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XCKU085-1FLVA1517I

Xilinx

XCKU085-1FLVA1517I by Xilinx

Xilinx XCKU085-1FLVA1517I FPGA features 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. With a max supply voltage of 0.979 V, it is ideal for industrial applications requiring high-performance computing in a compact square package with grid array style.

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$6,317.790

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Kenton Components

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Overview

Unlock the power of cutting-edge technology with the XCKU085-1FLVA1517I by Xilinx. As a leader in the field programmable gate arrays (FPGA) category, Xilinx delivers top-notch quality and reliability. This versatile product offers a wide range of applications, providing customers with endless possibilities for innovation. With its high number of logic cells and inputs, along with a low supply voltage, this FPGA is designed to boost performance and efficiency. Experience the value and benefits of Xilinx's advanced technology, empowering you to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, ensuring reliable performance in various environments.

No. of Logic Cells: 1088325

With a large number of logic cells, this FPGA can handle complex and high-performance computing tasks efficiently.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the FPGA on a PCB, saving time and effort during assembly.

Maximum Supply Voltage: 0.979 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA energy-efficient.

No. of CLBs: 62190

With a large number of Configurable Logic Blocks, this FPGA offers flexibility in designing custom logic circuits for specific applications.

No. of Inputs: 676

A high number of inputs allow for connectivity to a wide range of external devices and sensors, increasing the versatility of the FPGA.

Package Shape: SQUARE

The square package shape provides a compact form factor for the FPGA, making it suitable for space-constrained applications.

Form Of Terminal: BALL

Ball terminals offer a reliable connection and easy soldering during the PCB assembly process, ensuring a secure electrical interface.

Nominal Supply Voltage (V): 0.95

The nominal supply voltage of 0.95V provides stable and consistent power delivery to the FPGA for reliable operation.

Power Supplies (V): 0.95

Having consistent power supplies at 0.95V ensures proper functioning of the FPGA without voltage fluctuations.

No. of Terminals: 1517

The high number of terminals allows for multiple connections and interfaces, enabling the FPGA to communicate with various components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product offers flexibility and reconfigurability for adapting to changing design requirements.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates easy PCB layout and alignment, improving the overall assembly process.

Minimum Supply Voltage: 0.922 V

The minimum supply voltage of 0.922V ensures that the FPGA can operate reliably even under low power conditions.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, this FPGA can withstand harsh environmental conditions and thermal stress.

Pitch Of Terminal: 1 mm

The 1mm pitch of the terminals allows for precise and compact placement of the FPGA on the PCB, optimizing the use of space.

Organization: 62190 CLBS

The organized structure of 62190 Configurable Logic Blocks enables efficient routing and logic implementation within the FPGA.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this FPGA can operate reliably in cold environments without performance degradation.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of Tin, Silver, and Copper finishes on the terminals ensures good conductivity and corrosion resistance for long-term reliability.

Position Of Terminal: BOTTOM

Having terminals at the bottom enhances the signal integrity and protects the electrical connections from external elements.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this FPGA can withstand moderate exposure to moisture during storage and operation.

Maximum Seated Height: 4.09 mm

The low seated height of 4.09mm makes this FPGA suitable for compact electronic devices and PCB designs with height restrictions.

Width: 40 mm

The width of 40mm provides a balanced size for the FPGA, enabling easy integration into various electronic systems and enclosures.

No. of Outputs: 676

A high number of outputs allow the FPGA to drive multiple signals and interact with various external components, enhancing its functionality.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds at the peak temperature of 245°C ensures quick and efficient soldering of the FPGA during assembly.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C ensures proper soldering of the FPGA on the PCB without thermal damage to the components.

Length: 40 mm

With a length of 40mm, this FPGA offers a compact design for space-constrained applications while providing sufficient functionality.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation of the FPGA in challenging industrial environments with temperature variations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU085-1FLVA1517I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1088325

No. of Inputs:

676

No. of Outputs:

676

No. of CLBs:

62190

Sub-Category:

Field Programmable Gate Arrays

Organization:

62190 CLBS

Power Characteristics

Nominal Supply Voltage:

0.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Power Supplies:

0.95 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

40 mm

Width:

40 mm

Maximum Seated Height:

4.09 mm

Package Equivalence Code:

BGA1517,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU085-1FLVA1517I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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