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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC5VLX50-1FFG324I by Xilinx

XC5VLX50-1FFG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

220

220

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

XC5VLX50-2FFG324I by Xilinx

XC5VLX50-2FFG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

220

220

3600

0.77 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

XC5VLX30-3FF324C by Xilinx

XC5VLX30-3FF324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

220

220

2400

0.67 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Lead

1 mm

324

S-PBGA-B324

e0

No

XC5VLX30-3FFG324C by Xilinx

XC5VLX30-3FFG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

220

220

2400

0.67 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

XC5VLX50-3FF324C by Xilinx

XC5VLX50-3FF324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

220

220

3600

0.67 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Lead

1 mm

324

S-PBGA-B324

e0

No

XC6SLX16-2CSG324C by Xilinx

XC6SLX16-2CSG324C

Xilinx

Xilinx XC6SLX16-2CSG324C FPGA features 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. Ideal for applications requiring a max clock frequency of 667 MHz, such as high-speed data processing in telecommunications or industrial automation systems. Operating temperature range from 0 to 85°C with a low profile grid array package style.

FPGA

14579

232

232

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-2CSG324I by Xilinx

XC6SLX16-2CSG324I

Xilinx

Xilinx XC6SLX16-2CSG324I FPGA features 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide supply voltage range and low combinatorial delay, this FPGA offers versatile programmability for various electronic systems.

FPGA

14579

232

232

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-3CSG324C by Xilinx

XC6SLX16-3CSG324C

Xilinx

The Xilinx XC6SLX16-3CSG324C is a FPGA with 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for applications requiring high-speed processing in compact form factors like telecommunications equipment and industrial automation systems.

FPGA

14579

232

232

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-3CSG324I by Xilinx

XC6SLX16-3CSG324I

Xilinx

The Xilinx XC6SLX16-3CSG324I is a FPGA with 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. It operates at a max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factors due to its low profile grid array package style.

FPGA

14579

232

232

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-L1CSG324C by Xilinx

XC6SLX16-L1CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

14579

232

232

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-L1CSG324I by Xilinx

XC6SLX16-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

14579

232

232

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-2CSG324C by Xilinx

XC6SLX25-2CSG324C

Xilinx

Xilinx XC6SLX25-2CSG324C FPGA features 24051 logic cells, 1879 CLBs, and 226 inputs/outputs. Utilized in applications requiring high-speed processing such as telecommunications, networking, and industrial automation due to its max clock frequency of 667 MHz and low profile grid array package style.

FPGA

24051

226

226

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-2CSG324I by Xilinx

XC6SLX25-2CSG324I

Xilinx

Xilinx XC6SLX25-2CSG324I FPGA features 24051 logic cells, 1879 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

24051

226

226

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-3CSG324C by Xilinx

XC6SLX25-3CSG324C

Xilinx

The Xilinx XC6SLX25-3CSG324C is a FPGA with 24051 logic cells, 1879 CLBs, and 226 inputs/outputs. It operates at max clock frequency of 862 MHz and uses CMOS technology. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.

FPGA

24051

226

226

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-3CSG324I by Xilinx

XC6SLX25-3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

24051

226

226

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-L1CSG324I by Xilinx

XC6SLX25-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

24051

226

226

1879

0.46 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-2CSG324C by Xilinx

XC6SLX25T-2CSG324C

Xilinx

XC6SLX25T-2CSG324C by Xilinx is a FPGA with 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. Operating at 667 MHz max clock frequency, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

24051

190

190

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-2CSG324I by Xilinx

XC6SLX25T-2CSG324I

Xilinx

Xilinx XC6SLX25T-2CSG324I FPGA features 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. Utilized in industrial applications, it operates at a max frequency of 667 MHz with a combinatorial delay of 0.26 ns per CLB. The package style is grid array with low profile and fine pitch terminals.

FPGA

24051

190

190

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-3CSG324C by Xilinx

XC6SLX25T-3CSG324C

Xilinx

Xilinx XC6SLX25T-3CSG324C FPGA features 24051 logic cells, 1879 CLBs, and 862 MHz max clock frequency. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation. Package style: Grid Array, low profile with 0.8mm terminal pitch.

