Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
Microchip Technology's MPF300TS-1FCVG484I is a CMOS FPGA with 300,000 logic cells and 284 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 0.97V to 1.03V. Ideal for industrial applications requiring high-density programmable logic in a compact grid array package.
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Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.
Large number of logic cells provide flexibility and capability to handle complex logic functions efficiently.
Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.
Efficient operation at a relatively low maximum supply voltage helps in reducing power consumption and heat dissipation.
CMOS technology ensures low power consumption, fast switching speeds, and high noise immunity, making the FPGA reliable and efficient.
Abundance of input channels allow for connectivity with multiple external devices or sensors, increasing the versatility of the FPGA.
Square package shape facilitates easy integration into PCB layouts, maximizing use of available board space.
Ball terminals provide reliable and secure connections, suitable for applications where vibration or movement is a concern.
High number of terminals offer a wide range of connectivity options, enabling the FPGA to interface with a variety of external components.
Being a field programmable device, the FPGA allows for flexibility in design modifications and updates without the need for hardware changes.
Grid array with fine pitch design enables high-density mounting, allowing for more compact and space-efficient circuit designs.
Low minimum supply voltage requirement allows for operation in low-power modes, optimizing energy efficiency.
High maximum operating temperature tolerance ensures reliable performance even in challenging environments with elevated temperatures.
Narrow terminal pitch provides high density interconnects, enabling the FPGA to accommodate more connections in a smaller footprint.
Wide temperature operating range allows the FPGA to function reliably in both extreme cold and hot conditions.
Bottom terminal position facilitates easy access for soldering and assembly, simplifying the manufacturing process.
Low seated height profile enables the FPGA to be mounted in compact spaces without compromising on overall system height.
Compact width dimension makes the FPGA suitable for applications where space constraints are a consideration.
Abundance of output channels allow for driving multiple devices or signals, enhancing the functionality and versatility of the FPGA.
High peak reflow temperature capability ensures robust solder connections during assembly processes, enhancing overall reliability.
Compact length dimension makes the FPGA suitable for applications where space constraints are a consideration.
Industrial-grade temperature rating signifies high reliability and performance under extreme temperature conditions typically encountered in industrial environments.
Field Programmable Gate Arrays (FPGA) MPF300TS-1FCVG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology
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MPF300TS-1FCVG484I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Datasheet Update 02/Jun/2022 Revised timing data 26/Aug/2021
PCN Assembly/Origin - Manufacturing Change 23/Feb/2021
PCN Other - Security change 29/May/2019
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
BAV99
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Positronic Industries
CONNECTOR ACCESSORY; MIL-Connector Accessory Name: CONTACT; DIN Conformity: NO; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354; Contact Type: CRIMP REAR RELEASE;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1552200253
Molex
WIRE AND CABLE;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
Sangdest Microelectronics (Nanjing)
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Samsung
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
General Semiconductor
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
LFXP2-8E-5FTN256I
Lattice Semiconductor
LFXP2-8E-5FTN256I by Lattice Semiconductor is a 1.2V FPGA with 8000 logic cells, 1000 CLBs, and max clock freq of 435MHz. Ideal for applications requiring high-speed processing in compact designs due to its small form factor and low power consumption.
10M16SAU169I7G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
EP4CE15E22C8N
The EP4CE15E22C8N by Altera is a field programmable gate array (FPGA) with 15408 logic cells and 963 configurable logic blocks (CLBs). It operates at a maximum supply voltage of 1.25V and has 81 inputs and outputs. This FPGA is surface mountable and has a package shape of square, with a gull wing form of terminal. It is suitable for applications that require high-speed processing and programmability.
EP4CE10E22C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: HLFQFP; Package Shape: SQUARE;
EP4CGX15BF14I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: LBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
XC7K325T-2FFG900C
Xilinx
Xilinx XC7K325T-2FFG900C FPGA features 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
LCMXO2-1200HC-6SG32I
LCMXO2-1200HC-6SG32I by Lattice Semiconductor is a 1280 Logic Cells FPGA with 160 CLBs, 21 Inputs/Outputs. Operating at -40 to 100°C, it has a max supply voltage of 3.6V and nominal voltage of 2.5V. Ideal for industrial applications requiring high-performance in compact form factor.
10M08SAM153I7G
Intel
Intel 10M08SAM153I7G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a supply voltage range of 2.85V to 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with bottom terminals.
