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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
10M16SCU324C8G by Intel

10M16SCU324C8G

Intel

Intel's 10M16SCU324C8G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance computing in commercial extended temperature environments. The package style is grid array with low profile and fine pitch terminals, making it suitable for compact designs.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M16SCU324I7G by Intel

10M16SCU324I7G

Intel

Intel's 10M16SCU324I7G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with ball terminals.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

XC7A50T-1CS324I by Xilinx

XC7A50T-1CS324I

Xilinx

The Xilinx XC7A50T-1CS324I is a FPGA with 52160 logic cells, 4075 CLBs, and 210 inputs/outputs. It operates at temperatures ranging from -40 to 100°C and has a max supply voltage of 1.05V. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package.

FPGA

52160

210

210

4075

1.27 ns

HKMG

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

XC6SLX16-N3CSG324I by Xilinx

XC6SLX16-N3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

14579

232

232

1139

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-N3CSG324C by Xilinx

XC6SLX25-N3CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

24051

226

226

1879

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-N3CSG324I by Xilinx

XC6SLX25-N3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

24051

226

226

1879

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-N3CSG324I by Xilinx

XC6SLX25T-N3CSG324I

Xilinx

Xilinx XC6SLX25T-N3CSG324I FPGA features 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. Operating at up to 806 MHz with a combinatorial delay of 0.26 ns, it is ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package.

FPGA

24051

190

190

1879

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45-N3CSG324C by Xilinx

XC6SLX45-N3CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

43661

218

218

3411

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45-N3CSG324I by Xilinx

XC6SLX45-N3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

43661

218

218

3411

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45T-N3CSG324C by Xilinx

XC6SLX45T-N3CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

43661

190

190

3411

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-N3CSG324C by Xilinx

XC6SLX9-N3CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

9152

200

200

715

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC7A100T-L1CSG324I by Xilinx

XC7A100T-L1CSG324I

Xilinx

Xilinx XC7A100T-L1CSG324I is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its low profile grid array package style and wide operating temperature range from -40 to 100°C.

FPGA

101440

300

300

7925

1098 MHz

1.27 ns

7925 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-1CSG324C by Xilinx

XC7A15T-1CSG324C

Xilinx

The Xilinx XC7A15T-1CSG324C is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

16640

250

250

1300

1098 MHz

1.27 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-1CSG324I by Xilinx

XC7A15T-1CSG324I

Xilinx

The Xilinx XC7A15T-1CSG324I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex digital designs. With a package style of grid array and low profile, it offers versatility in various electronic systems.

FPGA

16640

250

250

1300

1098 MHz

1.27 ns

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-2CSG324C by Xilinx

XC7A15T-2CSG324C

Xilinx

XC7A15T-2CSG324C by Xilinx is a FPGA with 16640 logic cells, 1300 CLBs, and 250 inputs/outputs. Operating at up to 1286 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

16640

250

250

1300

1286 MHz

1.05 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-2CSG324I by Xilinx

XC7A15T-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

250

250

1300

1286 MHz

1.05 ns

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-3CSG324E by Xilinx

XC7A15T-3CSG324E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

250

250

1300

1412 MHz

0.94 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-L1CSG324I by Xilinx

XC7A15T-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

250

250

1300

1098 MHz

1.27 ns

1300 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-L2CSG324E by Xilinx

XC7A15T-L2CSG324E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

250

250

1300

1098 MHz

1.51 ns

1300 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A35T-L1CSG324I by Xilinx

XC7A35T-L1CSG324I

Xilinx

The Xilinx XC7A35T-L1CSG324I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications for high-speed processing tasks due to its low profile package style and fine pitch grid array design.

FPGA

33280

250

250

2600

1098 MHz

1.27 ns

2600 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A50T-L1CSG324I by Xilinx

XC7A50T-L1CSG324I

Xilinx

Xilinx XC7A50T-L1CSG324I FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7A75T-L1CSG324I by Xilinx

XC7A75T-L1CSG324I

Xilinx

Xilinx XC7A75T-L1CSG324I is a FPGA with 75520 logic cells, 5900 CLBs, and max clock freq of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its low profile grid array package and wide operating temp range from -40 to 100°C.

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

5900 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

LCMXO3LF-2100C-5BG324I by Lattice Semiconductor

LCMXO3LF-2100C-5BG324I

Lattice Semiconductor

LCMXO3LF-2100C-5BG324I by Lattice Semiconductor is a 2100 Logic Cells FPGA with 264 CLBs and 279 Inputs/Outputs. It operates b/w -40 to 100 °C, has a supply voltage range of 2.375V to 3.465V, and is ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

2100

279

279

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3LF-2100C-6BG324C by Lattice Semiconductor

LCMXO3LF-2100C-6BG324C

Lattice Semiconductor

LCMXO3LF-2100C-6BG324C by Lattice Semiconductor is a 264 CLB FPGA with max supply voltage of 3.465V and package style GRID ARRAY, ideal for applications requiring low profile, fine pitch solutions in electronics design.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin/Silver/Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3LF-2100C-6BG324I by Lattice Semiconductor

LCMXO3LF-2100C-6BG324I

Lattice Semiconductor

LCMXO3LF-2100C-6BG324I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 2100 logic cells, 264 CLBs, and 279 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 2.375V to 3.465V. Ideal for applications requiring high-performance computing in compact spaces.

