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Industrial FPGAs

Field Programmable Gate Arrays (FPGA)

Available Parts 998

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7S6-2CSGA225I by Xilinx

XC7S6-2CSGA225I

Xilinx

Xilinx XC7S6-2CSGA225I FPGA offers 6000 logic cells, 469 CLBs, and 1286 MHz clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S6-L1CPGA196I by Xilinx

XC7S6-L1CPGA196I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S6-L1CSGA225I by Xilinx

XC7S6-L1CSGA225I

Xilinx

Xilinx XC7S6-L1CSGA225I FPGA offers 6000 logic cells, 469 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a low profile grid array package style.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S75-1FGGA484I by Xilinx

XC7S75-1FGGA484I

Xilinx

Xilinx XC7S75-1FGGA484I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with surface mount technology.

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S75-1FGGA676I by Xilinx

XC7S75-1FGGA676I

Xilinx

Xilinx XC7S75-1FGGA676I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 400 inputs/outputs.

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S75-2FGGA484I by Xilinx

XC7S75-2FGGA484I

Xilinx

Xilinx XC7S75-2FGGA484I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 484 terminals.

FPGA

76800

400

400

6000

1286 MHz

1.05 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S75-2FGGA676I by Xilinx

XC7S75-2FGGA676I

Xilinx

Xilinx XC7S75-2FGGA676I FPGA features 76800 logic cells, 6000 CLBs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact package with PLASTIC/EPOXY material.

FPGA

76800

400

400

6000

1286 MHz

1.05 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S75-L1FGGA484I by Xilinx

XC7S75-L1FGGA484I

Xilinx

Xilinx XC7S75-L1FGGA484I FPGA features 76800 logic cells, 6000 CLBs, and max clock freq of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. Operates b/w -40 to 100 °C with low supply voltage range of 0.92-0.98 V.

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S75-L1FGGA676I by Xilinx

XC7S75-L1FGGA676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

ICE40UP3K-UWG30ITR by Lattice Semiconductor

ICE40UP3K-UWG30ITR

Lattice Semiconductor

ICE40UP3K-UWG30ITR by Lattice Semiconductor is a 2800 logic cell FPGA with 350 CLBs, operating at 1.2V. It features a CMOS technology, 0.4mm terminal pitch, and can withstand industrial temperatures. Ideal for applications requiring high performance in compact form factors like IoT devices and consumer electronics.

FPGA

2800

21

21

350

9 ns

CMOS

350 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

2.537 mm

2.114 mm

.6 mm

Tape and Reel

BGA30,5X6,16

Bottom

Ball

.4 mm

30

R-PBGA-B30

ICE40UP5K-UWG30ITR by Lattice Semiconductor

ICE40UP5K-UWG30ITR

Lattice Semiconductor

ICE40UP5K-UWG30ITR by Lattice Semiconductor is a CMOS FPGA with 660 CLBs, operating at -40 to 100 °C. It has a max supply voltage of 1.26 V and package style of GRID ARRAY for industrial applications requiring high performance in compact designs.

FPGA

660

CMOS

660 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

2.537 mm

2.114 mm

.6 mm

Bottom

Ball

.4 mm

30

R-PBGA-B30

XC7S15-2FTGB196I by Xilinx

XC7S15-2FTGB196I

Xilinx

The Xilinx XC7S15-2FTGB196I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and low power consumption. The package style is grid array, low profile, fine pitch with matte tin finishing for optimal performance.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S15-L1FTGB196I by Xilinx

XC7S15-L1FTGB196I

Xilinx

Xilinx XC7S15-L1FTGB196I FPGA offers 12800 logic cells, 1000 CLBs, and 100 inputs. Ideal for industrial applications requiring high combinatorial delay tolerance and operating temperatures ranging from -40 to 100°C. Package style: grid array, with matte tin finishing on bottom terminals.

