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XCKU085-2FLVA1517I

Xilinx

XCKU085-2FLVA1517I by Xilinx

Xilinx XCKU085-2FLVA1517I FPGA offers 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C. The package style is grid array with a square shape and ball terminals for surface mount assembly.

Median Price

$8,167.670

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Nova Conductors

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Overview

Looking to take your projects to the next level? Look no further than the Xilinx XCKU085-2FLVA1517I Field Programmable Gate Array. With over 1 million logic cells and 62190 CLBs, this FPGA offers unparalleled performance and versatility. Manufactured by industry leader Xilinx, you can trust in the quality and reliability of this product. Whether you're designing cutting-edge electronics or optimizing complex algorithms, the XCKU085-2FLVA1517I will deliver the speed, power, and flexibility you need. Upgrade your creations today with Xilinx!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components, making it a reliable choice for various applications.

No. of Logic Cells: 1088325

With a large number of logic cells, this FPGA can handle complex logic functions and processes efficiently, making it suitable for high-performance applications.

Surface Mount: YES

Being surface mountable makes the FPGA easy to integrate onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 0.979 V

The low maximum supply voltage of 0.979 V helps in reducing power consumption and heat generation, making the FPGA energy-efficient.

No. of CLBs: 62190

The high number of Configurable Logic Blocks (CLBs) allows for flexible and customizable logic configurations, enabling the FPGA to adapt to a variety of applications.

No. of Inputs: 676

Having a large number of inputs allows for more input signals to be processed simultaneously, enhancing the FPGA's capability to handle complex tasks.

Package Shape: SQUARE

The square package shape offers equal dimensions on all sides, making it easier to design and mount the FPGA onto circuit boards efficiently.

Nominal Supply Voltage (V): 0.95

The nominal supply voltage of 0.95 V ensures stable and reliable operation of the FPGA, contributing to its overall performance and longevity.

Power Supplies (V): 0.95

Having consistent power supplies at 0.95 V ensures proper functionality and prevents voltage fluctuations that could potentially damage the FPGA.

No. of Terminals: 1517

The high number of terminals provides ample connectivity options, allowing for easy integration and extensive communication capabilities with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array means that the logic functions of the FPGA can be reconfigured and optimized as needed, offering flexibility and adaptability in various applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and organized layout of terminals, facilitating easy assembly and enhancing the overall aesthetics of the FPGA.

Minimum Supply Voltage: 0.922 V

The low minimum supply voltage of 0.922 V ensures compatibility with a wide range of power sources and allows for efficient power management within the FPGA.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C indicates that the FPGA can withstand harsh environmental conditions and operate reliably in challenging thermal environments.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals enables easy soldering and connection with other components, ensuring a secure and stable electrical connection for optimal performance.

Organization: 62190 CLBS

The organization of 62190 Configurable Logic Blocks (CLBs) allows for efficient logic structuring and programming, enabling the FPGA to perform complex operations with speed and accuracy.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the FPGA can function reliably in cold environments without experiencing performance issues or damage.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of Tin-Silver-Copper finishing on terminals enhances conductivity, corrosion resistance, and solderability, ensuring a reliable and long-lasting connection for the FPGA.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom allows for easy integration onto PCBs and facilitates efficient heat dissipation, contributing to the overall reliability and performance of the FPGA.

Moisture Sensitivity Level (MSL): 4

The MSL rating of 4 indicates that the FPGA is capable of withstanding moderate exposure to moisture during storage and handling, ensuring its structural integrity and reliability.

Maximum Seated Height: 4.09 mm

The low maximum seated height of 4.09 mm makes the FPGA suitable for compact designs and applications where space is limited, without compromising on performance or functionality.

Width: 40 mm

With a width of 40 mm, the FPGA offers a compact form factor that can be easily integrated into various electronic systems and devices, allowing for versatile applications.

No. of Outputs: 676

Having a high number of outputs enables the FPGA to drive multiple devices or receive data simultaneously, enhancing its ability to process and transmit information efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature of 245°C ensures proper soldering and assembly of the FPGA onto PCBs, guaranteeing a secure and reliable connection.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C is within the acceptable range for soldering processes, ensuring that the FPGA can be effectively and safely integrated onto circuit boards.

Length: 40 mm

With a length of 40 mm, the FPGA maintains a balanced form factor that can be easily accommodated in various electronic designs, offering flexibility and versatility in application.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures that the FPGA can operate reliably in demanding industrial environments with varying temperature conditions, making it a robust and durable choice for industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU085-2FLVA1517I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1088325

No. of Inputs:

676

No. of Outputs:

676

No. of CLBs:

62190

Sub-Category:

Field Programmable Gate Arrays

Organization:

62190 CLBS

Power Characteristics

Nominal Supply Voltage:

0.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Power Supplies:

0.95 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

40 mm

Width:

40 mm

Maximum Seated Height:

4.09 mm

Package Equivalence Code:

BGA1517,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU085-2FLVA1517I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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