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XC7K160T-L2FFG676I

Xilinx

XC7K160T-L2FFG676I by Xilinx

Xilinx XC7K160T-L2FFG676I is a FPGA with 12675 CLBs, 0.97V max supply voltage, and 0.61ns combinatorial delay. Ideal for high-performance applications requiring fast processing speeds and programmable logic capabilities in a compact 27mm square package.

Median Price

$901.060

Lifecycle Status

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6

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1k+

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Mouser Electronics

USA . 3 parts In-Stock

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Digiode

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VNN

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Nova Conductors

Japan . 200 parts In-Stock

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AZTECH Wire

Italy . 634 parts In-Stock

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Modulus Dynamics

Lithuania . 281 parts In-Stock

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Corohmni

South Africa . 108 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 100 parts In-Stock

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$214.531

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$205.950

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$199.514

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$188.787

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Qasali Group International

UK . 70 parts In-Stock

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$482.695

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Vigor

Singapore . 475 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 3 parts In-Stock

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Semicontronic

India . 3 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

USA . 2,419 parts In-Stock

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$873.786

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Supply Digital

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Overview

Unlock endless possibilities with the Xilinx XC7K160T-L2FFG676I Field Programmable Gate Array. Manufactured by the industry leader Xilinx, this FPGA offers unparalleled quality and reliability. With over 12,000 CLBs and a wide range of applications, this product provides customers with the flexibility and performance they need. Whether you're designing cutting-edge electronics or pushing the boundaries of innovation, the XC7K160T-L2FFG676I delivers value, efficiency, and unmatched benefits to help you succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the FPGA, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mount design allows for easy and convenient installation of the FPGA on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 0.97 V

Higher maximum supply voltage allows for flexibility in power supply options, accommodating different system requirements.

No. of CLBs: 12675

Large number of Configurable Logic Blocks (CLBs) enable complex logic functions to be implemented, making the FPGA suitable for a wide range of applications.

Package Shape: SQUARE

Square package shape helps in efficient placement and routing of the FPGA on the PCB, optimizing board space utilization.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and allow for easier rework or replacement of the FPGA if needed.

Nominal Supply Voltage (V): 0.95

Stable nominal supply voltage ensures consistent performance of the FPGA, reducing the likelihood of errors or malfunctions.

No. of Terminals: 676

Sufficient number of terminals facilitate easy integration of the FPGA into the overall system design, enabling seamless connectivity with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product offers reconfigurability and flexibility in logic implementation, allowing for rapid prototyping and customization.

Package Style (Meter): GRID ARRAY

Grid array package style provides robust mechanical support and thermal dissipation for the FPGA, contributing to its reliability and longevity.

Minimum Supply Voltage: 0.93 V

Low minimum supply voltage helps in minimizing power consumption and heat generation, enhancing energy efficiency of the FPGA.

Pitch Of Terminal: 1 mm

1mm terminal pitch enables high-density mounting of the FPGA on the PCB, enabling compact system designs in space-constrained applications.

Maximum Combinatorial Delay of a CLB: 0.61 ns

Low combinatorial delay of CLBs ensures fast signal propagation and processing within the FPGA, leading to high-speed and responsive performance.

Organization: 12675 CLBS

Organized structure of 12675 CLBs provides scalability and versatility in logic design, allowing for implementation of diverse and intricate algorithms.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, and copper finishing of terminals ensures good conductivity and corrosion resistance, maintaining signal integrity and reliability of the connections.

Position Of Terminal: BOTTOM

Bottom terminal position simplifies PCB layout and routing, facilitating efficient signal flow and reducing electromagnetic interference in the system.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates high resistance to moisture absorption, ensuring the stability and performance of the FPGA under humid or damp conditions.

Maximum Seated Height: 3.37 mm

Low seated height allows for compact integration of the FPGA within the system, enabling slim and sleek device designs.

Width: 27 mm

Optimal width of 27mm strikes a balance between form factor and functionality, making the FPGA suitable for a diverse range of applications and board sizes.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures proper solder melting and joint formation during assembly, improving the reliability of the connections.

Peak Reflow Temperature °C: 250

High peak reflow temperature of 250°C ensures thorough and uniform solder reflow, resulting in strong and durable connections for the FPGA on the PCB.

Length: 27 mm

Length of 27mm provides a compact footprint for the FPGA, allowing for efficient use of PCB real estate and enabling sleek and space-saving system designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K160T-L2FFG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of CLBs:

12675

CLB Maximum Delay:

0.61 ns

Organization:

12675 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.93 V

Maximum Supply Voltage:

.97 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.37 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Trade Compliance

XC7K160T-L2FFG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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