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XCKU115-2FLVD1924I

Xilinx

XCKU115-2FLVD1924I by Xilinx

Xilinx XCKU115-2FLVD1924I is a PLASTIC/EPOXY FPGA with 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. It is used in industrial applications requiring high performance and programmable ICs.

Median Price

$12,077.455

Lifecycle Status

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Nova Conductors

Japan . 100 parts In-Stock

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Digiode

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Chip Stock

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Touchstone Systems

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Cyclops Electronics Ltd

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Semicontronic

India . 469 parts In-Stock

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$4.875

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$4.850

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AZTECH Wire

Italy . 355 parts In-Stock

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Ampacity Inc.

Singapore . 1,627 parts In-Stock

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Modulus Dynamics

Lithuania . 1,806 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 859 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 58 parts In-Stock

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Qasali Group International

UK . 830 parts In-Stock

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Microchip USA

USA . 425 parts In-Stock

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Netroflash

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Continental Prestige Electronics

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Supply Digital

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MARBEL Systems

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Argo Parts USA

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Overview

Discover the power of the XCKU115-2FLVD1924I by Xilinx, a game-changing FPGA designed to elevate your projects to new heights. As a leader in the industry, Xilinx is known for its exceptional quality and craftsmanship, ensuring that every product meets the highest standards. With its vast array of applications, this FPGA is perfect for industries ranging from telecommunications to automotive. Experience the value and benefits it brings, allowing you to unlock endless possibilities and achieve unparalleled performance. Don't settle for average when you can have extraordinary with Xilinx's XCKU115-2FLVD1924I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and thermal resistance, making the FPGA suitable for various operating conditions and environments.

No. of Logic Cells: 1451100

With a large number of logic cells, this FPGA can handle complex and demanding tasks, allowing for versatile and high-performance applications.

Surface Mount: YES

The surface mount feature simplifies the assembly process, making it more convenient for manufacturers and reducing production costs.

Maximum Supply Voltage: 0.979 V

This low voltage requirement minimizes power consumption and heat generation, contributing to energy efficiency and overall system reliability.

No. of CLBs: 5520

The significant number of configurable logic blocks enables flexible customization and efficient implementation of complex digital circuits.

No. of Inputs: 832

With a high input capacity, this FPGA can handle large amounts of data, making it suitable for applications requiring substantial input processing.

Package Shape: SQUARE

The square shape allows for efficient use of board space and easier integration, making it suitable for compact designs and reducing overall system size.

Form Of Terminal: BALL

The use of ball terminals simplifies soldering and improves electrical performance, ensuring reliable connections in the manufacturing process.

Nominal Supply Voltage (V): 0.95

This stable and standard voltage level ensures consistent and reliable operation, enabling compatibility with various systems and power architectures.

Power Supplies (V): 0.95

With multiple power supply options, this FPGA can adapt to different voltage requirements, enhancing versatility and compatibility with various systems.

No. of Terminals: 1924

The high number of terminals allows for extensive connectivity options and integration, offering flexibility in connecting other components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being programmable, this FPGA provides the ability to customize and reconfigure the logic, making it versatile and adaptable for different applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers excellent mechanical strength and reliable connections, ensuring durability and high-performance in various conditions.

Minimum Supply Voltage: 0.922 V

This low minimum voltage requirement provides flexibility in power supply options and contributes to energy efficiency.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance allows this FPGA to withstand elevated temperatures, making it suitable for demanding industrial environments.

Pitch Of Terminal: 1 mm

The small terminal pitch allows for higher interconnect density, enabling a compact layout and increased functionality in space-constrained designs.

Organization: 5520 CLBS

The organized structure of 5520 configurable logic blocks facilitates efficient design implementation and simplifies logic organization.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance ensures reliability and functionality even under extreme cold conditions, expanding the range of potential applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals enhances conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term performance.

Position Of Terminal: BOTTOM

The terminal's bottom position eases the PCB layout process and improves signal routing efficiency, enabling optimized circuit designs and reducing potential signal integrity issues.

Moisture Sensitivity Level (MSL): 4

With moisture sensitivity level 4, this FPGA can withstand higher exposure to humidity without compromising performance or reliability, offering increased robustness during manufacturing and operation.

Maximum Seated Height: 4.13 mm

The compact maximum seated height allows for low-profile board integration, enabling designs with reduced overall system height and increasing flexibility in space-constrained applications.

Width: 45 mm

The 45 mm width provides compatibility with standard board dimensions and facilitates integration into various systems, simplifying the design and manufacturing process.

No. of Outputs: 832

This FPGA's ample output capacity allows for efficient signal routing and processing, making it suitable for applications requiring extensive output capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and thermal stability during the manufacturing process, improving the overall quality and yield of assembled units.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance of 245°C enables compatibility with lead-free soldering processes, ensuring compliance with industry regulations and standards.

Length: 45 mm

The 45 mm length complements the width and allows for compact yet versatile board integration, enabling space-efficient designs and enhancing system flexibility.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature grading ensures reliable operation within a wide range of temperatures, making this FPGA suitable for demanding industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU115-2FLVD1924I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1451100

No. of Inputs:

832

No. of Outputs:

832

No. of CLBs:

5520

Sub-Category:

Field Programmable Gate Arrays

Organization:

5520 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Power Supplies:

0.95 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

45 mm

Width:

45 mm

Maximum Seated Height:

4.13 mm

Package Equivalence Code:

BGA1924,44X44,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1924

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU115-2FLVD1924I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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