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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7K325T-L2FFG676I by Xilinx

XC7K325T-L2FFG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 25475;

FPGA

25475

0.61 ns

25475 CLBS

.95

.93 V

.97 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.37 mm

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7K325T-L2FFG900I by Xilinx

XC7K325T-L2FFG900I

Xilinx

The Xilinx XC7K325T-L2FFG900I is a FPGA with 25475 CLBs, 0.97V max supply voltage, and 0.61ns combinatorial delay. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact 31mm square package. Suitable for advanced electronics, telecommunications, and industrial automation systems.

FPGA

25475

0.61 ns

25475 CLBS

.95

.93 V

.97 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XC7K355T-L2FFG901I by Xilinx

XC7K355T-L2FFG901I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 901; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

27825

0.61 ns

27825 CLBS

.95

.93 V

.97 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

901

S-PBGA-B901

e1

XC7K410T-L2FBG676I by Xilinx

XC7K410T-L2FBG676I

Xilinx

The Xilinx XC7K410T-L2FBG676I is a FPGA with 31775 CLBs, 0.97V max supply voltage, and 0.61ns combinatorial delay. Ideal for applications requiring high-speed processing and programmable logic capabilities. Package style: GRID ARRAY, terminals: BALL, MSL level: 4.

FPGA

31775

0.61 ns

31775 CLBS

.95

.93 V

.97 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7K410T-L2FFG676I by Xilinx

XC7K410T-L2FFG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B676;

FPGA

31775

0.61 ns

31775 CLBS

.95

.93 V

.97 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.37 mm

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7K410T-L2FFG900I by Xilinx

XC7K410T-L2FFG900I

Xilinx

The Xilinx XC7K410T-L2FFG900I is a FPGA with 31775 CLBs, 0.97V max supply voltage, and 0.61ns combinatorial delay. Ideal for applications requiring high-speed processing, such as telecommunications equipment and industrial automation systems.

FPGA

31775

0.61 ns

31775 CLBS

.95

.93 V

.97 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XC7K480T-L2FFG901I by Xilinx

XC7K480T-L2FFG901I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 901; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

37325

0.61 ns

37325 CLBS

.95

.93 V

.97 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

901

S-PBGA-B901

e1

XC7V2000T-L2FHG1761E by Xilinx

XC7V2000T-L2FHG1761E

Xilinx

The Xilinx XC7V2000T-L2FHG1761E is a high-performance FPGA with 1954560 logic cells and 152700 CLBs. Operating at up to 1818 MHz, it offers 850 inputs/outputs and uses CMOS technology. Ideal for applications requiring fast processing speeds in fields like telecommunications and aerospace.

FPGA

1954560

850

850

152700

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

152700 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1761

S-PBGA-B1761

e1

No

XC7A200T-2FB676I by Xilinx

XC7A200T-2FB676I

Xilinx

XC7A200T-2FB676I by Xilinx is a FPGA with 16825 CLBs, 1.05V max supply voltage, and 1.05ns combinatorial delay. Ideal for industrial applications requiring high-speed processing and programmable logic capabilities in a compact 27mm square package with 676 terminals.

FPGA

16825

1.05 ns

16825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

ICE40UL1K-SWG16ITR by Lattice Semiconductor

ICE40UL1K-SWG16ITR

Lattice Semiconductor

ICE40UL1K-SWG16ITR by Lattice Semiconductor is a 1248 logic cell FPGA with 156 CLBs, operating at 1.2V. It features a combinatorial delay of 9ns and can withstand industrial temperatures (-40 to 100°C). Ideal for applications requiring high-speed processing in harsh environments.

FPGA

1248

10

10

156

9 ns

CMOS

156 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

1

Plastic/Epoxy

Yes

Grid Array

BGA

Square

1.409 mm

1.409 mm

Bottom

Ball

.35 mm

16

S-PBGA-B16

ICE40UL640-SWG16ITR by Lattice Semiconductor

ICE40UL640-SWG16ITR

Lattice Semiconductor

ICE40UL640-SWG16ITR by Lattice Semiconductor is a 640 logic cell FPGA with 80 CLBs, operating at 1.2V. It features a max combinatorial delay of 9ns and can withstand industrial temperatures from -40 to 100°C. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

640

10

10

80

9 ns

CMOS

80 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

1

Plastic/Epoxy

Yes

Grid Array

BGA

Square

1.409 mm

1.409 mm

Bottom

Ball

.35 mm

16

S-PBGA-B16

XC7A200T-2FFV1156I by Xilinx

XC7A200T-2FFV1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .95 V;

FPGA

16825

1.05 ns

16825 CLBS

1

.95 V

1.05 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.1 mm

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XC7A200T-L2FBV484E by Xilinx

XC7A200T-L2FBV484E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: 1.51 ns;

FPGA

16825

1.51 ns

16825 CLBS

.9

.87 V

.93 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7K325T-1FFV900I by Xilinx

XC7K325T-1FFV900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Width: 31 mm;

FPGA

25475

0.74 ns

25475 CLBS

1

.97 V

1.03 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XC7K325T-2FFV900I by Xilinx

XC7K325T-2FFV900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

25475

0.61 ns

25475 CLBS

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XC7K355T-L2FFV901E by Xilinx

XC7K355T-L2FFV901E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 901; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.35 mm;

FPGA

27825

0.91 ns

27825 CLBS

.9

.87 V

.93 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

901

S-PBGA-B901

e1

XC7K410T-1FFV900I by Xilinx

XC7K410T-1FFV900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

31775

0.74 ns

31775 CLBS

1

.97 V

1.03 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XC7K410T-2FBV676I by Xilinx

XC7K410T-2FBV676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

31775

0.61 ns

31775 CLBS

1

.97 V

1.03 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7K410T-2FFV900C by Xilinx