FPGA

2100

279

279

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3LF-4300C-5BG324C by Lattice Semiconductor

LCMXO3LF-4300C-5BG324C

Lattice Semiconductor

LCMXO3LF-4300C-5BG324C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 3.465V, suitable for applications requiring low profile, fine pitch grid arrays. Operating temp range: 0-85°C, terminal pitch: 0.8mm, and MSL level of 3 make it ideal for compact designs in various industries.

FPGA

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3LF-4300C-6BG324I by Lattice Semiconductor

LCMXO3LF-4300C-6BG324I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; No. of Outputs: 279;

FPGA

4300

279

279

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3LF-6900C-5BG324C by Lattice Semiconductor

LCMXO3LF-6900C-5BG324C

Lattice Semiconductor

LCMXO3LF-6900C-5BG324C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. It features a grid array package style, 0.8mm terminal pitch, and TIN SILVER COPPER finishing. Ideal for applications requiring low profile, fine pitch ICs in compact spaces.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XA7A35T-1CSG324Q by Xilinx

XA7A35T-1CSG324Q

Xilinx

The Xilinx XA7A35T-1CSG324Q is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to AEC-Q100 screening level and HKMG technology for high reliability in harsh environments. With a compact grid array package style, it offers low profile design suitable for space-constrained systems.

FPGA

33280

210

210

2600

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA7A75T-1CSG324Q by Xilinx

XA7A75T-1CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

75520

210

210

5900

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA7A35T-1CSG324I by Xilinx

XA7A35T-1CSG324I

Xilinx

The Xilinx XA7A35T-1CSG324I is a FPGA with 33280 logic cells, 2600 CLBs, and 210 inputs/outputs. It operates at a max frequency of 1098 MHz and supports a max supply voltage of 1.05 V. Ideal for applications requiring high-speed processing in compact designs.

FPGA

33280

210

210

2600

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A35T-2CSG324I by Xilinx

XA7A35T-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: 1.05 ns;

FPGA

33280

210

210

2600

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A50T-2CSG324I by Xilinx

XA7A50T-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;

FPGA

52160

210

210

4075

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A50T-1CSG324Q by Xilinx

XA7A50T-1CSG324Q

Xilinx

The Xilinx XA7A50T-1CSG324Q is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for automotive applications due to AEC-Q100 screening level, HKMG technology, and low profile grid array package style.

FPGA

52160

210

210

4075

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA7A75T-2CSG324I by Xilinx

XA7A75T-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

75520

210

210

5900

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A50T-1CSG324I by Xilinx

XA7A50T-1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

52160

210

210

4075

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A100T-1CSG324I by Xilinx

XA7A100T-1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Length: 15 mm;

FPGA

101440

210

210

7925

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A100T-1CSG324Q by Xilinx

XA7A100T-1CSG324Q

Xilinx

The Xilinx XA7A100T-1CSG324Q is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for automotive applications due to AEC-Q100 screening level and HKMG technology. It features a low profile grid array package with 324 terminals.

FPGA

101440

210

210

7925

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA7A100T-2CSG324I by Xilinx

XA7A100T-2CSG324I

Xilinx

XA7A100T-2CSG324I by Xilinx is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

101440

210

210

7925

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A15T-1CSG324I by Xilinx

XA7A15T-1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

FPGA

16640

210

210

1300

1.27 ns

HKMG

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XA7A15T-1CSG324Q by Xilinx

XA7A15T-1CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

210

210

1300

1.27 ns

HKMG

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

AEC-Q100

XA7A15T-2CSG324I by Xilinx

XA7A15T-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Minimum Supply Voltage: .95 V;

FPGA

16640

210

210

1300

1.05 ns

HKMG

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S25-1CSGA324C by Xilinx

XC7S25-1CSGA324C

Xilinx

The Xilinx XC7S25-1CSGA324C is a FPGA with 23360 logic cells, 1825 CLBs, and operates at a max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S25-2CSGA324C by Xilinx

XC7S25-2CSGA324C

Xilinx

Xilinx XC7S25-2CSGA324C FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S25-2CSGA324I by Xilinx

XC7S25-2CSGA324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S25-L1CSGA324I by Xilinx

XC7S25-L1CSGA324I

Xilinx

Xilinx XC7S25-L1CSGA324I FPGA offers 23360 logic cells, 1825 CLBs, and 1098 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with -40 to 100 °C operating temp range. Features low profile grid array package with 0.8 mm terminal pitch.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S50-2CSGA324C by Xilinx

XC7S50-2CSGA324C

Xilinx

The Xilinx XC7S50-2CSGA324C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S50-2CSGA324I by Xilinx

XC7S50-2CSGA324I

Xilinx

The Xilinx XC7S50-2CSGA324I is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications for high-speed data processing due to its low profile package style and fine pitch grid array design.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1