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Industrial FPGAs

Field Programmable Gate Arrays (FPGA)

Available Parts 998

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
5AGXMA5G4F31I3G by Intel

5AGXMA5G4F31I3G

Intel

The Intel 5AGXMA5G4F31I3G is a Field Programmable Gate Array with 190,000 logic cells and 7170 CLBs. It operates at a max supply voltage of 1.18V and has TSMC technology. Ideal for industrial applications requiring high-performance FPGA solutions in compact form factors.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.15

1.12 V

1.18 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

2.7 mm

BGA896,30X30,40

Bottom

Ball

1 mm

896

S-PBGA-B896

5AGXMA3D4F27I5G by Intel

5AGXMA3D4F27I5G

Intel

Intel's 5AGXMA3D4F27I5G FPGA boasts 156K logic cells, TSMC technology, and 416 inputs/outputs. Ideal for industrial applications with a wide operating temperature range of -40 to 100°C. The package features a grid array style with a compact size of 27x27mm and low seated height of 2.7mm.

FPGA

156000

416

416

5890

TSMC

5890 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

27 mm

27 mm

2.7 mm

BGA672,26X26,40

Bottom

Ball

1 mm

672

S-PBGA-B672

5AGXMA5G4F35I5G by Intel

5AGXMA5G4F35I5G

Intel

The Intel 5AGXMA5G4F35I5G is a Field Programmable Gate Array (FPGA) with 190,000 logic cells and TSMC technology. It has 7170 CLBs, 544 inputs/outputs, and operates b/w -40 to 100 °C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXFB3H4F40I5G by Intel

5AGXFB3H4F40I5G

Intel

Intel's 5AGXFB3H4F40I5G FPGA boasts 362K logic cells, TSMC technology, and 13688 CLBs. With a max supply voltage of 1.13V, it is ideal for industrial applications requiring high-performance computing in a compact form factor with a grid array package style.

FPGA

362000

704

704

13688

TSMC

13688 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

LFD2NX-40-9MG121I by Lattice Semiconductor

LFD2NX-40-9MG121I

Lattice Semiconductor

LFD2NX-40-9MG121I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 9750 CLBs, and uses a GRID ARRAY package style. Ideal for industrial applications requiring high-density programmable ICs with low power consumption.

FPGA

39000

23

23

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

e1

LFD2NX-40-9BG256I by Lattice Semiconductor

LFD2NX-40-9BG256I

Lattice Semiconductor

LFD2NX-40-9BG256I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 111 inputs/outputs, and uses a grid array package. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LFD2NX-40-8BG196I by Lattice Semiconductor

LFD2NX-40-8BG196I

Lattice Semiconductor

LFD2NX-40-8BG196I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 92 inputs/outputs, and uses 0.95-1.05 V supply voltage. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package with 196 terminals.

FPGA

39000

92

92

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Square

12 mm

12 mm

Bottom

Ball

.8 mm

196

S-PBGA-B196

LFD2NX-17-9MG121I by Lattice Semiconductor

LFD2NX-17-9MG121I

Lattice Semiconductor

LFD2NX-17-9MG121I by Lattice Semiconductor is a 17000 Logic Cells FPGA with FDSOI tech. It operates at 1.05V max, -40 to 100°C temp range, and 0.95V min supply voltage. Suitable for industrial use, it features 4250 CLBs, 23 inputs/outputs, and a grid array package style with very thin profile & fine pitch terminals.

FPGA

17000

23

23

4250

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

e1

LFD2NX-17-7MG121I by Lattice Semiconductor

LFD2NX-17-7MG121I

Lattice Semiconductor

LFD2NX-17-7MG121I by Lattice Semiconductor is a 17000 Logic Cells FPGA with FDSOI tech. It operates at 1.05V max, -40 to 100°C temp range, and 0.5mm terminal pitch. Suitable for industrial applications requiring high-density programmable ICs in a compact grid array package style.

FPGA

17000

23

23

4250

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

e1

LFD2NX-40-8BG256I by Lattice Semiconductor

LFD2NX-40-8BG256I

Lattice Semiconductor

LFD2NX-40-8BG256I by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 39,000 logic cells and 9,750 CLBs. It uses FDSOI technology and has a max supply voltage of 1.05V. This FPGA is suitable for industrial applications requiring high-performance programmable ICs.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LFD2NX-40-7MG121I by Lattice Semiconductor

LFD2NX-40-7MG121I

Lattice Semiconductor

LFD2NX-40-7MG121I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 9750 CLBs, and uses a 0.5 mm terminal pitch. Ideal for industrial applications requiring high-density programmable ICs in a compact grid array package.

