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XCKU11P-1FFVD900I

Xilinx

XCKU11P-1FFVD900I by Xilinx

Xilinx XCKU11P-1FFVD900I FPGA offers 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C.

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Overview

Enhance your projects with the XCKU11P-1FFVD900I by Xilinx, a top-of-the-line Field Programmable Gate Array (FPGA) designed to deliver exceptional performance and reliability. With over 653,000 logic cells and 37,320 CLBs, this FPGA is perfect for applications requiring high-speed processing and advanced functionalities. Backed by Xilinx's reputation for quality and innovation, this product offers customers unparalleled value and benefits. Whether you're designing cutting-edge electronics or pushing the boundaries of technology, the XCKU11P-1FFVD900I is the perfect choice to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the FPGA, ensuring a longer lifespan.

No. of Logic Cells: 653100

With a high number of logic cells, this FPGA offers extensive programming capabilities for complex applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into electronic circuit boards.

Maximum Supply Voltage: 0.876 V

With a high maximum supply voltage, this FPGA can support power-hungry applications without risking damage.

No. of CLBs: 37320

The large number of Configurable Logic Blocks (CLBs) allows for versatile customization of the FPGA's functionality.

No. of Inputs: 512

Having a high number of inputs enables the FPGA to process a large amount of data simultaneously, making it suitable for data-intensive tasks.

Package Shape: SQUARE

The square shape of the package provides a compact form factor and efficient use of space on a circuit board.

Form Of Terminal: BALL

Ball terminals offer reliable connectivity and easy soldering during the assembly process.

Nominal Supply Voltage (V): 0.85

The nominal supply voltage of 0.85V ensures compatibility with a wide range of power sources and reduces power consumption.

No. of Terminals: 900

Having a high number of terminals allows for versatile connectivity options and integration with various types of circuit boards.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility and adaptability for different applications without the need for specialized hardware.

Package Style (Meter): GRID ARRAY

The grid array package style provides a secure mounting and connection mechanism for the FPGA on a circuit board.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage ensures compatibility with low-power applications and reduces energy consumption.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and extended use without overheating.

Pitch Of Terminal: 1 mm

The 1mm pitch of the terminals allows for precise and secure connections during assembly, ensuring reliability in the long run.

Organization: 37320 CLBS

The organized structure of 37320 Configurable Logic Blocks (CLBs) simplifies the programming and customization process for developers.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this FPGA to function reliably in cold environments or during temperature fluctuations.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals ensures excellent conductivity and corrosion resistance, prolonging the FPGA's lifespan.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom makes it easier to mount and connect the FPGA securely on a circuit board.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this FPGA is less susceptible to moisture damage during storage and handling.

Maximum Seated Height: 3.42 mm

The low maximum seated height of 3.42mm allows for a compact design and efficient use of space in electronic assemblies.

Width: 31 mm

With a width of 31mm, this FPGA can fit easily into standard electronic devices and circuit board layouts.

No. of Outputs: 512

Having a high number of outputs enables the FPGA to drive multiple components or signals simultaneously, increasing its versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures safe and efficient soldering during the manufacturing process.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, this FPGA can withstand high-temperature soldering processes without damage.

Length: 31 mm

The 31mm length of the FPGA offers a balanced size that can accommodate complex circuitry without sacrificing space efficiency.

Grading Of Temperature: INDUSTRIAL

Being graded for industrial temperature ranges, this FPGA is suitable for rugged environments and applications that require high reliability.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU11P-1FFVD900I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

653100

No. of Inputs:

512

No. of Outputs:

512

No. of CLBs:

37320

Organization:

37320 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

3.42 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Trade Compliance

XCKU11P-1FFVD900I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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