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10CL010YM164I7G

Intel

10CL010YM164I7G by Intel

Intel's 10CL010YM164I7G FPGA features 645 CLBs, operates at -40 to 100 °C, and has a max supply voltage of 1.25 V. Ideal for industrial applications requiring high performance in a compact form factor with fine pitch grid array package style.

Median Price

$20.485

Lifecycle Status

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9

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Mouser Electronics

USA . 270 parts In-Stock

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$19.510

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$18.550

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DigiKey

USA . 117 parts In-Stock

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$21.460

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$18.550

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Arrow

USA . 696 parts In-Stock

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$19.140

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Verical

USA . 348 parts In-Stock

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Digiode

USA . 371 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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VNN

France . 4,946 parts In-Stock

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Vyrian

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Chip Stock

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Vigor

Singapore . 400 parts In-Stock

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$15.760

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Ampacity Inc.

Singapore . 329 parts In-Stock

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Semicontronic

India . 176 parts In-Stock

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Corphita

USA . 434 parts In-Stock

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$17.559

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Continental Prestige Electronics

USA . 2,500 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 110 parts In-Stock

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Texas Native Microelectronics

USA . 907 parts In-Stock

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$159.499

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Kenton Components

USA . 160 parts In-Stock

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$217.499

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$208.799

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$202.274

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$191.399

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$202.274

$191.399

Qasali Group International

UK . 250 parts In-Stock

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$489.372

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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MARBEL Systems

Belgium . 4,741 parts In-Stock

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Argo Parts USA

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Overview

Unlock limitless possibilities with the 10CL010YM164I7G FPGA by Intel. Crafted with precision and expertise, this innovative product offers unparalleled quality and reliability. Ideal for applications in a wide range of industries, from telecommunications to aerospace, this FPGA is a game-changer for tech enthusiasts and professionals alike. Experience seamless performance and efficiency, coupled with the peace of mind that comes with choosing a trusted manufacturer like Intel. Upgrade your projects today with the 10CL010YM164I7G and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the integrated circuits inside the FPGA, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the FPGA onto circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 1.25 V

Operating at a maximum supply voltage of 1.25V ensures efficient power consumption and reduces the risk of damage to the components.

No. of CLBs: 645

Having 645 Configurable Logic Blocks (CLBs) provides a high level of flexibility for designing and implementing complex logic functions.

Package Shape: SQUARE

Square package shape allows for easier handling and placement within circuit layouts, optimizing use of space on the PCB.

Form Of Terminal: BALL

Ball terminals offer a reliable and secure connection between the FPGA and the circuit board, minimizing the risk of signal loss or disconnection.

Nominal Supply Voltage (V): 1.2

Operating at a nominal supply voltage of 1.2V provides stable performance and reduces power consumption, making it energy-efficient.

No. of Terminals: 164

Having 164 terminals supports the connectivity requirements for a wide range of input and output signals, enabling versatile functionality.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for reconfiguration of logic functions, enabling flexibility for various applications without the need for hardware changes.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style offers a compact design that saves space and allows for high-density integration on PCBs.

Minimum Supply Voltage: 1.15 V

Operating at a minimum supply voltage of 1.15V ensures compatibility with low-power applications and enhances efficiency in energy consumption.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA is suitable for industrial environments and can withstand high temperature conditions.

Pitch Of Terminal: 0.5 mm

A pitch of 0.5mm between terminals allows for precise and reliable connections, maintaining signal integrity and reducing the risk of interference.

Organization: 645 CLBS

The organization of 645 CLBs provides a structured and efficient layout for implementing complex logic designs, enabling optimized performance.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this FPGA can withstand extreme cold environments and is suitable for a wide range of operating conditions.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom allows for easier assembly and connectivity within the circuit design, simplifying integration and maintenance.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2mm, this FPGA can be mounted closely to the PCB, reducing signal interference and improving overall circuit performance.

Width: 8 mm

A width of 8mm provides a compact form factor for the FPGA, enabling efficient use of space on the PCB and simplifying board layout.

Length: 8 mm

A length of 8mm ensures a standardized form factor for the FPGA, making it compatible with industry-standard mounting configurations and layouts.

Grading Of Temperature: INDUSTRIAL

Having an industrial temperature grading ensures that this FPGA is suitable for a wide range of harsh environments, making it a reliable choice for industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL010YM164I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of CLBs:

645

Organization:

645 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

8 mm

Width:

8 mm

Maximum Seated Height:

1.2 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

164

Standards

JESD-30 Code:

S-PBGA-B164

Trade Compliance

10CL010YM164I7G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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