FPGA

39000

23

23

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

e1

LFD2NX-40-9BG196I by Lattice Semiconductor

LFD2NX-40-9BG196I

Lattice Semiconductor

LFD2NX-40-9BG196I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 92 inputs/outputs, and uses a 0.8 mm pitch square package. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.

FPGA

39000

92

92

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Square

12 mm

12 mm

Bottom

Ball

.8 mm

196

S-PBGA-B196

LFD2NX-40-7BG196I by Lattice Semiconductor

LFD2NX-40-7BG196I

Lattice Semiconductor

LFD2NX-40-7BG196I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 92 inputs/outputs, and uses plastic/epoxy package material. Ideal for industrial applications requiring high-performance programmable ICs in compact square form factor.

FPGA

39000

92

92

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Square

12 mm

12 mm

Bottom

Ball

.8 mm

196

S-PBGA-B196

LFD2NX-40-7BG256I by Lattice Semiconductor

LFD2NX-40-7BG256I

Lattice Semiconductor

Lattice Semiconductor's LFD2NX-40-7BG256I FPGA features 39000 logic cells, FDSOI technology, and 9750 CLBs. With a max supply voltage of 1.05 V, it is ideal for industrial applications requiring high-performance computing in a compact form factor. The package style is grid array with low profile and fine pitch terminals for efficient surface mounting.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

1SD280PT1F55I1VG by Intel

1SD280PT1F55I1VG

Intel

1SD280PT1F55I1VG by Intel is a Field Programmable Gate Array (FPGA) with 2.8M logic cells, 816 inputs/outputs, and operates in industrial temperature range (-40 to 100°C). It features a square package style with ball terminals suitable for surface mount applications.

FPGA

2800000

816

816

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

55 mm

55 mm

3.881 mm

BGA2912,54X54,40

Bottom

Ball

1 mm

2912

S-PBGA-B2912

XC7A25T-2CPG238I by Xilinx

XC7A25T-2CPG238I

Xilinx

The Xilinx XC7A25T-2CPG238I is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex logic operations. With a package style of grid array and low profile, it offers versatile solutions in various electronic systems.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A12T-1CPG238I by Xilinx

XC7A12T-1CPG238I

Xilinx

Xilinx XC7A12T-1CPG238I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a low profile grid array package style.

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A12T-L1CPG238I by Xilinx

XC7A12T-L1CPG238I

Xilinx

The Xilinx XC7A12T-L1CPG238I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for various functions. With a package style of grid array and low profile, it offers flexibility in design while maintaining reliability.

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A75T-1CS324I by Xilinx

XC7A75T-1CS324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

5900 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

XC7A25T-1CPG238I by Xilinx

XC7A25T-1CPG238I

Xilinx

Xilinx XC7A25T-1CPG238I FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing with a temperature range of -40 to 100 °C. Package style is grid array, low profile, fine pitch.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A12T-2CPG238I by Xilinx

XC7A12T-2CPG238I

Xilinx

Xilinx XC7A12T-2CPG238I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with low profile grid array style.

FPGA

12800

150

150

1000

1286 MHz

1.05 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A25T-L1CPG238I by Xilinx

XC7A25T-L1CPG238I

Xilinx

XC7A25T-L1CPG238I by Xilinx is a Field Programmable Gate Array (FPGA) with 23360 logic cells and 1825 configurable logic blocks (CLBs). It operates at a max clock frequency of 1098 MHz and is commonly used in industrial applications.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

HKMG

1825 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

MPF100T-FCVG484I by Microchip Technology

MPF100T-FCVG484I

Microchip Technology

MPF100T-FCVG484I by Microchip is a CMOS FPGA with 284 inputs/outputs, operating temp range of -40 to 100°C. It features a grid array package with 0.8mm terminal pitch, suitable for industrial applications requiring high-density programmable logic solutions.

