Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XCKU11P-L1FFVE1517I
Xilinx
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
FPGA
653100
512
37320
37320 CLBS
0.72
.698 V
.742 V
-40 °C (-40 °F)
100 °C (212 °F)
Industrial
4
Plastic/Epoxy
Yes
Grid Array
BGA
Square
40 mm
3.51 mm
BGA1517,39X39,40
Bottom
Ball
Tin Silver Copper
1 mm
1517
S-PBGA-B1517
e1
XCKU13P-1FFVE900I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
746550
304
42660
42660 CLBS
0.85
.825 V
.876 V
245 °C (473 °F)
30 s
31 mm
3.42 mm
BGA900,30X30,40
900
S-PBGA-B900
XCKU13P-2FFVE900I
Xilinx XCKU13P-2FFVE900I FPGA features 746550 logic cells, 42660 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. Package style is grid array with moisture sensitivity level of MSL4.
XCKU13P-L1FFVE900I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: HBGA; Package Shape: SQUARE;
It also Operates at 0.85 V
.72
Grid Array, Heat Sink/Slug
HBGA
XCKU15P-1FFVA1156I
Xilinx XCKU15P-1FFVA1156I FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a package style of grid array. Operating temperature ranges from -40 to 100 °C.
1143450
668
65340
65340 CLBS
.85
35 mm
BGA1156,34X34,40
1156
S-PBGA-B1156
XCKU15P-1FFVA1760I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;
65340 CLBs
42.5 mm
3.71 mm
BGA1760,42X42,40
1760
S-PBGA-B1760
XCKU15P-1FFVE1517I
Xilinx XCKU15P-1FFVE1517I FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a max supply voltage of 0.876V.
XCKU15P-1FFVE1760I
XCKU15P-2FFVA1156I
Xilinx XCKU15P-2FFVA1156I FPGA features 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. With a supply voltage range of 0.825V to 0.876V, it is ideal for industrial applications requiring high-performance computing in a compact 35mm square grid array package.
XCKU15P-2FFVA1760I
Xilinx XCKU15P-2FFVA1760I FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C. The package style is grid array with a square shape and bottom-positioned terminals for efficient PCB integration.
XCKU15P-2FFVE1517I
XCKU15P-2FFVE1760I
XCKU15P-L1FFVA1156I
Xilinx XCKU15P-L1FFVA1156I FPGA features 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Package style is grid array with a square shape and ball terminals.
XCKU3P-1FFVB676I
Xilinx XCKU3P-1FFVB676I FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Package style is grid array with a square shape and ball terminals.
355950
20340
20340 CLBS
250 °C (482 °F)
27 mm
3.52 mm
BGA676,26X26,40
676
S-PBGA-B676
XCKU3P-1FFVD900I
Xilinx XCKU3P-1FFVD900I FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. With a supply voltage range of 0.825V to 0.876V, it's ideal for industrial applications requiring high-performance computing in a compact form factor with a grid array package style.
XCKU3P-1SFVB784I
Xilinx XCKU3P-1SFVB784I FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. With a max supply voltage of 0.876 V and operating temperature range from -40 to 100 °C, it's ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.
Grid Array, Fine Pitch
FBGA
23 mm
3.32 mm
BGA784,28X28,32
.8 mm
784
S-PBGA-B784
XCKU3P-2FFVA676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU3P-2FFVB676I
Xilinx XCKU3P-2FFVB676I FPGA features 355,950 logic cells and 20,340 CLBs. With 304 inputs/outputs, it operates b/w -40 to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.
XCKU3P-2FFVD900I
Xilinx XCKU3P-2FFVD900I FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. With a max supply voltage of 0.876V, it's ideal for industrial applications requiring high-performance computing in a compact form factor. The package style is grid array with a square shape and ball terminals, suitable for surface mount assembly.
XCKU3P-2SFVB784I
Xilinx XCKU3P-2SFVB784I FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C.
XCKU3P-L1FFVB676I
XCKU3P-L1FFVD900I
Xilinx XCKU3P-L1FFVD900I FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact package with a max operating temperature of 100°C.
XCKU3P-L1SFVB784I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
XCKU5P-1FFVB676I
Xilinx XCKU5P-1FFVB676I FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. With a supply voltage range of 0.825V to 0.876V, it is ideal for industrial applications requiring high-performance computing in a compact form factor. The package style is grid array with a square shape and ball terminals, suitable for surface mount assembly processes.
474600
27120
27120 CLBS
XCKU5P-1FFVD900I
XCKU5P-1SFVB784I
Xilinx XCKU5P-1SFVB784I FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. With a max supply voltage of 0.876 V, it is ideal for industrial applications requiring high-performance computing in a compact form factor. The package style is grid array with fine pitch terminals, suitable for surface mount assembly processes.
XCKU5P-2FFVB676I
XCKU5P-2FFVD900I
XCKU5P-2SFVB784I
Xilinx XCKU5P-2SFVB784I FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. Package style: Grid Array, Fine Pitch; Nominal voltage: 0.85V.
XCKU5P-L1FFVB676I
XCKU5P-L1SFVB784I
Xilinx XCKU5P-L1SFVB784I FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Utilizes a grid array package style with fine pitch terminals for compact designs.
XCKU9P-1FFVE900I
599550
34260
34260 CLBS
XCKU9P-2FFVE900I
XCKU9P-L1FFVE900I
XCVU11P-1FLGB2104I
Xilinx XCVU11P-1FLGB2104I FPGA offers 2835000 logic cells, 162000 CLBs, and 624 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Package style is grid array with square shape and bottom terminal position.
2835000
624
162000
162000 CLBS
47.5 mm
4.32 mm
BGA2104,46X46,40
2104
S-PBGA-B2104
XCVU11P-1FLGC2104I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;
XCVU11P-2FLGF1924I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;
45 mm
4.24 mm
BGA1924,44X44,40
1924
S-PBGA-B1924
XCVU11P-2FSGD2104I
4.59 mm
XCVU13P-1FHGA2104I
3780000
832
216000
216000 CLBS
52.5 mm
XCVU13P-1FHGB2104I
Xilinx XCVU13P-1FHGB2104I FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Utilizes a grid array package style with a square shape and plastic/epoxy material.
XCVU13P-1FLGA2577I
Xilinx XCVU13P-1FLGA2577I FPGA boasts 3.78M logic cells, 216K CLBs, and 832 inputs/outputs. Ideal for industrial applications with a wide operating temperature range (-40 to 100°C) due to its grid array package style and plastic/epoxy material. Suitable for high-performance computing tasks requiring advanced programmable ICs.
BGA2577,51X51,40
2577
S-PBGA-B2577
XCVU13P-2FHGA2104I
Xilinx XCVU13P-2FHGA2104I FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Package style is grid array with a square shape and bottom terminal position.
XCVU13P-2FHGB2104I
Xilinx XCVU13P-2FHGB2104I FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for industrial applications, it operates b/w -40 to 100 °C with a supply voltage range of 0.825V to 0.876V. The package style is grid array with a square shape and bottom terminal position.
XCVU13P-2FIGD2104I
XCVU13P-2FLGA2577I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;
XCVU3P-2FFVC1517I
Xilinx XCVU3P-2FFVC1517I FPGA offers 862050 logic cells, 49260 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range (-40 to 100°C) and grid array package style.
862050
520
49260
49260 CLBS
XCVU5P-1FLVA2104I
1313763
75072
75072 CLBS
4.11 mm
XCVU5P-1FLVB2104I
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