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Industrial FPGAs

Field Programmable Gate Arrays (FPGA)

Available Parts 998

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7A15T-2FTG256I by Xilinx

XC7A15T-2FTG256I

Xilinx

Xilinx XC7A15T-2FTG256I FPGA offers 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.

FPGA

16640

250

250

1300

1286 MHz

1.05 ns

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A15T-L1CPG236I by Xilinx

XC7A15T-L1CPG236I

Xilinx

Xilinx XC7A15T-L1CPG236I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing, it operates b/w -40 to 100°C with low power consumption at 0.92-0.98 V supply voltage.

FPGA

16640

250

250

1300

1098 MHz

1.27 ns

1300 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A15T-L1CSG324I by Xilinx

XC7A15T-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

250

250

1300

1098 MHz

1.27 ns

1300 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-L1FTG256I by Xilinx

XC7A15T-L1FTG256I

Xilinx

Xilinx XC7A15T-L1FTG256I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its low profile grid array package and fine pitch terminals.

FPGA

16640

250

250

1300

1098 MHz

1.27 ns

1300 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A35T-L1CPG236I by Xilinx

XC7A35T-L1CPG236I

Xilinx

Xilinx XC7A35T-L1CPG236I is a 33280 logic cell FPGA with 2600 CLBs, operating at max frequency of 1098 MHz. Ideal for industrial applications due to its low profile grid array package and wide temperature range from -40°C to 100°C.

FPGA

33280

250

250

2600

1098 MHz

1.27 ns

2600 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A35T-L1CSG324I by Xilinx

XC7A35T-L1CSG324I

Xilinx

The Xilinx XC7A35T-L1CSG324I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications for high-speed processing tasks due to its low profile package style and fine pitch grid array design.

FPGA

33280

250

250

2600

1098 MHz

1.27 ns

2600 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A35T-L1CSG325I by Xilinx

XC7A35T-L1CSG325I

Xilinx

The Xilinx XC7A35T-L1CSG325I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact form factor. With a package style of grid array and low profile, it offers versatility in design while maintaining reliability under varying operating conditions.

FPGA

33280

250

250

2600

1098 MHz

1.27 ns

2600 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A35T-L1FTG256I by Xilinx

XC7A35T-L1FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

33280

250

250

2600

1098 MHz

1.27 ns

2600 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A50T-L1CPG236I by Xilinx

XC7A50T-L1CPG236I

Xilinx

Xilinx XC7A50T-L1CPG236I is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact package. With a wide operating temperature range (-40 to 100°C) and fine pitch grid array style, it suits various electronic designs.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e8

XC7A50T-L1CSG324I by Xilinx

XC7A50T-L1CSG324I

Xilinx

Xilinx XC7A50T-L1CSG324I FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7A50T-L1CSG325I by Xilinx

XC7A50T-L1CSG325I

Xilinx

Xilinx XC7A50T-L1CSG325I FPGA with 52160 logic cells, 4075 CLBs, and max clock freq of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. Operates b/w -40 to 100 °C with low power consumption at 0.92-0.98 V supply voltage range.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A50T-L1FTG256I by Xilinx

XC7A50T-L1FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A75T-L1CSG324I by Xilinx

XC7A75T-L1CSG324I

Xilinx

Xilinx XC7A75T-L1CSG324I is a FPGA with 75520 logic cells, 5900 CLBs, and max clock freq of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its low profile grid array package and wide operating temp range from -40 to 100°C.

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

5900 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A200T-2FB676I by Xilinx

XC7A200T-2FB676I

Xilinx

XC7A200T-2FB676I by Xilinx is a FPGA with 16825 CLBs, 1.05V max supply voltage, and 1.05ns combinatorial delay. Ideal for industrial applications requiring high-speed processing and programmable logic capabilities in a compact 27mm square package with 676 terminals.

