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XC6SLX9-3CSG324I

Xilinx

XC6SLX9-3CSG324I by Xilinx

The Xilinx XC6SLX9-3CSG324I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. Operates b/w -40 to 100°C with low combinatorial delay and fine pitch grid array package style.

Median Price

$53.630

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Mouser Electronics

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Overview

Unlock endless possibilities with the XC6SLX9-3CSG324I by Xilinx, a top-tier manufacturer of Field Programmable Gate Arrays (FPGA). This versatile device boasts 9152 logic cells, 715 CLBs, and a maximum clock frequency of 862 MHz, making it ideal for a wide range of applications. From telecommunications to automotive systems, this FPGA offers unparalleled flexibility and performance. Experience the power of cutting-edge technology with the XC6SLX9-3CSG324I and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and ensures durability.

No. of Logic Cells: 9152

Offers a high level of programmability and flexibility for complex logic designs.

Maximum Supply Voltage: 1.26 V

Allows for efficient power consumption and operation within safe voltage limits.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in reliable performance.

Maximum Clock Frequency: 862 MHz

High clock frequency enables fast processing speeds for real-time applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX9-3CSG324I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

9152

No. of Inputs:

200

No. of Outputs:

200

No. of CLBs:

715

Maximum Clock Frequency:

862 MHz

CLB Maximum Delay:

0.21 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

715 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX9-3CSG324I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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