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XCKU3P-1SFVB784I

Xilinx

XCKU3P-1SFVB784I by Xilinx

Xilinx XCKU3P-1SFVB784I FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. With a max supply voltage of 0.876 V and operating temperature range from -40 to 100 °C, it's ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.

Median Price

$1,717.476

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 800 parts In-Stock

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Digiode

USA . 499 parts In-Stock

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VNN

France . 878 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 417 parts In-Stock

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$9.497

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Corohmni

South Africa . 510 parts In-Stock

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Modulus Dynamics

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Aztec Data Supply Inc.

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Texas Native Microelectronics

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Kenton Components

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$169.640

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Qasali Group International

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Ampacity Inc.

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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$1,642.734

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Netroflash

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$1,608.863

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Microchip USA

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Advanced Electronics

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One Stop Electronics

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MARBEL Systems

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Overview

Unlock endless possibilities with the Xilinx XCKU3P-1SFVB784I Field Programmable Gate Array. Manufactured by Xilinx, a trusted industry leader, this FPGA boasts top-notch quality and reliability. With a whopping 355950 logic cells and 20340 CLBs, this powerful device offers unparalleled flexibility for a wide range of applications. Whether you're designing cutting-edge electronics or pushing the boundaries of technology, the XCKU3P-1SFVB784I delivers exceptional value and performance. Experience the future of innovation today with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and flexibility for various applications.

No. of Logic Cells: 355950

High number of logic cells allows for complex programmable functions and designs.

Surface Mount: YES

Surface mount package makes it easy to integrate into electronic circuit boards.

Maximum Supply Voltage: 0.876 V

Efficient maximum supply voltage for power consumption and heat management.

No. of CLBs: 20340

Large number of Configurable Logic Blocks (CLBs) offer flexibility and scalability in design.

No. of Inputs: 304

Abundant number of inputs allow for versatile input/output configurations.

Nominal Supply Voltage (V): 0.85

Stable nominal supply voltage for reliable performance in different environments.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch offers efficient space utilization and optimized signal integrity.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage for energy efficiency and extended battery life.

Maximum Operating Temperature: 100 °C

Wide temperature range ensures operation in harsh industrial conditions.

Pitch Of Terminal: 0.8 mm

Fine terminal pitch for high density interconnection and reduced signal crosstalk.

Minimum Operating Temperature: -40 °C

Operational at low temperatures for reliable performance in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, copper finish on terminals for enhanced conductivity and corrosion resistance.

No. of Outputs: 304

Balanced number of outputs for versatile output configurations and signal processing.

Peak Reflow Temperature °C: 250

High peak reflow temperature for robust solder joints and component reliability.

Length: 23 mm

Compact length for space-efficient integration into electronic systems.

Grading Of Temperature INDUSTRIAL

Industrial-grade temperature grading for reliable operation in demanding environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU3P-1SFVB784I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

355950

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

20340

Organization:

20340 CLBS

Power Characteristics

Nominal Supply Voltage:

.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA784,28X28,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Trade Compliance

XCKU3P-1SFVB784I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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