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XCKU3P-L1FFVD900I

Xilinx

XCKU3P-L1FFVD900I by Xilinx

Xilinx XCKU3P-L1FFVD900I FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact package with a max operating temperature of 100°C.

Median Price

$2,147.340

Lifecycle Status

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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VNN

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Semicontronic

India . 598 parts In-Stock

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AZTECH Wire

Italy . 733 parts In-Stock

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Ampacity Inc.

Singapore . 253 parts In-Stock

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One Stop Electronics

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Modulus Dynamics

Lithuania . 1,860 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,440 parts In-Stock

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Corohmni

South Africa . 306 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 6,826 parts In-Stock

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$192.894

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$185.178

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$179.391

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$169.747

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Qasali Group International

UK . 4,201 parts In-Stock

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Continental Prestige Electronics

USA . 6,373 parts In-Stock

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Argo Parts USA

USA . 3,045 parts In-Stock

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$2,125.867

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$2,082.920

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Microchip USA

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Advanced Electronics

New Zealand . 600 parts In-Stock

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Netroflash

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Supply Digital

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Vigor

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Corphita

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Overview

Unlock endless possibilities with the XCKU3P-L1FFVD900I by Xilinx! This cutting-edge Field Programmable Gate Array boasts 355950 logic cells and 20340 CLBs, making it a powerhouse in the world of FPGA technology. Perfect for applications requiring high performance and flexibility, this FPGA offers customers the ability to customize and adapt their designs with ease. Trust in Xilinx's reputation for quality and innovation, and experience the countless benefits and advantages that this product brings to your projects. Elevate your creations to new heights with the XCKU3P-L1FFVD900I today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the FPGA, making it suitable for a variety of environmental conditions.

No. of Logic Cells: 355950

With a high number of logic cells, this FPGA can handle complex logic operations and calculations efficiently, making it ideal for advanced applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 0.742 V

The low maximum supply voltage of 0.742 V helps to minimize power consumption and heat generation, leading to energy efficiency.

No. of CLBs: 20340

The large number of Configurable Logic Blocks (CLBs) allows for flexible configuration and customization of logic functions, making the FPGA versatile for different applications.

No. of Inputs: 304

Having 304 inputs enables the FPGA to handle a wide range of input signals, making it suitable for applications that require multiple data inputs.

Package Shape: SQUARE

The square package shape provides uniformity in design and layout, making it easier to integrate the FPGA into circuit board assemblies.

Nominal Supply Voltage (V): 0.72

The nominal supply voltage of 0.72 V ensures stable and reliable operation of the FPGA, contributing to overall system performance.

No. of Terminals: 900

Having 900 terminals allows for a high level of connectivity and signal routing options, making the FPGA versatile for different circuit configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA can be reconfigured and customized for specific applications, offering flexibility and adaptability.

Package Style (Meter): GRID ARRAY

The grid array package style provides efficient heat dissipation and component placement, enhancing reliability and performance of the FPGA.

Minimum Supply Voltage: 0.698 V

The low minimum supply voltage of 0.698 V ensures stable operation even under low-power conditions, making the FPGA suitable for battery-powered devices.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand high temperatures in industrial environments, ensuring reliable operation.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals allows for high-density packaging and efficient signal routing, optimizing the performance and functionality of the FPGA.

Organization: 20340 CLBS

The organizational structure of 20340 Configurable Logic Blocks (CLBs) provides a high level of logic integration and flexibility, making the FPGA suitable for complex applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this FPGA can operate in harsh cold environments, making it versatile for a wide range of applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishings on the terminals ensures good conductivity and corrosion resistance, enhancing the reliability and longevity of the FPGA.

Position Of Terminal: BOTTOM

Having terminals at the bottom allows for easy and secure connection to circuit boards, ensuring stable and reliable signal transmission in the FPGA.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this FPGA can withstand moderate exposure to moisture during handling and manufacturing processes, ensuring product reliability.

Maximum Seated Height: 3.42 mm

The maximum seated height of 3.42 mm allows for compact and low-profile designs, making the FPGA suitable for space-constrained applications.

Width: 31 mm

With a width of 31 mm, this FPGA can fit easily into standard circuit board layouts, simplifying the integration process and ensuring compatibility with existing designs.

No. of Outputs: 304

Having 304 outputs enables the FPGA to drive multiple external devices and interfaces, making it suitable for applications that require extensive signal routing capabilities.

Length: 31 mm

With a length of 31 mm, this FPGA is compact and space-efficient, allowing for flexible placement and integration within electronic systems.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in extreme temperature conditions, making this FPGA suitable for industrial and rugged applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU3P-L1FFVD900I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

355950

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

20340

Organization:

20340 CLBS

Power Characteristics

Nominal Supply Voltage:

0.72

Minimum Supply Voltage:

.698 V

Maximum Supply Voltage:

.742 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

3.42 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Trade Compliance

XCKU3P-L1FFVD900I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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