Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Xilinx XCKU15P-L1FFVA1156I FPGA features 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Package style is grid array with a square shape and ball terminals.
Median Price
$6,806.050
Lifecycle Status
Suppliers In-Stock
5
In-Stock Inventory
1k+
Nova Conductors
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
Chip Stock
VNN
Digiode
AZTECH Wire
$9.112
Ampacity Inc.
$14.000
Semicontronic
$27.000
$26.325
$26.190
One Stop Electronics
$32.000
MARBEL Systems
$60.602
$58.178
Modulus Dynamics
$66.717
Texas Native Microelectronics
$69.658
$66.872
$64.782
Kenton Components
$83.590
$73.559
Netroflash
Supply Digital
Corphita
Corohmni
Vigor
Futuretech Components
Qasali Group International
$180.554
$165.507
The use of plastic/epoxy material in the package body makes the FPGA lightweight and durable, ensuring ease of handling and protection against physical damage.
With a high number of logic cells, this FPGA offers extensive processing capabilities and flexibility for complex designs and applications.
Being surface mountable, this FPGA simplifies the assembly process, reduces PCB footprint, and enables efficient heat dissipation.
The low maximum supply voltage requirement results in reduced power consumption and heat generation, making the FPGA energy-efficient.
The large number of Configurable Logic Blocks (CLBs) enables versatile implementation of custom logic functions, enhancing design flexibility.
Having a high number of inputs allows for extensive connectivity and input/output options, facilitating complex system integration.
The square package shape ensures efficient use of space on the PCB, enabling compact designs and optimizing layout considerations.
The ball terminal form simplifies the soldering process, enhances signal integrity, and improves electrical performance of the FPGA.
The low nominal supply voltage requirement contributes to energy efficiency and reliable operation of the FPGA, reducing power consumption.
Having a high number of terminals allows for versatile connectivity options, supporting a wide range of input/output configurations in the system.
As a Field Programmable Gate Array, this IC type offers reconfigurability, adaptability, and customization of logic functions, making it suitable for prototyping and dynamic applications.
The grid array package style provides efficient thermal dissipation, improved electrical performance, and ease of mounting the FPGA on the PCB.
The low minimum supply voltage requirement ensures stable operation across different voltage conditions, enhancing the reliability of the FPGA.
With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and temperature variations, ensuring robust performance in industrial settings.
The 1 mm pitch of terminals allows for high-density mounting, precise soldering, and efficient PCB layout, contributing to overall system reliability.
The organizational structure of 65340 Configurable Logic Blocks (CLBs) provides a systematic arrangement for logic functions, offering scalability and ease of design implementation.
The wide operating temperature range from -40°C ensures reliable performance in extreme temperature conditions, making the FPGA suitable for industrial and automotive applications.
The combination of tin, silver, and copper in the terminal finishing improves solderability, corrosion resistance, and electrical conductivity, enhancing the overall performance and reliability of the FPGA.
The bottom position of terminals simplifies PCB layout, improves signal integrity, and enhances thermal management, contributing to the overall reliability of the FPGA.
With a moisture sensitivity level of 4, this FPGA is suitable for standard surface mount assembly processes, ensuring proper handling and storage to prevent moisture-related failures.
The low maximum seated height offers compatibility with compact and slim designs, allowing for space-efficient integration of the FPGA in various electronic devices.
The 35 mm width of the FPGA provides a compact form factor, optimizing PCB space utilization and enabling efficient system integration in constrained environments.
Having a high number of outputs allows for versatile signal routing options, enabling complex logic functions and diverse output configurations in the system.
With a length of 35 mm, this FPGA offers a balanced form factor, facilitating uniform thermal dissipation, efficient layout considerations, and ease of integration in standard PCB designs.
The industrial-grade temperature grading ensures reliable operation in demanding environments, such as industrial automation and automotive applications, where temperature fluctuations are common.
Field Programmable Gate Arrays (FPGA) XCKU15P-L1FFVA1156I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
No. of Logic Cells:
No. of Inputs:
No. of Outputs:
No. of CLBs:
Organization:
Additional Features:
Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Minimum Operating Temperature:
Maximum Operating Temperature:
Temperature Grade:
Moisture Sensitivity Level (MSL):
Package Body Material:
Surface Mountable:
Package Style:
Package Code:
Package Shape:
Length:
Width:
Maximum Seated Height:
Package Equivalence Code:
Terminal Position:
Terminal Style:
Terminal Finish:
Terminal Pitch:
No. of Terminals:
JESD-30 Code:
JESD-609 Code:
XCKU15P-L1FFVA1156I Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
1N4148
Rectron
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Nexperia
Diotec Semiconductor Ag
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
Hitachi
BAV99
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Formosa Microsemi
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
L78L05ABZ-AP
STMicroelectronics
L78L05ABZ-AP by STMicroelectronics is a BIPOLAR fixed positive single output standard regulator with an operating temperature range of -40 to 125°C. It has a nominal output voltage of 5V, max load regulation of 0.06%, and can handle a max output current of 0.07A. Ideal for applications requiring stable voltage regulation in various electronic devices.
Diotec Electronics
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diodes Incorporated
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
M39029/56-351
Amphenol
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Additional Features: STANDARD: MIL-DTL-38999; Contact Gender: FEMALE; MIL-Connector Accessory Name: CONTACT; Associated Military - Specifications: MIL-DTL-38999;
XC7S75-1FGGA676I
Xilinx
Xilinx XC7S75-1FGGA676I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 400 inputs/outputs.
