Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
Microchip Technology's MPF300TS-1FCVG484I is a CMOS FPGA with 300,000 logic cells and 284 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 0.97V to 1.03V. Ideal for industrial applications requiring high-density programmable logic in a compact grid array package.
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$641.370
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Microchip Technology
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NAC Semi
$513.090
$481.020
Nova Conductors
$826.680
Vyrian
Chip Stock
Digiode
AZTECH Wire
$14.669
Ampacity Inc.
$702.690
Semicontronic
$685.123
$681.609
Netroflash
West Coast Incorporated
Authorized Procurement Solutions
Corphita
Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.
Large number of logic cells provide flexibility and capability to handle complex logic functions efficiently.
Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.
Efficient operation at a relatively low maximum supply voltage helps in reducing power consumption and heat dissipation.
CMOS technology ensures low power consumption, fast switching speeds, and high noise immunity, making the FPGA reliable and efficient.
Abundance of input channels allow for connectivity with multiple external devices or sensors, increasing the versatility of the FPGA.
Square package shape facilitates easy integration into PCB layouts, maximizing use of available board space.
Ball terminals provide reliable and secure connections, suitable for applications where vibration or movement is a concern.
High number of terminals offer a wide range of connectivity options, enabling the FPGA to interface with a variety of external components.
Being a field programmable device, the FPGA allows for flexibility in design modifications and updates without the need for hardware changes.
Grid array with fine pitch design enables high-density mounting, allowing for more compact and space-efficient circuit designs.
Low minimum supply voltage requirement allows for operation in low-power modes, optimizing energy efficiency.
High maximum operating temperature tolerance ensures reliable performance even in challenging environments with elevated temperatures.
Narrow terminal pitch provides high density interconnects, enabling the FPGA to accommodate more connections in a smaller footprint.
Wide temperature operating range allows the FPGA to function reliably in both extreme cold and hot conditions.
Bottom terminal position facilitates easy access for soldering and assembly, simplifying the manufacturing process.
Low seated height profile enables the FPGA to be mounted in compact spaces without compromising on overall system height.
Compact width dimension makes the FPGA suitable for applications where space constraints are a consideration.
Abundance of output channels allow for driving multiple devices or signals, enhancing the functionality and versatility of the FPGA.
High peak reflow temperature capability ensures robust solder connections during assembly processes, enhancing overall reliability.
Compact length dimension makes the FPGA suitable for applications where space constraints are a consideration.
Industrial-grade temperature rating signifies high reliability and performance under extreme temperature conditions typically encountered in industrial environments.
Field Programmable Gate Arrays (FPGA) MPF300TS-1FCVG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology
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MPF300TS-1FCVG484I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Datasheet Update 02/Jun/2022 Revised timing data 26/Aug/2021
PCN Assembly/Origin - Manufacturing Change 23/Feb/2021
PCN Other - Security change 29/May/2019
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
NXP Semiconductors
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
LL4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Unitrode
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
261
Deltrol Controls
Other Relays;
LM358D-T
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
Shenzhen Yixinsemi Electronics
XC3S200AN-4FTG256C
Xilinx
Xilinx XC3S200AN-4FTG256C is a FPGA with 4032 logic cells, 448 CLBs, and 195 inputs. It operates at max frequency of 667 MHz and has 160 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
XC7S50-2CSGA324I
The Xilinx XC7S50-2CSGA324I is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications for high-speed data processing due to its low profile package style and fine pitch grid array design.
M1A3P250-PQG208
M1A3P250-PQG208 by Microchip Technology is a CMOS FPGA with 6144 CLBs and 250000 gates. Operating at 350 MHz, it has a supply voltage range of 1.425V to 1.575V. Ideal for applications requiring high-speed processing in commercial-grade environments.
MPF300T-1FCG784E
MPF300T-1FCG784E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w 0-100°C, and uses plastic/epoxy package for surface mount applications.
XC7S25-2FTGB196I
Xilinx XC7S25-2FTGB196I FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption.
