Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCVU13P-2FHGA2104I FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Package style is grid array with a square shape and bottom terminal position.
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PLASTIC/EPOXY material provides durability and protection to the FPGA, ensuring reliability in various operating conditions.
Large number of logic cells allow for complex and high-performance designs to be implemented on the FPGA.
Surface mount capability provides ease of installation and compact integration into electronic systems.
Optimized maximum supply voltage ensures efficient power consumption while maintaining proper functionality.
Abundance of Configurable Logic Blocks (CLBs) offer flexibility and customization for different application requirements.
High number of inputs allow for extensive connectivity and data processing capabilities within the FPGA.
Square package shape facilitates easy handling and integration into circuit layouts for efficient board design.
Ball terminals enable secure connection and reliable contact points for interfacing with external components.
Stable nominal supply voltage ensures consistent performance and proper functioning of the FPGA.
Ample terminals allow for versatile connectivity options and support for various input/output configurations.
Being a Field Programmable Gate Array (FPGA) offers reconfigurability and flexibility in design implementation for diverse applications.
Grid array package style simplifies placement on circuit boards and facilitates efficient routing of signals.
Low minimum supply voltage aids in reducing power consumption and enhancing energy efficiency of the FPGA.
High maximum operating temperature tolerance ensures reliability in demanding environments and extended operational conditions.
Compact terminal pitch enables space-saving integration and optimal signal routing within the FPGA package.
Organized structure with 216000 Configurable Logic Blocks (CLBs) provides a systematic framework for logic implementation and design realization.
Wide range of minimum operating temperature allows for stable performance in harsh cold environments without compromising functionality.
Terminal positioned at the bottom facilitates easy accessibility for soldering and interconnection with other components on the PCB.
Low seated height minimizes PCB assembly height requirements and offers compatibility with compact electronic designs.
Optimal width size enables efficient utilization of PCB space while accommodating other components for a well-integrated system layout.
Abundance of outputs offers extensive interfacing possibilities and supports multi-channel data transmission within the FPGA.
Balanced length dimension provides a compact form factor for the FPGA, ensuring compatibility with various board layouts and system configurations.
Industrial-grade temperature rating signifies robustness and reliability in harsh operating environments, making it suitable for industrial applications.
Field Programmable Gate Arrays (FPGA) XCVU13P-2FHGA2104I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XCVU13P-2FHGA2104I Programmable ICs trade compliance attributes, and parameters.
ECCN
3A001.A.7.B
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
1N4148
Rochester Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ESD5Z5.0T1G
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
SS14
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
BSS123-7-F
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
ABS25-32.768KHZ-1-T
Abracon
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
MBRS3200T3G
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
LM78L05ACMX/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
XC6SLX45-3FGG484I
Xilinx
Xilinx XC6SLX45-3FGG484I is a FPGA with 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. It operates at max frequency of 862 MHz, suitable for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and moisture sensitivity level of MSL3, it offers reliable performance in harsh environments.
10M08SCU169A7G
Intel
The Intel 10M08SCU169A7G is a Field Programmable Gate Array with 8000 logic cells, 500 CLBs, and 250 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of -40°C to 125°C. Ideal for automotive applications due to its high reliability and performance in harsh environments.
5CEFA9F23I7N
Intel's 5CEFA9F23I7N FPGA features 301K logic cells, 230 inputs/outputs, and CMOS technology. Ideal for applications requiring high-speed data processing and complex algorithm implementations in fields like telecommunications, aerospace, and industrial automation.
10M04SCE144C8G
Altera
The Altera 10M04SCE144C8G is a field programmable gate array (FPGA) with 4000 logic cells. It is a surface mount device made of plastic/epoxy material. Its CMOS technology allows for efficient performance. With 101 inputs and outputs, it offers versatile connectivity options. The package shape is square with a gull-wing form of terminal. It operates at temperatures ranging from 0 to 85 degrees Celsius. This FPGA is suitable for a wide range of applications that require programmable logic and high-performance computing.
LFD2NX-40-7BG196I
Lattice Semiconductor
LFD2NX-40-7BG196I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 92 inputs/outputs, and uses plastic/epoxy package material. Ideal for industrial applications requiring high-performance programmable ICs in compact square form factor.