FPGA

24051

190

190

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-3CSG324I by Xilinx

XC6SLX25T-3CSG324I

Xilinx

Xilinx XC6SLX25T-3CSG324I FPGA features 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The device operates b/w -40 to 100°C and supports supply voltages ranging from 1.14V to 2.5/3.3V, making it versatile for various electronic designs.

FPGA

24051

190

190

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-4CSG324C by Xilinx

XC6SLX25T-4CSG324C

Xilinx

Xilinx XC6SLX25T-4CSG324C FPGA features 24051 logic cells, 190 inputs/outputs, and CMOS technology. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor. Package style includes grid array with low profile and fine pitch terminals for efficient PCB integration.

FPGA

24051

190

190

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45-3CSG324C by Xilinx

XC6SLX45-3CSG324C

Xilinx

The Xilinx XC6SLX45-3CSG324C is a FPGA with 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. Operating at a max frequency of 862 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a low profile grid array package style, it offers flexibility in design while maintaining reliability under varying operating conditions.

FPGA

43661

218

218

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45-3CSG324I by Xilinx

XC6SLX45-3CSG324I

Xilinx

Xilinx XC6SLX45-3CSG324I FPGA features 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. Operating temperature ranges from -40 to 100°C, making it suitable for various environments.

FPGA

43661

218

218

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45-L1CSG324C by Xilinx

XC6SLX45-L1CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

43661

218

218

3411

0.46 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45-L1CSG324I by Xilinx

XC6SLX45-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

43661

218

218

3411

0.46 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45T-2CSG324C by Xilinx

XC6SLX45T-2CSG324C

Xilinx

Xilinx XC6SLX45T-2CSG324C is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing like telecommunications and networking.

FPGA

43661

190

190

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45T-2CSG324I by Xilinx

XC6SLX45T-2CSG324I

Xilinx

Xilinx XC6SLX45T-2CSG324I is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at -40 to 100°C, suitable for industrial applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

43661

190

190

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45T-3CSG324C by Xilinx

XC6SLX45T-3CSG324C

Xilinx

Xilinx XC6SLX45T-3CSG324C FPGA features 43661 logic cells, 3411 CLBs, and 190 inputs/outputs. It operates at a max frequency of 862 MHz with a combinatorial delay of 0.21 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in electronics design.

FPGA

43661

190

190

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45T-3CSG324I by Xilinx

XC6SLX45T-3CSG324I

Xilinx

Xilinx XC6SLX45T-3CSG324I FPGA features 43661 logic cells, 3411 CLBs, and 862 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temperature of 100°C.

FPGA

43661

190

190

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45T-4CSG324C by Xilinx

XC6SLX45T-4CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

43661

190

190

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-2CSG324C by Xilinx

XC6SLX9-2CSG324C

Xilinx

Xilinx XC6SLX9-2CSG324C FPGA features 9152 logic cells, 715 CLBs, and a max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

9152

200

200

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-2CSG324I by Xilinx

XC6SLX9-2CSG324I

Xilinx

Xilinx XC6SLX9-2CSG324I FPGA features 9152 logic cells, 715 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design. Operating temperature range from -40 to 100°C makes it suitable for various environments.

FPGA

9152

200

200

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-3CSG324C by Xilinx

XC6SLX9-3CSG324C

Xilinx

The Xilinx XC6SLX9-3CSG324C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing like telecommunications and industrial automation.

FPGA

9152

200

200

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-3CSG324I by Xilinx

XC6SLX9-3CSG324I

Xilinx

The Xilinx XC6SLX9-3CSG324I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. Operates b/w -40 to 100°C with low combinatorial delay and fine pitch grid array package style.

