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XCKU5P-L1SFVB784I

Xilinx

XCKU5P-L1SFVB784I by Xilinx

Xilinx XCKU5P-L1SFVB784I FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Utilizes a grid array package style with fine pitch terminals for compact designs.

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$2,895.420

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Overview

Unlock the power of cutting-edge technology with the Xilinx XCKU5P-L1SFVB784I Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA offers unparalleled quality and performance for a wide range of applications. With 474600 logic cells and 27120 CLBs, this FPGA provides exceptional speed and flexibility. Perfect for industrial use, this product boasts a high operating temperature range and superior moisture sensitivity level. Experience the value and benefits of Xilinx's expertise with the XCKU5P-L1SFVB784I FPGA - the key to unlocking limitless possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the package.

No. of Logic Cells: 474600

High number of logic cells allows for complex programmable functionality.

Surface Mount: YES

Ease of mounting on PCBs for integration into electronic systems.

Maximum Supply Voltage: 0.742 V

Efficient power consumption and low voltage operation.

No. of CLBs: 27120

Abundance of Configurable Logic Blocks allow for flexibility in design.

No. of Inputs: 304

High number of inputs allow for handling of multiple signals.

Package Shape: SQUARE

Space-saving design for efficient board layout.

Form Of Terminal: BALL

Ball terminal offers secure and reliable connections.

Nominal Supply Voltage (V): 0.72

Ideal operating voltage for stable performance.

No. of Terminals: 784

Sufficient number of terminals for connectivity with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array for high density packaging.

Minimum Supply Voltage: 0.698 V

Low minimum supply voltage for energy efficiency.

Maximum Operating Temperature: 100 °C

Wide operating temperature range suitable for industrial applications.

Pitch Of Terminal: 0.8 mm

Compact terminal pitch for space optimization.

Organization: 27120 CLBS

Organized layout of CLBs for structured programmable logic design.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low temperature environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Durable terminal finishing for long-lasting connections.

Position Of Terminal: BOTTOM

Bottom terminal position for easy PCB mounting.

Moisture Sensitivity Level (MSL): 4

Resistant to moisture damage for reliable performance.

Maximum Seated Height: 3.32 mm

Low profile height for slim electronic designs.

Width: 23 mm

Compact width for space-efficient integration.

No. of Outputs: 304

High number of outputs for driving multiple external devices.

Maximum Time At Peak Reflow Temperature (s): 30

Capability to withstand peak reflow temperatures for soldering.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance for assembly process.

Length: 23 mm

Ideal length for compact board layout.

Grading Of Temperature: INDUSTRIAL

Suitable for industrial temperature requirements and rugged environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU5P-L1SFVB784I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

474600

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

27120

Organization:

27120 CLBS

Additional Features:

It also Operates at 0.85 V

Power Characteristics

Nominal Supply Voltage:

.72

Minimum Supply Voltage:

.698 V

Maximum Supply Voltage:

.742 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA784,28X28,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Trade Compliance

XCKU5P-L1SFVB784I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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