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XCKU115-2FLVB1760I

Xilinx

XCKU115-2FLVB1760I by Xilinx

Xilinx XCKU115-2FLVB1760I FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for industrial applications requiring high processing power in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.922V to 0.979V.

Median Price

$11,404.560

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Avnet

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Nova Conductors

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Microchip USA

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Overview

Unleash the power of innovation with the Xilinx XCKU115-2FLVB1760I FPGA. This cutting-edge technology offers unparalleled quality and performance, backed by the renowned manufacturer Xilinx. Ideal for a wide range of applications, this FPGA provides customers with unmatched value and benefits. From faster processing speeds to increased efficiency, this product is sure to take your projects to the next level. Upgrade your tech game today with the Xilinx XCKU115-2FLVB1760I FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 1451100

Offers a large number of logic cells for complex programmable designs.

Surface Mount: YES

Allows for easy mounting onto circuit boards, simplifying the assembly process.

Maximum Supply Voltage: 0.979 V

Efficient power consumption with a low maximum supply voltage.

No. of CLBs: 5520

Provides a high number of Configurable Logic Blocks for versatile programming options.

No. of Inputs: 832

Offers a large number of inputs for connecting external signals and data.

Package Shape: SQUARE

Optimal square shape for efficient placement on circuit boards.

Form Of Terminal: BALL

Ball terminals provide a reliable connection in a compact space.

Nominal Supply Voltage (V): 0.95

Stable nominal supply voltage for consistent performance.

Power Supplies (V): 0.95

Efficient power supplies for low power consumption.

No. of Terminals: 1760

Plenty of terminals for connecting to external devices and components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Versatile programmable IC type for customizable functionality.

Package Style (Meter): GRID ARRAY

Grid array package style for easy integration into circuit board layouts.

Minimum Supply Voltage: 0.922 V

Low minimum supply voltage for efficient power operation.

Maximum Operating Temperature: 100 °C

High maximum operating temperature for reliability in various environments.

Pitch Of Terminal: 1 mm

Narrow terminal pitch for compact design layouts.

Organization: 5520 CLBS

Organized into 5520 Configurable Logic Blocks for efficient programming and design.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature for versatility in different operating conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Durable terminal finishing for reliable connections over time.

Position Of Terminal: BOTTOM

Bottom-positioned terminals for easy integration and connectivity.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 for protection against environmental conditions.

Maximum Seated Height: 4.11 mm

Low maximum seated height for compact and space-saving designs.

Width: 42.5 mm

Optimal width for fitting in standard circuit board layouts.

No. of Outputs: 832

High number of outputs for transmitting processed data and signals.

Length: 42.5 mm

Compact length for fitting into various device designs.

Grading Of Temperature: INDUSTRIAL

Industrial grade temperature grading for reliable operation in harsh environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU115-2FLVB1760I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1451100

No. of Inputs:

832

No. of Outputs:

832

No. of CLBs:

5520

Sub-Category:

Field Programmable Gate Arrays

Organization:

5520 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Power Supplies:

0.95 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

42.5 mm

Width:

42.5 mm

Maximum Seated Height:

4.11 mm

Package Equivalence Code:

BGA1760,42X42,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1760

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU115-2FLVB1760I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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