EP3C40F484I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
XCAU25P-1FFVB676E
FIELD PROGRAMMABLE GATE ARRAY;
XC7A12T-1CPG238C
Xilinx XC7A12T-1CPG238C FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
LCMXO640C-3TN100C
Lattice Semiconductor
LCMXO640C-3TN100C by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 74 Inputs/Outputs. Operating at 1.8V, it's ideal for applications requiring low power consumption and high performance in a compact form factor like IoT devices or industrial control systems.
5CSXFC6D6F31C6N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;
XC6SLX25T-3CSG324C
Xilinx XC6SLX25T-3CSG324C FPGA features 24051 logic cells, 1879 CLBs, and 862 MHz max clock frequency. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation. Package style: Grid Array, low profile with 0.8mm terminal pitch.
10M08SAU169A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
EP2C8T144C8N
EP2C8T144C8N is a Field Programmable Gate Array (FPGA) by Altera. It has 8256 logic cells, 516 CLBs, and operates at a maximum clock frequency of 402.5 MHz. It is commonly used in applications requiring programmable ICs for digital logic design.
EP4CE30F23C8N
The EP4CE30F23C8N by Altera is a field programmable gate array with 28848 logic cells, 331 inputs and outputs, and a maximum clock frequency of 472.5 MHz. It is suitable for various applications including digital signal processing, high-speed communications, and industrial automation.
XC7A200T-3FFG1156E
The Xilinx XC7A200T-3FFG1156E is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
EP4CE15F23I7N
Intel
EP4CE15F23I7N by Intel is a FPGA with 15408 logic cells, 963 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC3S400-4FTG256C
The Xilinx XC3S400-4FTG256C FPGA features 8064 logic cells, 896 CLBs, and a max clock frequency of 630 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact package.
XCAU10P-2SBVB484E
M7A3P1000-FGG484I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XC7A35T-2FGG484I
Xilinx XC7A35T-2FGG484I FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring fast processing speeds and programmable ICs in a compact square grid array package with 484 terminals.
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MPF300TS-1FCG1152I
MPF300TS-1FCG1152I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 300,000 logic cells. It has a package body material of PLASTIC/EPOXY and features surface mount technology. This FPGA is suitable for applications requiring high-performance programmable ICs.
MPF300T-FCG484I
MPF300T-FCG484I by Microchip Technology is a CMOS FPGA with 300,000 logic cells and 244 inputs/outputs. It operates b/w -40 to 100°C, has a package size of 23x23mm, and uses a grid array style. Ideal for industrial applications requiring high-density programmable logic in a compact form factor.
MPF300T-FCVG484I
MPF300T-FCVG484I by Microchip is a 300K logic cell FPGA with CMOS tech. It has 284 inputs/outputs, operates b/w -40 to 100°C, and uses 0.97-1.03 V supply voltage. Ideal for industrial applications requiring high-density programmable logic solutions in a compact grid array package.
MPF300T-FCG784NI
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;
MPF300TS-1FCG784NI
MPF300TS-FCG784NI
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
MPF300T-1FCG784NI
MPF300T-1FCG784NI by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 300,000 logic cells. It has a package style of GRID ARRAY and can operate in temperatures ranging from -40 to 100 °C. This FPGA is commonly used for various applications requiring programmable ICs.
MPF300T-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .97 V;
MPF300TLS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 300000;
MPF300TLS-FCSG536I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; No. of Outputs: 300;
MPF300TL-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1152;
MPF300TLS-FCG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;
MPF300TS-FCV484M
Microchip Technology's MPF300TS-FCV484M is a 300K logic cell FPGA with CMOS technology. Featuring 284 inputs/outputs, it operates b/w -55 to 125°C and has a package style of grid array, fine pitch. Ideal for military applications requiring high-density programmable ICs in compact form factors.
MPF300T-1FCVG484I
MPF300T-1FCVG484I by Microchip Technology is a CMOS FPGA with 300K logic cells, 284 inputs/outputs. It operates b/w -40 to 100°C and has a package style of grid array, fine pitch. Ideal for applications requiring high-density programmable logic in compact form factors.
MPF300TS-FC484M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
MPF300T-1FCG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
MPF300T-FCG484E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
MPF300T-1FCG784I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
MPF300TS-FCS536M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE;
Supply Digital Components
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