FPGA

16825

1.05 ns

16825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

ICE40UL1K-SWG16ITR by Lattice Semiconductor

ICE40UL1K-SWG16ITR

Lattice Semiconductor

ICE40UL1K-SWG16ITR by Lattice Semiconductor is a 1248 logic cell FPGA with 156 CLBs, operating at 1.2V. It features a combinatorial delay of 9ns and can withstand industrial temperatures (-40 to 100°C). Ideal for applications requiring high-speed processing in harsh environments.

FPGA

1248

10

10

156

9 ns

CMOS

156 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

1

Plastic/Epoxy

Yes

Grid Array

BGA

Square

1.409 mm

1.409 mm

Bottom

Ball

.35 mm

16

S-PBGA-B16

ICE40UL640-SWG16ITR by Lattice Semiconductor

ICE40UL640-SWG16ITR

Lattice Semiconductor

ICE40UL640-SWG16ITR by Lattice Semiconductor is a 640 logic cell FPGA with 80 CLBs, operating at 1.2V. It features a max combinatorial delay of 9ns and can withstand industrial temperatures from -40 to 100°C. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

640

10

10

80

9 ns

CMOS

80 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

1

Plastic/Epoxy

Yes

Grid Array

BGA

Square

1.409 mm

1.409 mm

Bottom

Ball

.35 mm

16

S-PBGA-B16

LCMXO3LF-4300C-6BG256I by Lattice Semiconductor

LCMXO3LF-4300C-6BG256I

Lattice Semiconductor

LCMXO3LF-4300C-6BG256I by Lattice Semiconductor is a 540 CLBs FPGA with max supply voltage of 3.465V and min operating temp of -40°C. Ideal for industrial applications, it features a grid array package style with 0.8mm terminal pitch for high-performance electronic designs.

FPGA

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

XC7K325T-2FFV900I by Xilinx

XC7K325T-2FFV900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

25475

0.61 ns

25475 CLBS

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

ICE5LP4K-SWG36ITR50 by Lattice Semiconductor

ICE5LP4K-SWG36ITR50

Lattice Semiconductor

ICE5LP4K-SWG36ITR50 by Lattice Semiconductor is a CMOS-based FPGA with 440 CLBs. It operates at a voltage range of 1.14V to 1.26V and has a temperature range of -40°C to 100°C. This programmable IC is commonly used in industrial applications requiring high-performance computing and flexible circuit designs.

FPGA

440

CMOS

440 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

2.078 mm

2.078 mm

.491 mm

Bottom

Ball

.35 mm

36

S-PBGA-B36

LFE5UM5G-45F-8MG285I by Lattice Semiconductor

LFE5UM5G-45F-8MG285I

Lattice Semiconductor

Lattice Semiconductor's LFE5UM5G-45F-8MG285I FPGA features 5500 CLBs, 1.2V nominal voltage, and -40 to 100°C operating temperature range. Ideal for industrial applications requiring high performance and low profile design with a grid array package style.

FPGA

5500

5500 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

XA7A35T-2CSG325I by Xilinx

XA7A35T-2CSG325I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

33280

210

210

2600

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

No

XA7A100T-2FGG484I by Xilinx

XA7A100T-2FGG484I

Xilinx

Xilinx XA7A100T-2FGG484I FPGA features 101440 logic cells, 7925 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with PLASTIC/EPOXY body material.

FPGA

101440

285

285

7925

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XCKU085-1FLVB1760I by Xilinx

XCKU085-1FLVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU035-1SFVA784I by Xilinx

XCKU035-1SFVA784I

Xilinx

Xilinx XCKU035-1SFVA784I FPGA features 444343 logic cells, 25391 CLBs, and 520 inputs/outputs. With a package style of grid array, fine pitch, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor. Operating b/w -40 to 100°C, this FPGA offers versatility and reliability for various electronic designs.