FPGA

12800

100

100

1000

1.27 ns

1000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S25-2FTGB196I by Xilinx

XC7S25-2FTGB196I

Xilinx

Xilinx XC7S25-2FTGB196I FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S25-L1FTGB196I by Xilinx

XC7S25-L1FTGB196I

Xilinx

The Xilinx XC7S25-L1FTGB196I is a FPGA with 23360 logic cells, 1825 CLBs, and operates at a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its low profile grid array package style.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-1FTGB196I by Xilinx

XC7S50-1FTGB196I

Xilinx

XC7S50-1FTGB196I by Xilinx is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing, it operates b/w -40 to 100 °C with low profile grid array packaging.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-2FTGB196I by Xilinx

XC7S50-2FTGB196I

Xilinx

Xilinx XC7S50-2FTGB196I FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 1mm pitch terminals.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-L1FTGB196I by Xilinx

XC7S50-L1FTGB196I

Xilinx

Xilinx XC7S50-L1FTGB196I FPGA features 52160 logic cells, 4075 CLBs, and 100 inputs/outputs. With a max supply voltage of 0.98V and operating temperature range of -40 to 100°C, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The package style is grid array with matte tin finishing on bottom terminals.

FPGA

52160

100

100

4075

1.27 ns

4075 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S6-2FTGB196I by Xilinx

XC7S6-2FTGB196I

Xilinx

Xilinx XC7S6-2FTGB196I FPGA offers 6000 logic cells, 469 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style is grid array, low profile, fine pitch.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

ICE40UL1K-SWG16ITR50 by Lattice Semiconductor

ICE40UL1K-SWG16ITR50

Lattice Semiconductor

ICE40UL1K-SWG16ITR50 by Lattice Semiconductor is a CMOS FPGA with 156 CLBs, operating b/w -40 to 100 °C. It has a max supply voltage of 1.26 V and is suitable for industrial applications requiring high-performance programmable ICs in a square grid array package.

FPGA

156

CMOS

156 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

1

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

16

S-PBGA-B16

XC7K160T-2FF676I by Xilinx

XC7K160T-2FF676I

Xilinx

Xilinx XC7K160T-2FF676I FPGA features 162240 logic cells, 12675 CLBs, and max clock frequency of 1818 MHz. Ideal for industrial applications requiring high-speed processing with a max operating temp of 100°C. Package style is grid array with PLASTIC/EPOXY material and tin/lead finishing.

FPGA

162240

400

400

12675

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

12675 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.37 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead

1 mm

676

S-PBGA-B676

e0

No

ICE40HX4K-BG121TR by Lattice Semiconductor

ICE40HX4K-BG121TR

Lattice Semiconductor

ICE40HX4K-BG121TR by Lattice Semiconductor is a CMOS FPGA with 440 CLBs, operating at -40 to 100 °C. It has a max supply voltage of 1.26 V and uses PLASTIC/EPOXY material. Ideal for industrial applications requiring high performance in a compact GRID ARRAY package with 0.8 mm terminal pitch.

FPGA

440

CMOS

440 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9 mm

9 mm

1.1 mm

Bottom

Ball

Tin Silver Copper Nickel

.8 mm

121

S-PBGA-B121

e2

ICE40HX4K-BG121 by Lattice Semiconductor

ICE40HX4K-BG121

Lattice Semiconductor

ICE40HX4K-BG121 by Lattice Semiconductor is a 3520 logic cell FPGA with 440 CLBs, operating at max voltage of 1.26V. It features 93 inputs/outputs, 0.8mm terminal pitch, and -40 to 100°C temp range. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

3520

93

93

440

7.3 ns

CMOS

440 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9 mm

9 mm

1.1 mm

Bottom

Ball

Tin Silver Copper Nickel

.8 mm

121

S-PBGA-B121

e2

ICE40HX8K-BG121TR by Lattice Semiconductor

ICE40HX8K-BG121TR

Lattice Semiconductor

ICE40HX8K-BG121TR by Lattice Semiconductor is a CMOS-based FPGA with 7680 logic cells and 960 CLBs. It operates at a nominal voltage of 1.2V and can withstand temperatures up to 100°C. This programmable IC is commonly used in industrial applications requiring high-performance digital logic circuits.