XC7K410T-2FFV900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

31775

0.61 ns

31775 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XC7K420T-L2FFV901E by Xilinx

XC7K420T-L2FFV901E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 901; Package Code: BGA; Package Shape: SQUARE; Organization: 32575 CLBS;

FPGA

32575

0.91 ns

32575 CLBS

.9

.87 V

.93 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

901

S-PBGA-B901

e1

XC7K480T-2FFV1156C by Xilinx

XC7K480T-2FFV1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

37325

0.61 ns

37325 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XC7K70T-1FBV484C by Xilinx

XC7K70T-1FBV484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

5125

0.74 ns

5125 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7VX330T-2FFV1761C by Xilinx

XC7VX330T-2FFV1761C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1761; Package Code: BGA; Package Shape: SQUARE;

FPGA

25500

0.61 ns

25500 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.77 mm

Bottom

Ball

Tin Silver Copper

1 mm

1761

S-PBGA-B1761

e1

XC7VX415T-2FFV1158C by Xilinx

XC7VX415T-2FFV1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

32200

0.61 ns

32200 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

XA7A75T-1FGG484I by Xilinx

XA7A75T-1FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 5900;

FPGA

75520

285

285

5900

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XA7A75T-1FGG484Q by Xilinx

XA7A75T-1FGG484Q

Xilinx

XA7A75T-1FGG484Q by Xilinx is a FPGA with 75520 logic cells, 5900 CLBs, and 285 inputs/outputs. It operates at max frequency of 1098 MHz, suitable for automotive applications due to AEC-Q100 screening and HKMG technology.

FPGA

75520

285

285

5900

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA7A75T-2FGG484I by Xilinx

XA7A75T-2FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

75520

285

285

5900

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XA7A100T-1FGG484I by Xilinx

XA7A100T-1FGG484I

Xilinx

XA7A100T-1FGG484I by Xilinx is a FPGA with 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. It operates at max frequency of 1098 MHz, ideal for high-performance applications in various industries like telecommunications and aerospace due to its advanced HKMG technology.

FPGA

101440

285

285

7925

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XA7A100T-2FGG484I by Xilinx

XA7A100T-2FGG484I

Xilinx

Xilinx XA7A100T-2FGG484I FPGA features 101440 logic cells, 7925 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with PLASTIC/EPOXY body material.

FPGA

101440

285

285

7925

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC5VSX35T-1FFG665CES by Xilinx

XC5VSX35T-1FFG665CES

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

2720

1098 MHz

CMOS

2720 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

665

S-PBGA-B665

e1

LCMXO3L-9400C-5BG484C by Lattice Semiconductor

LCMXO3L-9400C-5BG484C

Lattice Semiconductor

LCMXO3L-9400C-5BG484C by Lattice Semiconductor is a 1175 CLBs FPGA with max supply voltage of 3.465V and square package. Ideal for applications requiring high flexibility and customization in electronics design, operating b/w 0 to 85°C temperature range.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

LCMXO3LF-9400C-6BG484C by Lattice Semiconductor

LCMXO3LF-9400C-6BG484C

Lattice Semiconductor

LCMXO3LF-9400C-6BG484C by Lattice Semiconductor is a 1175 CLBs FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring high flexibility and performance in a compact 19mm square GRID ARRAY package.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

LCMXO3LF-9400C-6BG484I by Lattice Semiconductor

LCMXO3LF-9400C-6BG484I

Lattice Semiconductor

LCMXO3LF-9400C-6BG484I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 9400 logic cells, 1175 CLBs, and 384 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 2.375V to 3.465V. Ideal for applications requiring high-performance programmable ICs in a compact GRID ARRAY package.

FPGA

9400

384

384

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

XCKU095-2FFVB2104E by Xilinx

XCKU095-2FFVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU085-1FLVB1760I by Xilinx

XCKU085-1FLVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU085-1FLVA1517I by Xilinx

XCKU085-1FLVA1517I

Xilinx

Xilinx XCKU085-1FLVA1517I FPGA features 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. With a max supply voltage of 0.979 V, it is ideal for industrial applications requiring high-performance computing in a compact square package with grid array style.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU095-2FFVC1517E by Xilinx

XCKU095-2FFVC1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-2FLVF1924E by Xilinx

XCKU085-2FLVF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU085-1FLVA1517C by Xilinx

XCKU085-1FLVA1517C

Xilinx

Xilinx XCKU085-1FLVA1517C FPGA boasts 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at 0.95V with a max temperature of 85°C, making it suitable for various industrial and commercial projects.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-2FLVF1924I by Xilinx

XCKU085-2FLVF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU085-1FLVB1760C by Xilinx

XCKU085-1FLVB1760C

Xilinx

Xilinx XCKU085-1FLVB1760C FPGA boasts 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.979 V. Package style is grid array with square shape and ball terminals, suitable for various electronic designs.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU095-1FFVB1760C by Xilinx

XCKU095-1FFVB1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU085-2FLVB1760E by Xilinx

XCKU085-2FLVB1760E

Xilinx

XCKU085-2FLVB1760E by Xilinx is a PLASTIC/EPOXY FPGA with 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. It is used for various applications in fields like telecommunications, aerospace, and automotive.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU085-1FLVF1924I by Xilinx

XCKU085-1FLVF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU095-2FFVB1760E by Xilinx

XCKU095-2FFVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU095-1FFVB1760I by Xilinx

XCKU095-1FFVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU085-2FLVB1760I by Xilinx

XCKU085-2FLVB1760I

Xilinx

Xilinx XCKU085-2FLVB1760I FPGA offers 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for industrial applications requiring high processing power in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.922V to 0.979V.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU085-3FLVA1517E by Xilinx

XCKU085-3FLVA1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No