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU085-1FLVA1517I by Xilinx

XCKU085-1FLVA1517I

Xilinx

Xilinx XCKU085-1FLVA1517I FPGA features 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. With a max supply voltage of 0.979 V, it is ideal for industrial applications requiring high-performance computing in a compact square package with grid array style.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-2FLVF1924I by Xilinx

XCKU085-2FLVF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU085-1FLVF1924I by Xilinx

XCKU085-1FLVF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU040-L1SFVA784I by Xilinx

XCKU040-L1SFVA784I

Xilinx

XCKU040-L1SFVA784I by Xilinx is a PLASTIC/EPOXY FPGA with 530250 logic cells. It has 30300 CLBs, 520 inputs/outputs, and operates at a max temperature of 100°C. This FPGA is commonly used in industrial applications for its high performance and versatility.

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

Also Operates at 0.95 V nominal supply

0.9

.88 V

.92 V

0.9 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU095-1FFVB1760I by Xilinx

XCKU095-1FFVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU085-2FLVB1760I by Xilinx

XCKU085-2FLVB1760I

Xilinx

Xilinx XCKU085-2FLVB1760I FPGA offers 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for industrial applications requiring high processing power in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.922V to 0.979V.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU095-2FFVB1760I by Xilinx

XCKU095-2FFVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU035-2SFVA784I by Xilinx

XCKU035-2SFVA784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU040-2SFVA784I by Xilinx

XCKU040-2SFVA784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU095-2FFVB2104I by Xilinx

XCKU095-2FFVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU040-1SFVA784I by Xilinx

XCKU040-1SFVA784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU095-2FFVC1517I by Xilinx

XCKU095-2FFVC1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-2FLVA1517I by Xilinx

XCKU085-2FLVA1517I

Xilinx

Xilinx XCKU085-2FLVA1517I FPGA offers 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C. The package style is grid array with a square shape and ball terminals for surface mount assembly.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU025-1FFVA1156I by Xilinx

XCKU025-1FFVA1156I

Xilinx

Xilinx XCKU025-1FFVA1156I FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a wide operating temperature range (-40 to 100°C) in a compact square grid array package.

FPGA

318150

312

312

18180

18180 CLBS

0.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU095-1FFVA1156I by Xilinx

XCKU095-1FFVA1156I

Xilinx

Xilinx XCKU095-1FFVA1156I is a FPGA with 1176000 logic cells, 67200 CLBs, and 702 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 0.922V to 0.979V. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

1176000

702

702

67200

67200 CLBS

.85

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU095-2FFVA1156I by Xilinx

XCKU095-2FFVA1156I

Xilinx

Xilinx XCKU095-2FFVA1156I FPGA features 1176000 logic cells, 67200 CLBs, and 702 inputs/outputs. Ideal for industrial applications requiring high processing power in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.922V to 0.979V.

FPGA

1176000

702

702

67200

67200 CLBS

0.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-1FFVA1156I by Xilinx

XCKU11P-1FFVA1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-1FFVD900I by Xilinx

XCKU11P-1FFVD900I

Xilinx

Xilinx XCKU11P-1FFVD900I FPGA offers 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C.

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU11P-1FFVE1517I by Xilinx

XCKU11P-1FFVE1517I

Xilinx

XCKU11P-1FFVE1517I by Xilinx is a PLASTIC/EPOXY FPGA with 653100 logic cells and 37320 CLBs. It has applications in industrial settings, offering a wide temperature range (-40 to 100 °C) and high reliability (Moisture Sensitivity Level 4).

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-2FFVA1156I by Xilinx

XCKU11P-2FFVA1156I

Xilinx

Xilinx XCKU11P-2FFVA1156I FPGA features 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Utilizes a grid array package style with a square shape and ball terminals for versatile integration.

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-2FFVD900I by Xilinx

XCKU11P-2FFVD900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU11P-2FFVE1517I by Xilinx

XCKU11P-2FFVE1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-L1FFVA1156I by Xilinx

XCKU11P-L1FFVA1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-L1FFVD900I by Xilinx

XCKU11P-L1FFVD900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1