FPGA

7680

93

93

960

7.3 ns

CMOS

960 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9 mm

9 mm

1.1 mm

Bottom

Ball

Tin Silver Copper Nickel

.8 mm

121

S-PBGA-B121

e2

ICE40HX8K-BG121 by Lattice Semiconductor

ICE40HX8K-BG121

Lattice Semiconductor

ICE40HX8K-BG121 by Lattice Semiconductor is a 1.2V FPGA with 7680 logic cells, 960 CLBs, and 93 inputs/outputs. It operates in industrial temperatures (-40 to 100 °C) and uses CMOS technology. Ideal for applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

7680

93

93

960

7.3 ns

CMOS

960 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9 mm

9 mm

1.1 mm

Bottom

Ball

Tin Silver Copper Nickel

.8 mm

121

S-PBGA-B121

e2

XC7A200T-2FF1156I by Xilinx

XC7A200T-2FF1156I

Xilinx

XC7A200T-2FF1156I by Xilinx is a FPGA with 16825 CLBs, 1.05V max supply voltage, and 1.05ns combinatorial delay. Ideal for industrial applications requiring high performance in a compact form factor with a grid array package style and operating temperature range of -40 to 100°C.

FPGA

16825

1.05 ns

16825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.1 mm

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

10CX085YF672I5G by Intel

10CX085YF672I5G

Intel

Intel's 10CX085YF672I5G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a wide operating temperature range from -40 to 100 °C.

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX085YF672I6G by Intel

10CX085YF672I6G

Intel

Intel's 10CX085YF672I6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX085YU484I5G by Intel

10CX085YU484I5G

Intel

Intel's 10CX085YU484I5G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

FPGA

85000

188

188

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX105YF672I5G by Intel

10CX105YF672I5G

Intel

Intel's 10CX105YF672I5G FPGA boasts 104000 logic cells, TSMC technology, and 38000 CLBs. Ideal for industrial applications with a wide operating temperature range of -40 to 100 °C, it offers high flexibility and performance in various electronic systems.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF672I6G by Intel

10CX105YF672I6G

Intel

Intel's 10CX105YF672I6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Operating at a max temp of 100°C, it uses TSMC technology with 0.93V supply voltage. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF780I6G by Intel

10CX105YF780I6G

Intel

Intel's 10CX105YF780I6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Utilizes TSMC technology with 0.93V max supply voltage. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.

FPGA

104000

284

284

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX105YU484I5G by Intel

10CX105YU484I5G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

104000

188

188

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX105YU484I6G by Intel

10CX105YU484I6G

Intel

Intel's 10CX105YU484I6G FPGA boasts 104,000 logic cells and TSMC technology. With 38,000 CLBs and 188 inputs/outputs, it operates in industrial settings with a temperature range of -40 to 100°C. Ideal for applications requiring high-performance programmable ICs in grid array packaging.

FPGA

104000

188

188

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX150YF672I5G by Intel

10CX150YF672I5G

Intel

Intel's 10CX150YF672I5G FPGA features 150000 logic cells, TSMC technology, and 54770 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

FPGA

150000

236

236

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX150YF780I5G by Intel

10CX150YF780I5G

Intel

Intel's 10CX150YF780I5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at -40 to 100 °C, it has 284 inputs/outputs for industrial applications. Utilizes TSMC tech with 0.87-0.93 V supply voltage range in a grid array package.

FPGA

150000

284

284

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX150YU484I6G by Intel

10CX150YU484I6G

Intel

Intel's 10CX150YU484I6G FPGA boasts 150,000 logic cells and TSMC technology. With 54770 CLBs, it operates in industrial settings with a temperature range of -40 to 100°C. Ideal for applications requiring high-performance programmable ICs.

FPGA

150000

188

188

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX220YF672I5G by Intel

10CX220YF672I5G

Intel

Intel's 10CX220YF672I5G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it features TSMC technology and supports industrial-grade applications. With 236 inputs/outputs and a supply voltage range of 0.87V to 0.93V, this grid array package is ideal for high-performance computing tasks.

