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XC7K410T-L2FFG900I

Xilinx

XC7K410T-L2FFG900I by Xilinx

The Xilinx XC7K410T-L2FFG900I is a FPGA with 31775 CLBs, 0.97V max supply voltage, and 0.61ns combinatorial delay. Ideal for applications requiring high-speed processing, such as telecommunications equipment and industrial automation systems.

Median Price

$5,235.420

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 97 parts In-Stock

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Vyrian

USA . 7,194 parts In-Stock

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Chip Stock

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Digiode

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AZTECH Wire

Italy . 197 parts In-Stock

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Semicontronic

India . 1,196 parts In-Stock

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$12.675

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$12.610

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One Stop Electronics

USA . 161 parts In-Stock

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Ampacity Inc.

Singapore . 1,109 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,930 parts In-Stock

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$67.073

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MARBEL Systems

Belgium . 5,500 parts In-Stock

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$65.384

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Texas Native Microelectronics

USA . 95 parts In-Stock

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$78.285

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$75.154

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Kenton Components

USA . 2,761 parts In-Stock

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$93.942

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$95.145

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Corohmni

South Africa . 234 parts In-Stock

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$118.483

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Modulus Dynamics

Lithuania . 576 parts In-Stock

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Argo Parts USA

USA . 4,814 parts In-Stock

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$5,235.420

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$5,183.066

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$5,130.712

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$5,078.357

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$5,078.357

Continental Prestige Electronics

USA . 4,631 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$5,130.712

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$4,973.649

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$4,868.941

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$4,973.649

$4,868.941

QUARKTWIN TECHNOLOGY LTD

USA . 8,497 parts In-Stock

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Qasali Group International

UK . 6,485 parts In-Stock

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Supply Digital

USA . 1,337 parts In-Stock

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Vigor

Singapore . 794 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the XC7K410T-L2FFG900I by Xilinx. As a leader in Field Programmable Gate Arrays (FPGAs), Xilinx delivers unparalleled quality and reliability. With 31775 CLBs and 900 terminals, this FPGA offers endless possibilities for customization and optimization. Whether you're designing cutting-edge technology or pushing the boundaries of AI, the XC7K410T-L2FFG900I provides the flexibility and performance you need to bring your ideas to life. Elevate your projects with Xilinx's advanced technology and unlock a world of opportunities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and can handle a wide range of operating conditions, making this FPGA suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy assembly and integration into circuit boards, saving time and effort during production.

Maximum Supply Voltage: 0.97 V

The low maximum supply voltage requirement contributes to energy efficiency and reduces power consumption, making this FPGA a cost-effective choice.

No. of CLBs: 31775

With a high number of Configurable Logic Blocks (CLBs), this FPGA offers a high level of flexibility and customization for complex logic functions.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, optimizing layout and design considerations.

Nominal Supply Voltage (V): 0.95

The nominal supply voltage provides a stable operating condition for the FPGA, ensuring reliable performance in diverse applications.

No. of Terminals: 900

Having a high number of terminals allows for increased connectivity options and integration with other components, enhancing the functionality of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device allows for customization and reprogramming of logic functions, making this FPGA versatile and adaptable for various applications.

Package Style (Meter): GRID ARRAY

A grid array package style provides a secure and reliable connection between the FPGA and the circuit board, ensuring stable operation under varying conditions.

Minimum Supply Voltage: 0.93 V

The low minimum supply voltage requirement allows for flexibility in power supply options and can optimize energy efficiency in different operating scenarios.

Pitch Of Terminal: 1 mm

A standard pitch of terminals enables easy connectivity and compatibility with common electronic components and circuit board designs.

Maximum Combinatorial Delay of a CLB: 0.61 ns

The low combinatorial delay of a CLB ensures fast and efficient logic processing within the FPGA, supporting high-speed and real-time applications.

Organization: 31775 CLBS

The organizational structure of 31775 CLBs provides a large number of logic blocks for implementing complex functions, making this FPGA suitable for advanced applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing ensures good conductivity and corrosion resistance, enhancing the overall reliability and longevity of the FPGA.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easy mounting and connection of the FPGA to circuit boards, simplifying assembly and maintenance processes.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this FPGA can withstand moderate exposure to humidity and environmental conditions, ensuring durability and reliability in typical operating environments.

Maximum Seated Height: 3.35 mm

The compact seated height of the FPGA allows for space-saving installation in electronic devices and systems, enabling a more streamlined and efficient design.

Width: 31 mm

The width of 31 mm provides a compact form factor for the FPGA, allowing for integration into a wide range of applications and devices with limited space constraints.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand a peak reflow temperature for up to 30 seconds ensures reliable soldering and mounting of the FPGA during manufacturing processes, leading to high-quality end products.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C indicates the thermal robustness of the FPGA, allowing for safe and efficient soldering processes without risking damage to the components.

Length: 31 mm

The length of 31 mm complements the compact width of the FPGA, resulting in a space-efficient and versatile form factor that can be easily integrated into various electronic systems and devices.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K410T-L2FFG900I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of CLBs:

31775

CLB Maximum Delay:

0.61 ns

Organization:

31775 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.93 V

Maximum Supply Voltage:

.97 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

3.35 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Trade Compliance

XC7K410T-L2FFG900I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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