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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCKU085-1FLVF1924C by Xilinx

XCKU085-1FLVF1924C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU095-1FFVC1517C by Xilinx

XCKU095-1FFVC1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU095-2FFVB1760I by Xilinx

XCKU095-2FFVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU095-1FFVB2104C by Xilinx

XCKU095-1FFVB2104C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU085-2FLVA1517E by Xilinx

XCKU085-2FLVA1517E

Xilinx

Xilinx XCKU085-2FLVA1517E FPGA offers 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact grid array package with PLASTIC/EPOXY body material. Operating temperature range from 0 to 100 °C suits various industrial needs.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-3FLVB1760E by Xilinx

XCKU085-3FLVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU095-2FFVB2104I by Xilinx

XCKU095-2FFVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU095-2FFVC1517I by Xilinx

XCKU095-2FFVC1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-2FLVA1517I by Xilinx

XCKU085-2FLVA1517I

Xilinx

Xilinx XCKU085-2FLVA1517I FPGA offers 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C. The package style is grid array with a square shape and ball terminals for surface mount assembly.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU025-1FFVA1156C by Xilinx

XCKU025-1FFVA1156C

Xilinx

Xilinx XCKU025-1FFVA1156C FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operating temperature range from 0 to 85°C makes it versatile for various industrial uses.

FPGA

318150

312

312

18180

18180 CLBS

0.95

.922 V

.979 V

0 °C (32 °F)

85 °C (185 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU025-1FFVA1156I by Xilinx

XCKU025-1FFVA1156I

Xilinx

Xilinx XCKU025-1FFVA1156I FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a wide operating temperature range (-40 to 100°C) in a compact square grid array package.

FPGA

318150

312

312

18180

18180 CLBS

0.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU025-2FFVA1156E by Xilinx

XCKU025-2FFVA1156E

Xilinx

Xilinx XCKU025-2FFVA1156E FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with grid array style. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.

FPGA

318150

312

312

18180

18180 CLBS

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU095-1FFVA1156C by Xilinx

XCKU095-1FFVA1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

67200 CLBS

0.95

.922 V

.979 V

0 °C (32 °F)

85 °C (185 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU095-1FFVA1156I by Xilinx

XCKU095-1FFVA1156I

Xilinx

Xilinx XCKU095-1FFVA1156I is a FPGA with 1176000 logic cells, 67200 CLBs, and 702 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 0.922V to 0.979V. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

1176000

702

702

67200

67200 CLBS

.85

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU095-2FFVA1156E by Xilinx

XCKU095-2FFVA1156E

Xilinx

Xilinx XCKU095-2FFVA1156E FPGA offers 1176000 logic cells, 67200 CLBs, and 702 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 100°C. Package style: grid array, surface mountable, with a square shape and ball terminals.

FPGA

1176000

702

702

67200

67200 CLBS

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1156

S-PBGA-B1156

e1

XCKU095-2FFVA1156I by Xilinx

XCKU095-2FFVA1156I

Xilinx

Xilinx XCKU095-2FFVA1156I FPGA features 1176000 logic cells, 67200 CLBs, and 702 inputs/outputs. Ideal for industrial applications requiring high processing power in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.922V to 0.979V.

FPGA

1176000

702

702

67200

67200 CLBS

0.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-1FFVA1156E by Xilinx

XCKU11P-1FFVA1156E

Xilinx

Xilinx XCKU11P-1FFVA1156E FPGA offers 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for applications requiring high processing power in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.825V to 0.876V.

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-1FFVA1156I by Xilinx

XCKU11P-1FFVA1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-1FFVD900E by Xilinx

XCKU11P-1FFVD900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU11P-1FFVD900I by Xilinx

XCKU11P-1FFVD900I

Xilinx

Xilinx XCKU11P-1FFVD900I FPGA offers 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C.

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU11P-1FFVE1517E by Xilinx

XCKU11P-1FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-1FFVE1517I by Xilinx

XCKU11P-1FFVE1517I

Xilinx

XCKU11P-1FFVE1517I by Xilinx is a PLASTIC/EPOXY FPGA with 653100 logic cells and 37320 CLBs. It has applications in industrial settings, offering a wide temperature range (-40 to 100 °C) and high reliability (Moisture Sensitivity Level 4).