XC7A35T-1CSG325I
Xilinx XC7A35T-1CSG325I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact form factor. Package style: Grid Array, low profile, fine pitch; operating temp range: -40 to 100°C.
XC7S25-2CSGA324I
XC7S25-2CSGA324I by Xilinx is a Field Programmable Gate Array (FPGA) with 23360 logic cells and 1825 configurable logic blocks (CLBs). It operates at a max clock frequency of 1286 MHz and is commonly used in industrial applications.
LCMXO2-256ZE-1TG100I
LCMXO2-256ZE-1TG100I by Lattice Semiconductor is a 256 logic cell FPGA with 55 inputs/outputs, operating at 1.2V. It comes in a square package with gull wing terminals, suitable for applications requiring low profile and fine pitch packaging in temperatures ranging from -40 to 100°C.
10CL055YF484I7G
Intel's 10CL055YF484I7G FPGA features 3491 CLBs, operates at -40 to 100 °C, with a supply voltage range of 1.15-1.25 V. Ideal for industrial applications requiring high-performance programmable ICs in a compact GRID ARRAY package style.
M1A3P250-PQG208I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
M1A3P250-PQG208
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
ICE40UP5K-UWG30ITR1K
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
A3P1000-PQG208
5CGXFC7C6F23I7N
The Altera 5CGXFC7C6F23I7N is a FPGA with 149,500 logic cells and 240 inputs and outputs. It has a maximum supply voltage of 1.13V and uses CMOS technology. This FPGA is surface mountable and comes in a BGA484 package. Its dimensions are 23mm x 23mm and it has a grid array style.
XC7A35T-2CSG325I
Xilinx XC7A35T-2CSG325I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in compact form factor. Operates b/w -40 to 100 °C with low profile grid array package style.
XC7S6-1CPGA196C
The Xilinx XC7S6-1CPGA196C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
EP3C16E144C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: RECTANGULAR;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MPF300TS-1FCG1152I
Microchip Technology
MPF300TS-1FCG1152I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 300,000 logic cells. It has a package body material of PLASTIC/EPOXY and features surface mount technology. This FPGA is suitable for applications requiring high-performance programmable ICs.
MPF300T-1FCG784E
MPF300T-1FCG784E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w 0-100°C, and uses plastic/epoxy package for surface mount applications.
MPF300T-FCG484I
MPF300T-FCG484I by Microchip Technology is a CMOS FPGA with 300,000 logic cells and 244 inputs/outputs. It operates b/w -40 to 100°C, has a package size of 23x23mm, and uses a grid array style. Ideal for industrial applications requiring high-density programmable logic in a compact form factor.
MPF300T-FCVG484I
MPF300T-FCVG484I by Microchip is a 300K logic cell FPGA with CMOS tech. It has 284 inputs/outputs, operates b/w -40 to 100°C, and uses 0.97-1.03 V supply voltage. Ideal for industrial applications requiring high-density programmable logic solutions in a compact grid array package.
MPF300T-FCG784NI
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;
MPF300TS-1FCG784NI
MPF300TS-FCG784NI
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
MPF300T-1FCG784NI
MPF300T-1FCG784NI by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 300,000 logic cells. It has a package style of GRID ARRAY and can operate in temperatures ranging from -40 to 100 °C. This FPGA is commonly used for various applications requiring programmable ICs.
MPF300T-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .97 V;
MPF300TLS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 300000;
MPF300TLS-FCSG536I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; No. of Outputs: 300;
MPF300TL-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1152;
MPF300TLS-FCG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;
MPF300TS-FCV484M
Microchip Technology's MPF300TS-FCV484M is a 300K logic cell FPGA with CMOS technology. Featuring 284 inputs/outputs, it operates b/w -55 to 125°C and has a package style of grid array, fine pitch. Ideal for military applications requiring high-density programmable ICs in compact form factors.
MPF300T-1FCVG484I
MPF300T-1FCVG484I by Microchip Technology is a CMOS FPGA with 300K logic cells, 284 inputs/outputs. It operates b/w -40 to 100°C and has a package style of grid array, fine pitch. Ideal for applications requiring high-density programmable logic in compact form factors.
MPF300TS-FC484M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
MPF300T-1FCG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
MPF300T-FCG484E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
MPF300T-1FCG784I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
MPF300TS-FCS536M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE;
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