FPGA

220000

236

236

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX220YF780I5G by Intel

10CX220YF780I5G

Intel

Intel's 10CX220YF780I5G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it has 284 inputs/outputs and uses TSMC technology. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package.

FPGA

220000

284

284

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX220YF780I6G by Intel

10CX220YF780I6G

Intel

Intel's 10CX220YF780I6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Utilizes TSMC technology with 0.9V nominal voltage. Ideal for industrial applications requiring high logic cell count and temperature tolerance up to 100°C.

FPGA

220000

284

284

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX220YU484I6G by Intel

10CX220YU484I6G

Intel

Intel's 10CX220YU484I6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it features TSMC technology and supports industrial-grade applications. With 188 inputs/outputs and a supply voltage range of 0.87V to 0.93V, this grid array package is ideal for high-performance computing tasks.

FPGA

220000

188

188

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CL006YE144I7G by Intel

10CL006YE144I7G

Intel

The Intel 10CL006YE144I7G is a Field Programmable Gate Array with 392 CLBs, operating at 1.2V nominal voltage and supporting a max supply voltage of 1.25V. Ideal for industrial applications requiring high performance in a compact form factor with a package style including flatpack, heat sink/slug, low profile, and fine pitch.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HLFQFP

Square

20 mm

20 mm

1.65 mm

Quad

Gull Wing

Matte Tin - annealed

.5 mm

144

S-PQFP-G144

e3

10CL006YU256I7G by Intel

10CL006YU256I7G

Intel

The Intel 10CL006YU256I7G is a FPGA with 392 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of -40°C to 100°C. It is used in industrial applications requiring high performance computing and programmable logic capabilities.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL006ZE144I8G by Intel

10CL006ZE144I8G

Intel

Intel's 10CL006ZE144I8G FPGA boasts 6272 logic cells and 392 CLBs, with 176 inputs and outputs. Operating b/w -40 to 100 °C, it features a low profile package style for industrial applications requiring high performance in a compact form factor.

FPGA

6272

176

176

392

392 CLBS

-40 to 125 °C range is available as extended industrial

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HLFQFP

Square

20 mm

20 mm

1.65 mm

HQFP144,.87SQ,20

Quad

Gull Wing

.5 mm

144

S-PQFP-G144

10CL006ZU256I8G by Intel

10CL006ZU256I8G

Intel

Intel's 10CL006ZU256I8G FPGA features 6272 logic cells, 392 CLBs, and 176 inputs/outputs. With a package style of grid array and low profile, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor. Operating temperature ranges from -40 to 100°C, making it suitable for various environments.

FPGA

6272

176

176

392

392 CLBS

-40 to 125 °C range is available as extended industrial

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

BGA256,16X16,32

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010YE144I7G by Intel

10CL010YE144I7G

Intel

The Intel 10CL010YE144I7G is a Field Programmable Gate Array (FPGA) with 645 CLBs. It operates at a nominal voltage of 1.2V and has a max supply voltage of 1.25V, making it suitable for industrial applications requiring high performance and programmability in electronic systems. With a package style including flatpack, heat sink/slug, low profile, and fine pitch, this FPGA offers versatility in design while maintaining reliability under extreme temperatures ranging from -40 to 100°C.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HLFQFP

Square

20 mm

20 mm

1.65 mm

Quad

Gull Wing

Matte Tin - annealed

.5 mm

144

S-PQFP-G144

e3

10CL010YM164I7G by Intel

10CL010YM164I7G

Intel

Intel's 10CL010YM164I7G FPGA features 645 CLBs, operates at -40 to 100 °C, and has a max supply voltage of 1.25 V. Ideal for industrial applications requiring high performance in a compact form factor with fine pitch grid array package style.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.2 mm

Bottom

Ball

.5 mm

164

S-PBGA-B164

10CL010YU256I7G by Intel

10CL010YU256I7G

Intel

The Intel 10CL010YU256I7G is a field programmable gate array (FPGA) with 645 CLBs. It has a max supply voltage of 1.25V and operates in temperatures ranging from -40 to 100°C. This FPGA is commonly used in industrial applications for its versatility and compact size (14mm x 14mm).

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256