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-2FFVA1156I by Xilinx

XCKU11P-2FFVA1156I

Xilinx

Xilinx XCKU11P-2FFVA1156I FPGA features 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Utilizes a grid array package style with a square shape and ball terminals for versatile integration.

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-2FFVD900I by Xilinx

XCKU11P-2FFVD900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU11P-2FFVE1517I by Xilinx

XCKU11P-2FFVE1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-3FFVA1156E by Xilinx

XCKU11P-3FFVA1156E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-3FFVD900E by Xilinx

XCKU11P-3FFVD900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU11P-3FFVE1517E by Xilinx

XCKU11P-3FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-L1FFVA1156I by Xilinx

XCKU11P-L1FFVA1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-L1FFVD900I by Xilinx

XCKU11P-L1FFVD900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU11P-L1FFVE1517I by Xilinx

XCKU11P-L1FFVE1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-L2FFVA1156E by Xilinx

XCKU11P-L2FFVA1156E

Xilinx

Xilinx XCKU11P-L2FFVA1156E FPGA offers 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for applications requiring high-performance computing and signal processing in industries like telecommunications, aerospace, and automotive. Operating temperature range from 0 to 110°C with a package style of grid array.

FPGA

653100

512

512

37320

37320 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-L2FFVE1517E by Xilinx

XCKU11P-L2FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU13P-1FFVE900E by Xilinx

XCKU13P-1FFVE900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

746550

304

304

42660

42660 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU13P-1FFVE900I by Xilinx

XCKU13P-1FFVE900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

746550

304

304

42660

42660 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU13P-2FFVE900I by Xilinx

XCKU13P-2FFVE900I

Xilinx

Xilinx XCKU13P-2FFVE900I FPGA features 746550 logic cells, 42660 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. Package style is grid array with moisture sensitivity level of MSL4.

FPGA

746550

304

304

42660

42660 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU15P-1FFVA1156E by Xilinx

XCKU15P-1FFVA1156E

Xilinx

Xilinx XCKU15P-1FFVA1156E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 100°C.

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.71 mm

BGA1156,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1156

S-PBGA-B1156

e1

XCKU15P-1FFVA1156I by Xilinx

XCKU15P-1FFVA1156I

Xilinx

Xilinx XCKU15P-1FFVA1156I FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a package style of grid array. Operating temperature ranges from -40 to 100 °C.

FPGA

1143450

668

668

65340

65340 CLBS

.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU15P-1FFVA1760E by Xilinx

XCKU15P-1FFVA1760E

Xilinx

Xilinx XCKU15P-1FFVA1760E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor with a max supply voltage of 0.876 V.

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU15P-1FFVA1760I by Xilinx

XCKU15P-1FFVA1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU15P-1FFVE1517E by Xilinx

XCKU15P-1FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-1FFVE1517I by Xilinx

XCKU15P-1FFVE1517I

Xilinx

Xilinx XCKU15P-1FFVE1517I FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a max supply voltage of 0.876V.

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-1FFVE1760E by Xilinx

XCKU15P-1FFVE1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU15P-1FFVE1760I by Xilinx

XCKU15P-1FFVE1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU15P-2FFVA1156I by Xilinx

XCKU15P-2FFVA1156I

Xilinx

Xilinx XCKU15P-2FFVA1156I FPGA features 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. With a supply voltage range of 0.825V to 0.876V, it is ideal for industrial applications requiring high-performance computing in a compact 35mm square grid array package.

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.71 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU15P-2FFVA1760I by Xilinx

XCKU15P-2FFVA1760I

Xilinx

Xilinx XCKU15P-2FFVA1760I FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C. The package style is grid array with a square shape and bottom-positioned terminals for efficient PCB integration.

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU15P-2FFVE1517I by Xilinx

XCKU15P-2FFVE1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-2FFVE1760I by Xilinx

XCKU15P-2FFVE1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1