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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCVU095-2FFVB1760I by Xilinx

XCVU095-2FFVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.81 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCVU095-2FFVC1517E by Xilinx

XCVU095-2FFVC1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU095-2FFVC1517I by Xilinx

XCVU095-2FFVC1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU095-2FFVC2104E by Xilinx

XCVU095-2FFVC2104E

Xilinx

Xilinx XCVU095-2FFVC2104E FPGA features 1176000 logic cells, 768 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C.

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.04 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU095-2FFVC2104I by Xilinx

XCVU095-2FFVC2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.04 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU095-2FFVD1517E by Xilinx

XCVU095-2FFVD1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU095-3FFVA2104E by Xilinx

XCVU095-3FFVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU125-2FLVA2104E by Xilinx

XCVU125-2FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU125-2FLVA2104I by Xilinx

XCVU125-2FLVA2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU125-2FLVB1760E by Xilinx

XCVU125-2FLVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCVU125-2FLVB1760I by Xilinx

XCVU125-2FLVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCVU125-2FLVB2104E by Xilinx

XCVU125-2FLVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU125-2FLVB2104I by Xilinx

XCVU125-2FLVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU125-2FLVC2104E by Xilinx

XCVU125-2FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.29 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU125-2FLVC2104I by Xilinx

XCVU125-2FLVC2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.29 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU160-2FLGB2104E by Xilinx

XCVU160-2FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2026500

702

702

1560

1560 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU160-2FLGB2104I by Xilinx

XCVU160-2FLGB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2026500

702

702

1560

1560 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU160-2FLGC2104E by Xilinx

XCVU160-2FLGC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2026500

702

702

1560

1560 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU160-2FLGC2104I by Xilinx

XCVU160-2FLGC2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2026500

702

702

1560

1560 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU160-3FLGB2104E by Xilinx

XCVU160-3FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2026500

702

702

1560

1560 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU190-2FLGA2577E by Xilinx

XCVU190-2FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.01 mm

BGA2577,51X51,40

Bottom

Ball

Tin Silver Copper

1 mm

2577

S-PBGA-B2577

e1

XCVU190-2FLGB2104E by Xilinx

XCVU190-2FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU190-2FLGB2104I by Xilinx

XCVU190-2FLGB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU190-2FLGC2104E by Xilinx

XCVU190-2FLGC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU190-3FLGA2577E by Xilinx

XCVU190-3FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.01 mm

BGA2577,51X51,40

Bottom

Ball

Tin Silver Copper

1 mm

2577

S-PBGA-B2577

e1

XCVU190-3FLGB2104E by Xilinx

XCVU190-3FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU190-3FLGC2104E by Xilinx

XCVU190-3FLGC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU440-1FLGA2892C by Xilinx

XCVU440-1FLGA2892C

Xilinx

Xilinx XCVU440-1FLGA2892C FPGA features 5540850 logic cells, 2880 CLBs, and 1456 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.979 V. Package style is grid array with a square shape and ball terminals, suitable for various electronic systems.

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

55 mm

55 mm

3.83 mm

BGA2892,54X54,40

Bottom

Ball

Tin Silver Copper

1 mm

2892

S-PBGA-B2892

e1

XCVU440-1FLGB2377C by Xilinx

XCVU440-1FLGB2377C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2377; Package Code: BGA; Package Shape: SQUARE;

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.83 mm

BGA2377,49X49,40

Bottom

Ball

Tin Silver Copper

1 mm

2377

S-PBGA-B2377

e1

XCVU440-2FLGA2892E by Xilinx

XCVU440-2FLGA2892E

Xilinx

Xilinx XCVU440-2FLGA2892E FPGA offers 5540850 logic cells, 2880 CLBs, and 1456 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a package style of grid array. Operating temperature range from 0 to 100 °C, making it suitable for various industrial uses.

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

55 mm

55 mm

3.83 mm

BGA2892,54X54,40

Bottom

Ball

Tin Silver Copper

1 mm

2892

S-PBGA-B2892

e1

XCVU440-2FLGA2892I by Xilinx

XCVU440-2FLGA2892I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2892; Package Code: BGA; Package Shape: SQUARE;

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

55 mm

55 mm

3.83 mm

BGA2892,54X54,40

Bottom

Ball

Tin Silver Copper

1 mm

2892

S-PBGA-B2892

e1

XCVU440-2FLGB2377E by Xilinx

XCVU440-2FLGB2377E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2377; Package Code: BGA; Package Shape: SQUARE;

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.83 mm

BGA2377,49X49,40

Bottom

Ball

Tin Silver Copper

1 mm

2377

S-PBGA-B2377

e1

XCVU440-2FLGB2377I by Xilinx

XCVU440-2FLGB2377I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2377; Package Code: BGA; Package Shape: SQUARE;

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.83 mm

BGA2377,49X49,40

Bottom

Ball

Tin Silver Copper

1 mm

2377

S-PBGA-B2377

e1

XCVU440-3FLGA2892E by Xilinx

XCVU440-3FLGA2892E

Xilinx

Xilinx XCVU440-3FLGA2892E FPGA offers 5540850 logic cells, 2880 CLBs, and 1456 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 1.03 V and operating temperature range from 0 to 100°C. Its grid array package style with square shape and ball terminals make it suitable for various electronic designs.

FPGA

5540850

1456

1456

2880

2880 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

55 mm

55 mm

3.83 mm

BGA2892,54X54,40

Bottom

Ball

Tin Silver Copper

1 mm

2892

S-PBGA-B2892

e1

XC7A100T-L1FGG484I by Xilinx

XC7A100T-L1FGG484I

Xilinx

Xilinx XC7A100T-L1FGG484I is a FPGA with 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. It operates b/w -40 to 100°C, has a max supply voltage of 0.98V, and combinatorial delay of 1.27ns. Ideal for applications requiring high-speed processing in compact designs.

FPGA

101440

285

285

7925

1.27 ns

7925 CLBS

.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A15T-1FGG484I by Xilinx

XC7A15T-1FGG484I

Xilinx

The Xilinx XC7A15T-1FGG484I is a Field Programmable Gate Array (FPGA) with 1300 CLBs and a max supply voltage of 1.05V. It features a grid array package style, operates in industrial temperatures (-40 to 100°C), and is suitable for applications requiring high-speed processing and programmable logic capabilities.

FPGA

1300

1.27 ns

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

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XC7A15T-2FGG484C by Xilinx

XC7A15T-2FGG484C

Xilinx

Xilinx XC7A15T-2FGG484C is a 1300 CLB FPGA with max supply voltage of 1.05V and combinatorial delay of 1.05ns. Ideal for applications requiring high-speed processing in compact form factors, such as IoT devices and industrial automation systems.

FPGA

1300

1.05 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A15T-2FGG484I by Xilinx

XC7A15T-2FGG484I

Xilinx

The Xilinx XC7A15T-2FGG484I is a 1300 CLB FPGA with max supply voltage of 1.05V and combinatorial delay of 1.05ns. It is used in applications requiring high-speed processing and programmable logic capabilities, featuring a grid array package style for easy mounting on PCBs.

FPGA

1300

1.05 ns

1300 CLBS

1

.95 V

1.05 V

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A15T-3FGG484E by Xilinx

XC7A15T-3FGG484E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;

FPGA

1300

0.94 ns

1300 CLBS

1

.95 V

1.05 V

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A200T-L1FBG484I by Xilinx

XC7A200T-L1FBG484I

Xilinx

Xilinx XC7A200T-L1FBG484I is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. Operating b/w -40 to 100 °C, it's ideal for applications requiring high-speed processing and programmable ICs in compact spaces. Package style: Grid Array; Supply voltage range: 0.92V to 0.98V.

FPGA

215360

285

285

16825

1.27 ns

16825 CLBS

.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

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XC7A200T-L1FBG676I by Xilinx

XC7A200T-L1FBG676I

Xilinx

Xilinx XC7A200T-L1FBG676I is a FPGA with 215360 logic cells, 16825 CLBs, and 400 inputs/outputs. Operating b/w -40 to 100 °C, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a grid array package style and moisture sensitivity level of 4, it offers versatile programmability in compact designs.

FPGA

215360

400

400

16825

1.27 ns

16825 CLBS

.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7A35T-L1FGG484I by Xilinx

XC7A35T-L1FGG484I

Xilinx

Xilinx XC7A35T-L1FGG484I is a 2600 CLB FPGA with 0.98V max supply voltage and 1.27ns combinatorial delay. Ideal for applications requiring high-speed processing in compact form factors, such as telecommunications equipment and industrial automation systems.

FPGA

2600

1.27 ns

2600 CLBS

.95

.92 V

.98 V

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A50T-L1FGG484I by Xilinx

XC7A50T-L1FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Length: 23 mm;

FPGA

52160

250

250

4075

1.27 ns

4075 CLBS

.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7K160T-L2FBG484I by Xilinx

XC7K160T-L2FBG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

12675

0.61 ns

12675 CLBS

.95

.93 V

.97 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7K160T-L2FBG676I by Xilinx

XC7K160T-L2FBG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 12675;

FPGA

12675

0.61 ns

12675 CLBS

.95

.93 V

.97 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7K160T-L2FFG676I by Xilinx

XC7K160T-L2FFG676I

Xilinx

Xilinx XC7K160T-L2FFG676I is a FPGA with 12675 CLBs, 0.97V max supply voltage, and 0.61ns combinatorial delay. Ideal for high-performance applications requiring fast processing speeds and programmable logic capabilities in a compact 27mm square package.

FPGA

12675

0.61 ns

12675 CLBS

.95

.93 V

.97 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.37 mm

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7K325T-L2FBG676I by Xilinx

XC7K325T-L2FBG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .97 V;

FPGA

25475

0.61 ns

25475 CLBS

.95

.93 V

.97 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7K325T-L2FBG900I by Xilinx

XC7K325T-L2FBG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Organization: 25475 CLBS;

FPGA

25475

0.61 ns

25475 CLBS

.95

.93 V

.97 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1