10M16SAU169I7G
Intel
The Intel 10M16SAU169I7G is a FPGA with 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. It operates at supply voltages b/w 2.85V to 3.15V and temperatures from -40°C to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.
A40MX04-PLG68I
Microchip Technology
A40MX04-PLG68I by Microchip Tech is a 3.6V FPGA with 547 CLBs, 6000 gates, and max clock freq of 80MHz. Ideal for industrial applications requiring high-speed processing in temp range -40 to 85°C. Features CMOS tech, J bend terminals, and square package shape.
10CL120YF484I7G
Intel's 10CL120YF484I7G FPGA features 119088 logic cells, 7443 CLBs, and 277 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with grid array style mounting.
10M25DAF256I7G
The Intel 10M25DAF256I7G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at temperatures from -40 to 100 °C and has a supply voltage range of 1.15-1.25 V. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package with grid array style terminals.
A3P125-VQG100I
A3P125-VQG100I by Microchip Technology is a CMOS FPGA with 3072 CLBs and 125000 gates. It operates at max frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a package style of flatpack, thin profile, fine pitch, it offers versatility in design and integration.
XC6SLX16-2CSG324C
Xilinx XC6SLX16-2CSG324C FPGA features 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. Ideal for applications requiring a max clock frequency of 667 MHz, such as high-speed data processing in telecommunications or industrial automation systems. Operating temperature range from 0 to 85°C with a low profile grid array package style.
XC6SLX150T-3FGG676I
Xilinx XC6SLX150T-3FGG676I is a FPGA with 147443 logic cells, 11519 CLBs, and max clock frequency of 862 MHz. It operates at industrial temperatures and is suitable for applications requiring high-speed processing and programmable ICs in various industries.
M2S090-FCS325I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 240;
LCMXO2-1200ZE-1MG132I
Lattice Semiconductor
LCMXO2-1200ZE-1MG132I by Lattice Semiconductor is a 1280 logic cell FPGA with 104 inputs/outputs, operating at max frequency of 133 MHz. Suitable for applications requiring high-speed processing and low power consumption in electronics industry.
10M08SAE144C8GES
Altera
FIELD PROGRAMMABLE GATE ARRAY;
EP1C3T144C8N
EP1C3T144C8N by Intel is a Field Programmable Gate Array (FPGA) with 2910 logic cells, 291 CLBs, and a max clock frequency of 275 MHz. It is ideal for applications requiring high-speed processing and customizable logic circuits in compact electronic designs.
XC7A35T-2CSG325C
XC7A35T-2CSG325C by Xilinx is a FPGA with 33280 logic cells, 2600 CLBs, and a max clock frequency of 1286 MHz. It is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
A3P1000-FGG484I
Microchip Technology's A3P1000-FGG484I is a CMOS FPGA with 24576 CLBs and 1000000 gates. It operates at a max frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a package size of 23x23 mm and MSL level of 3, it offers reliable performance in harsh environments.
10M16SCU169I7G
Intel's 10M16SCU169I7G FPGA boasts 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a max operating temperature of 100°C.
XC7A35T-2CSG324C
Xilinx XC7A35T-2CSG324C FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor with low profile grid array package style.
XC7A200T-1FBG484C
The Xilinx XC7A200T-1FBG484C is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
EP3C25E144C8NES
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: RECTANGULAR;
10M25SAE144I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XCAU10P-2UBVA368I
Xilinx XCAU10P-2UBVA368I FPGA features 96250 logic cells, 5500 CLBs, and 128 inputs/outputs. Ideal for applications requiring high-density programmable ICs in a compact GRID ARRAY package with low supply voltage and wide operating temperature range.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCKU040-2FFVA1156E
Xilinx XCKU040-2FFVA1156E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Package style: Grid Array, with a max operating temperature of 100°C.
XCKU3P-1FFVD900E
Xilinx XCKU3P-1FFVD900E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.
XCKU3P-2FFVB676E
Xilinx XCKU3P-2FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.876 V. Package style is grid array with a square shape and ball terminals, suitable for various industrial uses.
XCKU060-1FFVA1517I
Xilinx XCKU060-1FFVA1517I FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range (-40 to 100°C) and low supply voltage (0.922-0.979V).
XCKU3P-1FFVA676E
Xilinx XCKU3P-1FFVA676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.876 V. Suitable for various industries due to its versatile programmable IC type and grid array package style.
XCKU035-2FBVA900I
Xilinx XCKU035-2FBVA900I FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. The package style is a grid array with a square shape and ball terminals for surface mount assembly.
XCKU040-2FFVA1156I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU060-1FFVA1517C
Xilinx XCKU060-1FFVA1517C FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
XCKU3P-1FFVB676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU115-2FLVA1517E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCKU060-2FFVA1156E
Xilinx XCKU060-2FFVA1156E FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V. Suitable for various industries due to its versatility and robust design capabilities.
XCKU3P-1FFVB676E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU040-1FFVA1156C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU025-1FFVA1156I
Xilinx XCKU025-1FFVA1156I FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a wide operating temperature range (-40 to 100°C) in a compact square grid array package.
XCKU035-1FFVA1156C
XCKU5P-2FFVB676E
Xilinx XCKU5P-2FFVB676E FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C.
XCKU3P-1SFVB784E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
XCKU035-2FBVA900E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
XCKU040-3FFVA1156E
XCKU060-2FFVA1517I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved