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XCKU3P-2FFVD900I

Xilinx

XCKU3P-2FFVD900I by Xilinx

Xilinx XCKU3P-2FFVD900I FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. With a max supply voltage of 0.876V, it's ideal for industrial applications requiring high-performance computing in a compact form factor. The package style is grid array with a square shape and ball terminals, suitable for surface mount assembly.

Median Price

$2,385.080

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Nova Conductors

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AZTECH Wire

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One Stop Electronics

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Modulus Dynamics

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Qasali Group International

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Argo Parts USA

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Advanced Electronics

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Microchip USA

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Kenton Components

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Overview

Experience top-of-the-line performance with the XCKU3P-2FFVD900I by Xilinx, a leading manufacturer in the Field Programmable Gate Arrays (FPGA) category. Boasting 355,950 logic cells and 20,340 CLBs, this FPGA is perfect for applications requiring high-speed processing and flexibility. With a package style of GRID ARRAY and a maximum operating temperature of 100°C, this product offers unmatched reliability and versatility. Elevate your projects to new heights with the XCKU3P-2FFVD900I and unlock endless possibilities for innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and resistance to environmental factors, making the product suitable for a variety of applications.

No. of Logic Cells: 355950

High number of logic cells allows for complex programmability and versatility in designing custom circuits.

Surface Mount: YES

Surface mount capability enables easy integration onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 0.876 V

Efficient maximum supply voltage requirement ensures minimal power consumption and heat dissipation.

No. of CLBs: 20340

Large number of Configurable Logic Blocks (CLBs) provides flexibility in implementing different logic functions within the FPGA.

No. of Inputs: 304

High number of input pins allows for connectivity to multiple external devices or signals, enhancing the product's versatility.

Package Shape: SQUARE

Square package shape offers uniformity and ease of handling for mounting and soldering purposes.

Nominal Supply Voltage (V): 0.85

Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.

No. of Terminals: 900

High number of terminals enables connectivity to a wide range of interfaces and peripherals, expanding the product's compatibility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for real-time reconfigurability, making it ideal for prototyping and development purposes.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient routing of signals and reduced parasitic effects, enhancing the electrical performance of the FPGA.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures the product can function reliably in extreme environmental conditions.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance enables the product to operate in harsh industrial environments without overheating.

Width: 31 mm

Compact width dimensions facilitate space-saving integration of the FPGA into tight PCB layouts.

No. of Outputs: 304

High number of output pins allows the FPGA to drive multiple external devices or signals, expanding its functionality.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level rating indicates the product's resistance to moisture-induced damage, ensuring long-term reliability in humid environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU3P-2FFVD900I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

355950

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

20340

Organization:

20340 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

3.42 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Trade Compliance

XCKU3P-2FFVD900I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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