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XC7A200T-L1FBG484I

Xilinx

XC7A200T-L1FBG484I by Xilinx

Xilinx XC7A200T-L1FBG484I is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. Operating b/w -40 to 100 °C, it's ideal for applications requiring high-speed processing and programmable ICs in compact spaces. Package style: Grid Array; Supply voltage range: 0.92V to 0.98V.

Median Price

$357.490

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Mouser Electronics

USA . 19 parts In-Stock

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Digiode

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Nova Conductors

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AZTECH Wire

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Modulus Dynamics

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Texas Native Microelectronics

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Microchip USA

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$216.240

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$215.900

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$215.560

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Kenton Components

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$205.479

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$194.432

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Vigor

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One Stop Electronics

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Continental Prestige Electronics

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Qasali Group International

UK . 20,053 parts In-Stock

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Argo Parts USA

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Overview

Unleash the power of innovation with the Xilinx XC7A200T-L1FBG484I Field Programmable Gate Array (FPGA). Manufactured by Xilinx, a leader in cutting-edge technology, this FPGA offers unmatched quality and reliability. With over 215,000 logic cells and 16,825 CLBs, this versatile device is perfect for a wide range of applications. From aerospace to telecommunications, the possibilities are endless. Experience lightning-fast performance, low power consumption, and easy programmability, all in a compact square package with ball terminals. Elevate your projects to new heights with the Xilinx XC7A200T-L1FBG484I FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good thermal and mechanical properties for reliable performance.

No. of Logic Cells: 215360

Large number of logic cells allow for complex designs and high functionality in the FPGA.

Surface Mount: YES

Surface mount capability makes installation and assembly of the FPGA easier and more efficient.

Maximum Supply Voltage: 0.98 V

A low maximum supply voltage helps in reducing power consumption and heat generation in the device.

No. of CLBs: 16825

The high number of Configurable Logic Blocks (CLBs) allows for flexible and versatile logic implementation.

No. of Inputs: 285

With a high number of inputs, the FPGA can handle a wide range of input signals and data.

Package Shape: SQUARE

Square package shape provides efficient use of board space and easy integration into designs.

Nominal Supply Voltage (V): 0.95

Stable nominal supply voltage ensures consistent and reliable performance of the FPGA.

No. of Terminals: 484

Having a large number of terminals allows for more connectivity and interfacing options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for customization and reconfigurability of the device.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates easy mounting and connection on a circuit board.

Minimum Supply Voltage: 0.92 V

Low minimum supply voltage ensures proper functionality even at low power conditions.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range allows for use in various environmental conditions.

Pitch Of Terminal: 1 mm

Compact pitch of terminals enables efficient layout and design of the circuit board.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low combinatorial delay of a Configurable Logic Block ensures fast processing and response times.

Organization: 16825 CLBS

Well-organized arrangement of Configurable Logic Blocks provides ease of design and implementation.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in extreme cold conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Utilizing tin, silver, and copper for terminal finishing ensures good conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Bottom terminal position allows for efficient heat dissipation and space-saving layout on a circuit board.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level of 4 indicates a robust package design for protection against moisture damage.

Maximum Seated Height: 2.54 mm

Low seated height contributes to a compact and slim profile of the FPGA for system integration.

Width: 23 mm

Optimal width dimension provides a balanced form factor for compatibility with various board layouts.

No. of Outputs: 285

High number of outputs allow for driving multiple external devices and signals efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

Specified time limit for reflow temperature helps prevent damage to the FPGA during manufacturing processes.

Peak Reflow Temperature °C: 250

High peak reflow temperature capability ensures proper soldering and reliability of the device in assembly.

Length: 23 mm

Optimal length dimension provides a balanced form factor for compatibility with various board layouts.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A200T-L1FBG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

215360

No. of Inputs:

285

No. of Outputs:

285

No. of CLBs:

16825

CLB Maximum Delay:

1.27 ns

Organization:

16825 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.92 V

Maximum Supply Voltage:

.98 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.54 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Trade Compliance

XC7A200T-L1FBG484I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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