1760I

Xilinx

Xilinx XCKU115-2FLVB1760I FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for industrial applications requiring high processing power in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.922V to 0.979V.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU115-2FLVB2104E by Xilinx

XCKU115-2FLVB2104E

Xilinx

Xilinx XCKU115-2FLVB2104E FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-2FLVB2104I by Xilinx

XCKU115-2FLVB2104I

Xilinx

Xilinx XCKU115-2FLVB2104I FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-2FLVD1517I by Xilinx

XCKU115-2FLVD1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-2FLVD1924E by Xilinx

XCKU115-2FLVD1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-2FLVD1924I by Xilinx

XCKU115-2FLVD1924I

Xilinx

Xilinx XCKU115-2FLVD1924I is a PLASTIC/EPOXY FPGA with 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. It is used in industrial applications requiring high performance and programmable ICs.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-2FLVF1924E by Xilinx

XCKU115-2FLVF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-2FLVF1924I by Xilinx

XCKU115-2FLVF1924I

Xilinx

Xilinx XCKU115-2FLVF1924I FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact package with a max operating temperature of 100°C. The device features a grid array package style and is surface mountable for ease of integration.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-3FLVA1517E by Xilinx

XCKU115-3FLVA1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-3FLVA2104E by Xilinx

XCKU115-3FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-3FLVB1760E by Xilinx

XCKU115-3FLVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU115-3FLVB2104E by Xilinx

XCKU115-3FLVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-3FLVF1924E by Xilinx

XCKU115-3FLVF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-L1FLVA1517I by Xilinx

XCKU115-L1FLVA1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

Also Operates at 0.95 V nominal supply

.9

.873 V

.927 V

0.9 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-L1FLVF1924I by Xilinx

XCKU115-L1FLVF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

Also Operates at 0.95 V nominal supply

.9

.873 V

.927 V

0.9 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCVU065-2FFVC1517I by Xilinx

XCVU065-2FFVC1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

783300

520

520

600

600 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU080-1FFVA2104I by Xilinx

XCVU080-1FFVA2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

975000

832

832

672

672 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU080-2FFVA2104E by Xilinx

XCVU080-2FFVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

975000

832

832

672

672 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU080-2FFVB2104E by Xilinx

XCVU080-2FFVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

975000

832

832

672

672 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU080-2FFVD1517E by Xilinx

XCVU080-2FFVD1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

975000

832

832

672

672 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU080-3FFVA2104E by Xilinx

XCVU080-3FFVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

975000

832

832

672

672 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU095-2FFVA2104E by Xilinx

XCVU095-2FFVA2104E

Xilinx

Xilinx XCVU095-2FFVA2104E FPGA offers 1176000 logic cells, 768 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a max supply voltage of 0.979V.

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU095-2FFVA2104I by Xilinx

XCVU095-2FFVA2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU095-2FFVB1760E by Xilinx

XCVU095-2FFVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.81 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1