LCMXO2-2000HC-4TG144C
LCMXO2-2000HC-4TG144C by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 2112 logic cells. It has a max clock frequency of 133 MHz and can operate at temperatures up to 85°C. This FPGA is commonly used in applications requiring programmable ICs for various electronic systems.
EP2C5T144I8N
EP2C5T144I8N by Intel is a FPGA with 4608 logic cells, 288 CLBs, and 89 inputs. It operates at a max supply voltage of 1.25V and uses CMOS technology. Ideal for applications requiring high-speed data processing in compact electronic systems.
5CEBA2F23C8N
5CEBA2F23C8N by Intel is a FPGA with 25000 logic cells, 224 inputs/outputs, and operates at a max temp of 85°C. It is used in applications requiring high-speed processing and programmable ICs for various industries. The package style is grid array with a square shape and measures 23mm x 23mm.
M1A3P1000-FGG256I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
10M04SAU169I7G
Intel 10M04SAU169I7G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. Ideal for industrial applications requiring a programmable IC with a supply voltage range of 2.85V to 3.15V and operating temperatures from -40°C to 100°C.
XC6SLX25T-2FGG484C
Xilinx XC6SLX25T-2FGG484C FPGA features 24051 logic cells, 1879 CLBs, and 667 MHz max clock frequency. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. Package style: Grid Array, with a max operating temperature of 85°C.
10M04SAU169C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
LFD2NX-40-8BG256C
Lattice Semiconductor's LFD2NX-40-8BG256C FPGA boasts 39000 logic cells, 9750 CLBs, and 111 inputs/outputs. Utilizes FDSOI technology for applications requiring low power consumption and high performance in a compact form factor. Ideal for use in various electronic systems where programmable ICs are needed.
XCAU10P-2SBVB484E
FIELD PROGRAMMABLE GATE ARRAY;
XC7A100T-3FTG256E
Xilinx XC7A100T-3FTG256E FPGA features 101440 logic cells, 7925 CLBs, and a max clock frequency of 1412 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
LCMXO3LF-6900C-5BG400C
LCMXO3LF-6900C-5BG400C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, 0.8mm terminal pitch, and 400 terminals. Ideal for applications requiring low profile, fine pitch grid arrays in electronics operating b/w 0-85°C.
XC7A35T-1CSG324C
Xilinx XC7A35T-1CSG324C FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor with low power consumption.
10M25DAF256C8G
The Intel 10M25DAF256C8G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at a voltage range of 1.15V to 1.25V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring high-speed processing and programmable logic capabilities in various electronic systems.
XCAU15P-1UBVA368E
LCMXO2-256ZE-1TG100I
LCMXO2-256ZE-1TG100I by Lattice Semiconductor is a 256 logic cell FPGA with 55 inputs/outputs, operating at 1.2V. It comes in a square package with gull wing terminals, suitable for applications requiring low profile and fine pitch packaging in temperatures ranging from -40 to 100°C.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCVU47P-2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 4;
XCVU3P-2FFVC1517E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGB2104I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGC2104I
XCVU3P-1FFVC1517E
Xilinx XCVU3P-1FFVC1517E is a plastic/epoxy FPGA with 862,050 logic cells and 49,260 CLBs. It has a max supply voltage of 0.876V and is suitable for applications requiring high-performance programmable ICs.
XCVU3P-2FFVC1517I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-L2FSGD2104E
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
XCVU13P-L2FHGA2104E
XCVU11P-1FLGB2104I
XCVU19P-1FSVA3824E
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 4; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1;
XCVU3P-L2FFVC1517E
XCVU9P-L2FLGA2577E
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XCVU33P-2FSVH2104E
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 240;
XCVU9P-1FLGA2577E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGA2104E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;
XCVU37P-1FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 240; Moisture Sensitivity Level (MSL): 4; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCVU37P-2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2892; Package Code: BGA; Package Shape: SQUARE;
XCVU37P-3FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 240; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCVU37P-L2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 4;
XCVU13P-L2FHGC2104E
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