FPGA

9152

200

200

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-L1CSG324I by Xilinx

XC6SLX9-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

9152

200

200

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

LCMXO3L-4300E-5MG324C by Lattice Semiconductor

LCMXO3L-4300E-5MG324C

Lattice Semiconductor

LCMXO3L-4300E-5MG324C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 1.26V, operating temp up to 85°C. Ideal for applications requiring high-density programmable logic in compact form factors.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

10 mm

10 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

324

S-PBGA-B324

e1

LCMXO3L-4300E-5MG324I by Lattice Semiconductor

LCMXO3L-4300E-5MG324I

Lattice Semiconductor

LCMXO3L-4300E-5MG324I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 4300 logic cells, 540 CLBs, and 268 inputs/outputs. It operates b/w -40 to 100 °C and has a 0.5 mm terminal pitch. Ideal for applications requiring high-density programmable ICs in compact spaces.

FPGA

4300

268

268

540

540 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

10 mm

10 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

324

S-PBGA-B324

e1

LCMXO3L-4300E-6MG324C by Lattice Semiconductor

LCMXO3L-4300E-6MG324C

Lattice Semiconductor

LCMXO3L-4300E-6MG324C by Lattice Semiconductor is a 540 CLBs FPGA with max supply voltage of 1.26V, operating temp up to 85°C. It features a grid array package style and 0.5mm terminal pitch, suitable for applications requiring high-density programmable logic solutions in compact spaces.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

10 mm

10 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

324

S-PBGA-B324

e1

LCMXO3L-4300E-6MG324I by Lattice Semiconductor

LCMXO3L-4300E-6MG324I

Lattice Semiconductor

LCMXO3L-4300E-6MG324I by Lattice Semiconductor is a FPGA with 4300 logic cells, 540 CLBs, and 268 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 1.14V to 1.26V. Ideal for applications requiring high-density programmable logic solutions in compact spaces.

FPGA

4300

268

268

540

540 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

10 mm

10 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

324

S-PBGA-B324

e1

10M02SCU324C8G by Intel

10M02SCU324C8G

Intel

The Intel 10M02SCU324C8G is a FPGA with 2000 logic cells, 125 CLBs, and 246 inputs/outputs. It operates at supply voltages b/w 2.85V to 3.15V and temperatures from 0°C to 85°C. This versatile chip is ideal for applications requiring programmable ICs in commercial extended temperature environments.

FPGA

2000

246

246

125

125 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M04SAU324I7G by Intel

10M04SAU324I7G

Intel

Intel's 10M04SAU324I7G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a package style of grid array, it is ideal for industrial applications requiring high performance in a compact form factor. Operating b/w -40 to 100 °C, this FPGA offers versatility and reliability for various electronic designs.

FPGA

4000

246

246

250

250 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M04SCU324C8G by Intel

10M04SCU324C8G

Intel

Intel's 10M04SCU324C8G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a package style of grid array and low profile, it is suitable for commercial extended temperature applications requiring high-performance programmable ICs.

FPGA

4000

246

246

250

250 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M08SAU324C8G by Intel

10M08SAU324C8G

Intel

Intel's 10M08SAU324C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a package style of grid array and low profile, it is ideal for applications requiring high-speed processing in commercial extended temperature environments.

FPGA

8000

250

250

500

500 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M08SAU324I7G by Intel

10M08SAU324I7G

Intel

The Intel 10M08SAU324I7G is an FPGA with 8000 logic cells, 500 CLBs, and 250 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of -40°C to 100°C. This FPGA is ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

8000

250

250

500

500 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M08SCU324C8G by Intel

10M08SCU324C8G

Intel

Intel's 10M08SCU324C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. Ideal for applications requiring high-speed data processing in commercial extended temperature environments.

FPGA

8000

250

250

500

500 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M16DAU324I7P by Intel

10M16DAU324I7P

Intel

Intel's 10M16DAU324I7P FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with fine pitch terminals.

FPGA

16000

320

320

1000

1000 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M16SAU324C8G by Intel

10M16SAU324C8G

Intel

Intel's 10M16SAU324C8G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a package style of grid array and low profile, it is ideal for applications requiring high-speed processing in commercial extended temperature environments.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M16SAU324I7G by Intel

10M16SAU324I7G

Intel

The Intel 10M16SAU324I7G is a Field Programmable Gate Array (FPGA) with 16000 logic cells. It has a max supply voltage of 3.15V and can operate in temperatures ranging from -40 to 100 °C. This FPGA is suitable for industrial applications requiring high-performance programmable ICs.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324