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XCKU3P-2FFVB676I

Xilinx

XCKU3P-2FFVB676I by Xilinx

Xilinx XCKU3P-2FFVB676I FPGA features 355,950 logic cells and 20,340 CLBs. With 304 inputs/outputs, it operates b/w -40 to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

Median Price

$2,471.560

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9

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Newark

USA . 5 parts In-Stock

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$2,452.710

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Mouser Electronics

USA . 3 parts In-Stock

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DigiKey

USA . 12 parts In-Stock

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$2,626.170

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Digiode

USA . 265 parts In-Stock

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$2,286.479

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Nova Conductors

Japan . 50 parts In-Stock

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$2,392.220

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VNN

France . 222 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 677 parts In-Stock

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$7.565

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Modulus Dynamics

Lithuania . 1,074 parts In-Stock

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$10.145

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Corohmni

South Africa . 99 parts In-Stock

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$107.041

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Texas Native Microelectronics

USA . 25 parts In-Stock

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$179.074

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$157.585

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Kenton Components

USA . 355 parts In-Stock

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$214.889

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$206.293

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$199.847

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$189.102

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Qasali Group International

UK . 961 parts In-Stock

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$483.500

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$449.655

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iodParts Technologies Inc.

India . 1 parts In-Stock

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$598.540

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One Stop Electronics

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$2,029.260

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Ampacity Inc.

Singapore . 3 parts In-Stock

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Semicontronic

India . 3 parts In-Stock

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$2,029.260

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$1,978.528

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$1,968.382

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Corphita

USA . 96 parts In-Stock

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Aranea Global

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$2,344.376

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$2,250.601

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Continental Prestige Electronics

USA . 6,180 parts In-Stock

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Argo Parts USA

USA . 4,934 parts In-Stock

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$2,368.298

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$2,344.376

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$2,320.453

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$2,320.453

Perfect Parts

USA . 1,680 parts In-Stock

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Supply Digital

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A-Z Elektronik GmbH

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Vigor

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Overview

Unlock unparalleled performance and flexibility with the XCKU3P-2FFVB676I by Xilinx, a leading name in FPGA technology. This Field Programmable Gate Array boasts 355950 logic cells and 20340 CLBs, making it ideal for a wide range of applications. With its high-quality plastic/epoxy package body material, grid array package style, and tin silver copper terminal finishing, this FPGA offers customers unmatched value and benefits. From industrial automation to telecommunications, the XCKU3P-2FFVB676I delivers the power and reliability you need for your innovative projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the FPGA, making it ideal for applications where weight and environmental resistance are important factors.

No. of Logic Cells: 355950

Offers high processing power and capability for complex algorithm implementations and data processing tasks.

Surface Mount: YES

Allows for easy and convenient integration onto PCBs, saving assembly time and space.

Maximum Supply Voltage: 0.876 V

Efficient power consumption and compatibility with low-voltage applications.

No. of CLBs: 20340

Provides a large number of Configurable Logic Blocks for versatile logic implementation and customization.

No. of Inputs: 304

Supports a wide range of input signals and data streams for versatile connectivity.

Package Shape: SQUARE

Facilitates efficient use of PCB space and allows for easy orientation during assembly.

Form Of Terminal: BALL

Enables reliable and secure connections during soldering and assembly processes.

Nominal Supply Voltage (V): 0.85

Optimal voltage level for reliable operation and performance of the FPGA.

No. of Terminals: 676

Provides ample connectivity options for external interfacing and signal routing.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Offers flexibility and reconfigurability for adapting to changing requirements and applications.

Package Style (Meter): GRID ARRAY

Facilitates easy handling and assembly on PCBs with a grid pattern for terminal placement.

Minimum Supply Voltage: 0.825 V

Supports low-power operation and efficient energy utilization.

Maximum Operating Temperature: 100 °C

Ensures reliable performance even in high-temperature environments.

Pitch Of Terminal: 1 mm

Allows for precise and compact terminal arrangement on the FPGA for efficient signal routing.

Organization: 20340 CLBS

Structured layout of Configurable Logic Blocks for optimized logic processing and design implementation.

Minimum Operating Temperature: -40 °C

Ensures operational reliability even in extreme cold conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for long-term reliability and performance.

Position Of Terminal: BOTTOM

Facilitates easy PCB mounting and secure soldering of terminals for stable connections.

Moisture Sensitivity Level (MSL): 4

Indicates the level of protection against moisture damage, ensuring durability and reliability in humid environments.

Maximum Seated Height: 3.52 mm

Compact height profile for space-saving and efficient PCB layout.

Width: 27 mm

Compact form factor for easy integration into various electronic devices and systems.

No. of Outputs: 304

Provides multiple output channels for versatile data processing and signal routing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and terminal connections during assembly processes.

Peak Reflow Temperature °C: 250

Suitable peak temperature for reliable soldering and component bonding without damage.

Length: 27 mm

Compact design for efficient PCB layout and space-saving integration.

Grading Of Temperature: INDUSTRIAL

Designed to withstand industrial temperature ranges for reliable operation in harsh environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU3P-2FFVB676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

355950

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

20340

Organization:

20340 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.52 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Trade Compliance

XCKU3P-2FFVB676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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