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XCKU11P-1FFVE1517I

Xilinx

XCKU11P-1FFVE1517I by Xilinx

XCKU11P-1FFVE1517I by Xilinx is a PLASTIC/EPOXY FPGA with 653100 logic cells and 37320 CLBs. It has applications in industrial settings, offering a wide temperature range (-40 to 100 °C) and high reliability (Moisture Sensitivity Level 4).

Median Price

$4,876.950

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$4,876.950

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Vyrian

USA . 7,103 parts In-Stock

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Chip Stock

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VNN

France . 537 parts In-Stock

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Digiode

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Distributors (Availability)

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AZTECH Wire

Italy . 487 parts In-Stock

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$8.677

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One Stop Electronics

USA . 186 parts In-Stock

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Ampacity Inc.

Singapore . 1,333 parts In-Stock

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$13.000

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Modulus Dynamics

Lithuania . 1,200 parts In-Stock

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$95.370

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$95.370

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$95.370

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Texas Native Microelectronics

USA . 75 parts In-Stock

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$159.123

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$140.028

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Aztec Data Supply Inc.

USA . 679 parts In-Stock

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$163.480

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Corohmni

South Africa . 176 parts In-Stock

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Kenton Components

USA . 58 parts In-Stock

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$190.948

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$183.310

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$177.581

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$168.034

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$177.581

$168.034

Qasali Group International

UK . 5,244 parts In-Stock

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$429.632

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$399.558

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Semicontronic

India . 2 parts In-Stock

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$4,144.930

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$4,041.307

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$4,020.582

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Argo Parts USA

USA . 1,440 parts In-Stock

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$4,876.950

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$4,828.181

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$4,779.411

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$4,730.642

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$4,828.181

$4,779.411

$4,730.642

Continental Prestige Electronics

USA . 736 parts In-Stock

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736

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Microchip USA

USA . 1,025 parts In-Stock

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$4,877.450

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MARBEL Systems

Belgium . 1,185 parts In-Stock

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Vigor

Singapore . 640 parts In-Stock

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Supply Digital

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Corphita

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Overview

Discover the cutting-edge XCKU11P-1FFVE1517I FPGA by Xilinx! With its unmatched quality and reliability, Xilinx has once again raised the bar in the field of programmable gate arrays. This versatile product offers a multitude of applications, from high-performance computing to wireless communication systems. Experience the value and benefits it brings, with its vast number of logic cells, inputs, and outputs. With XCKU11P-1FFVE1517I, you'll enjoy seamless integration, enhanced performance, and endless possibilities for innovation. Don't miss out on this game-changing technology!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the FPGA, making it suitable for various industrial applications.

No. of Logic Cells

653100 - With a large number of logic cells, this FPGA is capable of handling complex logic functions and can be used for advanced digital design projects.

Surface Mount

YES - The surface mount feature allows for easy integration onto circuit boards, simplifying the assembly process and reducing manufacturing costs.

Maximum Supply Voltage

0.876 V - The high maximum supply voltage allows for efficient power management and ensures reliable operation of the FPGA.

No. of CLBs

37320 - The abundance of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic functions, enabling the FPGA to meet diverse application requirements.

No. of Inputs

512 - The large number of input channels allows for a wide range of data to be processed simultaneously, enhancing the FPGA's capability to handle multiple input signals.

Package Shape

SQUARE - The square shape facilitates easier placement and alignment of the FPGA on circuit boards, optimizing space utilization and enabling compact designs.

Form Of Terminal

BALL - The ball form terminals offer robust connectivity options, ensuring reliable electrical connections between the FPGA and other components.

Nominal Supply Voltage (V)

0.85 - The nominal supply voltage indicates the ideal operating voltage range for the FPGA, ensuring stable and efficient performance.

No. of Terminals

1517 - The large number of terminals allows for extensive connectivity options and enables the FPGA to interface with various external devices.

Programmable IC Type

FIELD PROGRAMMABLE GATE ARRAY - Being a field-programmable device, this FPGA offers versatility as it can be reprogrammed multiple times to adapt to changing application needs.

Package Style (Meter)

GRID ARRAY - The grid array package style offers enhanced mechanical strength and thermal performance, making it reliable for demanding industrial environments.

Minimum Supply Voltage

0.825 V - The low minimum supply voltage allows for efficient power consumption, ensuring energy efficiency and longer battery life for FPGA-based applications.

Maximum Operating Temperature

100 °C - The high maximum operating temperature enables the FPGA to operate reliably in harsh environmental conditions without compromising performance.

Pitch Of Terminal

1 mm - The small pitch of the terminals allows for fine-pitch PCB assembly, enabling compact designs while maintaining reliable interconnectivity.

Organization

37320 CLBS - The organizational structure of 37320 Configurable Logic Blocks (CLBs) allows for efficient implementation of complex logic functions, providing flexibility and versatility.

Minimum Operating Temperature

40 °C - The low minimum operating temperature ensures the FPGA's functionality in extreme cold conditions, making it suitable for a wide range of environments.

Finishing Of Terminal Used

TIN SILVER COPPER - The terminal finishing with a combination of tin, silver, and copper ensures excellent conductivity, corrosion resistance, and solderability.

Position Of Terminal

BOTTOM - The terminal's bottom position facilitates easy board-level integration, ensuring convenient access and connection during assembly and testing processes.

Moisture Sensitivity Level (MSL)

4 - The moisture sensitivity level 4 indicates that the FPGA has a high resistance to moisture and can be safely stored and used in various conditions.

Maximum Seated Height

3.51 mm - The compact size and low seated height of the FPGA allow for efficient space utilization on circuit boards, enabling compact and streamlined designs.

Width

40 mm - The standard width dimension ensures compatibility with industry-standard board layouts and facilitates seamless integration into existing systems.

No. of Outputs

512 - The large number of output channels enables the FPGA to deliver multiple data streams simultaneously, allowing for efficient data processing and communication.

Maximum Time At Peak Reflow Temperature (s)

30 - The maximum time at peak reflow temperature indicates the FPGA's ability to withstand high-temperature soldering processes during manufacturing, ensuring reliable solder joints and product durability.

Peak Reflow Temperature °C

245 - The high peak reflow temperature indicates the FPGA's thermal stability, enabling it to endure elevated temperatures during assembly and rework processes.

Length

40 mm - The standard length dimension ensures compatibility with industry-standard board layouts and facilitates seamless integration into existing systems.

Grading Of Temperature

INDUSTRIAL - The industrial-grade temperature grading ensures the FPGA's reliability and performance in demanding environments with varying temperature ranges.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU11P-1FFVE1517I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

653100

No. of Inputs:

512

No. of Outputs:

512

No. of CLBs:

37320

Organization:

37320 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

40 mm

Width:

40 mm

Maximum Seated Height:

3.51 mm

Package Equivalence Code:

BGA1517,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Trade Compliance

XCKU11P-1FFVE1517I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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