FPGA

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

1ST280EU2F50I2VG by Intel

1ST280EU2F50I2VG

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE;

FPGA

2800000

440

440

350000

350000 CLBS

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.881 mm

BGA2397,49X49,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

2397

S-PBGA-B2397

e1

XCKU19P-1FFVJ1760I by Xilinx

XCKU19P-1FFVJ1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1842750

540

540

105300

105300 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.27 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU19P-2FFVB2104I by Xilinx

XCKU19P-2FFVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1842750

540

540

105300

105300 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.27 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCKU19P-2FFVJ1760I by Xilinx

XCKU19P-2FFVJ1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1842750

540

540

105300

105300 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.27 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU19P-L1FFVJ1760I by Xilinx

XCKU19P-L1FFVJ1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1842750

540

540

105300

105300 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.27 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU19P-1FFVB2104I by Xilinx

XCKU19P-1FFVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1842750

540

540

105300

105300 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.27 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCKU19P-L1FFVB2104I by Xilinx

XCKU19P-L1FFVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1842750

540

540

105300

105300 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.27 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

LIF-MDF6000-6KMG80I by Lattice Semiconductor

LIF-MDF6000-6KMG80I

Lattice Semiconductor

LIF-MDF6000-6KMG80I by Lattice Semiconductor is a FPGA with 5936 logic cells, 742 CLBs, and 37 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 1.14-1.26V, and features a grid array package for industrial applications.

FPGA

5936

37

37

742

742 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

7 mm

7 mm

1.2 mm

BGA80,10X10,26

Bottom

Ball

.65 mm

80

S-PBGA-B80

LIF-MDF6000-6UMG64I by Lattice Semiconductor

LIF-MDF6000-6UMG64I

Lattice Semiconductor

LIF-MDF6000-6UMG64I by Lattice Semiconductor is a 5936 logic cell FPGA with 742 CLBs and 29 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 1.14-1.26V, and features a grid array package for industrial applications.

FPGA

5936

29

29

742

742 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

3.5 mm

3.5 mm

1 mm

BGA64,8X8,16

Bottom

Ball

.4 mm

64

S-PBGA-B64

10CL080YF484I7G by Intel

10CL080YF484I7G

Intel

Intel's 10CL080YF484I7G FPGA features 81264 logic cells, 5079 CLBs, and operates at a max voltage of 1.25V. Ideal for industrial applications requiring high-performance programmable ICs with 289 inputs/outputs in a compact square package.

FPGA

81264

289

289

5079

5079 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

BGA484,22X22,40

Bottom

Ball

1 mm

484

S-PBGA-B484

MPF300TS-1FCVG484I by Microchip Technology

MPF300TS-1FCVG484I

Microchip Technology

Microchip Technology's MPF300TS-1FCVG484I is a CMOS FPGA with 300,000 logic cells and 284 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 0.97V to 1.03V. Ideal for industrial applications requiring high-density programmable logic in a compact grid array package.

FPGA

300000

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

10CL120YF484I7G by Intel

10CL120YF484I7G

Intel

Intel's 10CL120YF484I7G FPGA features 119088 logic cells, 7443 CLBs, and 277 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with grid array style mounting.

FPGA

119088

277

277

7443

7443 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

BGA484,22X22,40

Bottom

Ball

1 mm

484

S-PBGA-B484

MPF300T-FCVG484I by Microchip Technology

MPF300T-FCVG484I

Microchip Technology

MPF300T-FCVG484I by Microchip is a 300K logic cell FPGA with CMOS tech. It has 284 inputs/outputs, operates b/w -40 to 100°C, and uses 0.97-1.03 V supply voltage. Ideal for industrial applications requiring high-density programmable logic solutions in a compact grid array package.

FPGA

300000

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF100T-1FCVG484I by Microchip Technology

MPF100T-1FCVG484I

Microchip Technology

MPF100T-1FCVG484I by Microchip Technology is a CMOS FPGA with 109K logic cells, 284 inputs/outputs. Operating at -40 to 100°C, it's ideal for industrial applications requiring high-density programmable logic solutions in a compact 19x19mm grid array package.

FPGA

109000

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

EP3SL70F780I3G by Intel

EP3SL70F780I3G

Intel

EP3SL70F780I3G by Intel is a FPGA with 67500 logic cells, 2700 CLBs, and 488 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 0.86V to 0.94V, and features a grid array package style. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.

FPGA

67500

488

488

2700

2700 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780