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XCKU15P-2FFVA1156I

Xilinx

XCKU15P-2FFVA1156I by Xilinx

Xilinx XCKU15P-2FFVA1156I FPGA features 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. With a supply voltage range of 0.825V to 0.876V, it is ideal for industrial applications requiring high-performance computing in a compact 35mm square grid array package.

Median Price

$8,303.270

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Mouser Electronics

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Digiode

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Overview

Unlock unparalleled performance and flexibility with the XCKU15P-2FFVA1156I from Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). This innovative product boasts over 1 million logic cells and 65340 CLBs, making it ideal for a wide range of applications. Dive into a world of endless possibilities with this FPGA, offering customers unmatched value and benefits. Experience seamless integration, cutting-edge technology, and reliable performance like never before. Elevate your projects to new heights with the XCKU15P-2FFVA1156I by Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the components inside, making this product durable and reliable.

No. of Logic Cells: 1143450

With a large number of logic cells, this FPGA can handle complex designs and calculations, making it suitable for high-performance applications.

Surface Mount: YES

Being surface mountable makes this FPGA easy to integrate into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 0.876 V

This low maximum supply voltage helps reduce power consumption and heat generation, making this FPGA energy-efficient.

No. of CLBs: 65340

The high number of Configurable Logic Blocks allows for a high degree of flexibility in designing custom logic circuits, making this FPGA versatile.

No. of Inputs: 668

With a large number of inputs, this FPGA can handle multiple data streams simultaneously, making it suitable for data-intensive applications.

Package Shape: SQUARE

The square package shape is efficient for space utilization on circuit boards, allowing for compact and dense designs using this FPGA.

Form Of Terminal: BALL

The use of ball terminals makes soldering connections easier and more reliable, ensuring secure connections in the final product.

Nominal Supply Voltage (V): 0.85

Having a stable nominal supply voltage ensures consistent performance and reliability of the FPGA in various operating conditions.

No. of Terminals: 1156

The high number of terminals allows for a greater number of I/O connections, enabling this FPGA to interface with numerous external devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The reprogrammable nature of FPGAs allows for flexibility in design changes and updates, making this product adaptable to evolving requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides a secure mounting platform for the FPGA, ensuring stability and reliability in operation.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage enables this FPGA to operate efficiently with low power sources, making it suitable for portable and battery-powered devices.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions, making it suitable for industrial applications.

Pitch Of Terminal: 1 mm

The small pitch of the terminals allows for dense packing of components on the circuit board, maximizing space efficiency in designs using this FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU15P-2FFVA1156I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1143450

No. of Inputs:

668

No. of Outputs:

668

No. of CLBs:

65340

Organization:

65340 CLBs

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.71 mm

Package Equivalence Code:

BGA1156,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Trade Compliance

XCKU15P-2FFVA1156I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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