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XC7A75T-L1CSG324I

Xilinx

XC7A75T-L1CSG324I by Xilinx

Xilinx XC7A75T-L1CSG324I is a FPGA with 75520 logic cells, 5900 CLBs, and max clock freq of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its low profile grid array package and wide operating temp range from -40 to 100°C.

Median Price

$158.580

Lifecycle Status

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Farnell

UK . 122 parts In-Stock

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$119.440

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Newark

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Mouser Electronics

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DigiKey

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Element14

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Digiode

USA . 256 parts In-Stock

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VNN

France . 69 parts In-Stock

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Vyrian

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Nova Conductors

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MARBEL Systems

Belgium . 705 parts In-Stock

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Modulus Dynamics

Lithuania . 1,568 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Semicontronic

India . 120 parts In-Stock

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Ampacity Inc.

Singapore . 110 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Corohmni

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Perfect Parts

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Supply Digital

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Argo Parts USA

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Qasali Group International

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Overview

Unlock endless possibilities with the XC7A75T-L1CSG324I by Xilinx, a leading manufacturer in Field Programmable Gate Arrays. This innovative FPGA boasts 75520 logic cells and 5900 CLBs, providing unparalleled flexibility for your projects. With a maximum clock frequency of 1098 MHz and a wide operating temperature range, this high-quality product is perfect for a variety of applications. Experience seamless performance and reliability with the XC7A75T-L1CSG324I, designed to exceed your expectations and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable.

No. of Logic Cells: 75520

With a high number of logic cells, this FPGA allows for complex designs and calculations to be implemented effectively.

Maximum Supply Voltage: 0.98 V

The low maximum supply voltage ensures efficient power consumption and minimizes heat dissipation.

No. of CLBs: 5900

The large number of configurable logic blocks (CLBs) provides flexibility in designing various circuits and functionalities.

No. of Inputs: 300

Having a high number of inputs allows for a wide range of external signals to be processed by the FPGA.

Package Shape: SQUARE

The square package shape simplifies the layout and integration of the FPGA into circuit designs.

Nominal Supply Voltage (V): 0.95

The nominal supply voltage ensures stable and consistent operation of the FPGA.

No. of Terminals: 324

The high number of terminals provides ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field programmable gate array, this product allows for reprogramming of logic and functionality as needed.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables high-density mounting and optimal signal routing.

Minimum Supply Voltage: 0.92 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and efficient operation.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows the FPGA to operate reliably in a variety of environmental conditions.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals allows for compact design and placement of the FPGA on circuit boards.

Maximum Combinatorial Delay of a CLB: 1.27 ns

With a low combinatorial delay, this FPGA enables fast and efficient processing of logic operations.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures the FPGA can function reliably in extreme conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The use of tin/silver/copper finishing on terminals enhances conductivity and reliability of connections.

Position Of Terminal: BOTTOM

Having terminals on the bottom allows for easy and secure mounting on circuit boards.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA can withstand moderate humidity levels in operation environments.

Maximum Seated Height: 1.5 mm

The low seated height of the package enables a compact and space-efficient design when integrating the FPGA into systems.

Width: 15 mm

The compact width of the FPGA allows for efficient use of board space and facilitates layout in circuit designs.

Maximum Clock Frequency: 1098 MHz

With a high maximum clock frequency, this FPGA can handle high-speed processing and operations effectively.

No. of Outputs: 300

The availability of a high number of outputs allows for the FPGA to drive multiple external devices or signals simultaneously.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the FPGA can withstand manufacturing processes such as reflow soldering without issues.

Length: 15 mm

The compact length of the FPGA contributes to a space-efficient design and easier integration into circuit layouts.

Grading Of Temperature: INDUSTRIAL

The industrial temperature grading ensures that the FPGA can operate reliably in harsh industrial environments with varying temperature conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A75T-L1CSG324I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

75520

No. of Inputs:

300

No. of Outputs:

300

No. of CLBs:

5900

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Organization:

5900 CLBS

Power Characteristics

Nominal Supply Voltage:

0.95

Minimum Supply Voltage:

.92 V

Maximum Supply Voltage:

.98 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Trade Compliance

XC7A75T-L1CSG324I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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