Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Intel's 5AGXMA3D4F27I5G FPGA boasts 156K logic cells, TSMC technology, and 416 inputs/outputs. Ideal for industrial applications with a wide operating temperature range of -40 to 100°C. The package features a grid array style with a compact size of 27x27mm and low seated height of 2.7mm.
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This material is cost-effective and lightweight, making it a practical choice for a wide range of applications.
Having a large number of logic cells provides ample flexibility and capability for complex designs and computations.
Surface mount technology allows for easy and secure placement on circuit boards, simplifying the manufacturing process.
The maximum supply voltage of 1.13V ensures stable and reliable operation within specified limits.
With a high number of Configurable Logic Blocks (CLBs), this FPGA offers great flexibility in creating custom logic functions.
Utilizing TSMC technology ensures high performance, reliability, and compatibility with industry standards.
The large number of inputs allows for versatile connectivity and input signal processing capabilities.
The square package shape simplifies the layout and integration of this FPGA into circuit designs.
Ball terminal design provides secure connections and simplifies the soldering process during PCB assembly.
The nominal supply voltage of 1.1V ensures efficient power consumption and reliable operation.
With a high number of terminals, this FPGA offers ample connectivity options for interfacing with other components.
Being a field programmable device, this FPGA allows for custom configuration and reprogramming as needed.
The grid array package style with a heat sink/ slug design helps in efficient heat dissipation, ensuring reliable performance under high temperatures.
The minimum supply voltage of 1.07V ensures compatibility with low-power applications while maintaining operational stability.
The high maximum operating temperature makes this FPGA suitable for demanding industrial applications where temperature variations are common.
The 1mm terminal pitch allows for compact layout designs and efficient use of PCB space.
The organization of 5890 Configurable Logic Blocks (CLBs) provides a high degree of flexibility and customization in logic design.
The low minimum operating temperature of -40°C ensures reliable performance even in harsh environmental conditions.
The bottom terminal position facilitates easy and secure mounting on PCBs, ensuring reliable connections.
The low maximum seated height of 2.7mm allows for slim and compact designs, making it suitable for space-constrained applications.
The compact width of 27mm makes this FPGA easy to integrate into various electronic systems without occupying much space.
With a high number of outputs, this FPGA can drive multiple external devices and interfaces, enabling complex signal processing capabilities.
The length of 27mm complements the compact width, making this FPGA suitable for compact and efficient circuit designs.
The industrial-grade temperature grading ensures reliable performance in harsh industrial environments with temperature fluctuations.
Field Programmable Gate Arrays (FPGA) 5AGXMA3D4F27I5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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5AGXMA3D4F27I5G Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Datasheet Update 09/Aug/2023 Mult PN LABEL 01/08/2023
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
M24308/2-1F
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
2N2222A
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
1552200168
Molex
WIRE AND CABLE;
MMBT2907ALT1G
MMBT2907ALT1G by Onsemi is a PNP BJT transistor with 100 min hFE, 60V VCEO, and 200MHz fT. Ideal for switching applications, it has a small outline package with Gull Wing terminals and can handle up to 0.6A of collector current.
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148-GS08
Telefunken Microelectronics
RECTIFIER DIODE; Surface Mount: YES; JESD-609 Code: e0; No. of Elements: 1; Maximum Operating Temperature: 175 Cel; Maximum Non Repetitive Peak Forward Current: 2 A;
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
10M16SCU169I7G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 130;
XC6SLX150-2FGG484I
Xilinx
Xilinx XC6SLX150-2FGG484I FPGA features 147443 logic cells, 11519 CLBs, and 338 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor with a grid array package style.
XC7S50-L1CSGA324I
Xilinx XC7S50-L1CSGA324I FPGA has 52160 logic cells, 4075 CLBs, and operates at max clock freq of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style is grid array with fine pitch terminals suitable for surface mount assembly.
10M04SCE144C8G
Intel
Intel's 10M04SCE144C8G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-speed processing in industrial automation and telecommunications sectors.
M1A3P250-PQG208I
Microchip Technology
M1A3P250-PQG208I by Microchip Technology is a CMOS FPGA with 6144 CLBs and 250000 gates. It operates b/w -40 to 100 °C, with supply voltage range of 1.425V to 1.575V. Suitable for industrial applications requiring high gate count and programmable logic functions.
A3PE1500-PQG208I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC7S50-L1FTGB196I
Xilinx XC7S50-L1FTGB196I FPGA features 52160 logic cells, 4075 CLBs, and 100 inputs/outputs. With a max supply voltage of 0.98V and operating temperature range of -40 to 100°C, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The package style is grid array with matte tin finishing on bottom terminals.
EP3C16F484I7N
EP3C16F484I7N by Intel is a CMOS FPGA with 15408 logic cells and CLBs. It operates at a max clock frequency of 472.5 MHz, suitable for industrial applications requiring high-speed processing in compact designs. With 346 inputs/outputs, this rectangular grid array package offers flexibility and performance in various electronic systems.
XCAU20P-L1SFVB784I
FIELD PROGRAMMABLE GATE ARRAY;
10M50SCE144C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
A3P250-PQG208
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
10M02SCM153I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 153; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 112;
A3P1000-PQG208M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
M2GL090T-1FG676I
M2GL090T-1FG676I by Microchip Technology is a CMOS FPGA with 86316 logic cells, 425 inputs/outputs, and operates at temperatures from -40 to 100°C. It comes in a plastic/epoxy package with a grid array style, suitable for industrial applications requiring high-performance programmable ICs.
5CEFA9F23I7N
Intel's 5CEFA9F23I7N FPGA features 301K logic cells, 230 inputs/outputs, and CMOS technology. Ideal for applications requiring high-speed data processing and complex algorithm implementations in fields like telecommunications, aerospace, and industrial automation.
XC3S50AN-4TQG144C
XC3S50AN-4TQG144C by Xilinx is a CMOS-based FPGA with 1584 logic cells and 176 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
LCMXO2-640HC-4SG48C
Lattice Semiconductor
LCMXO2-640HC-4SG48C by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 40 Inputs/Outputs. Operating at 2.375V to 3.6V, it's ideal for applications requiring high performance in compact form factors like IoT devices and consumer electronics.
EP3C25F324C8N
EP3C25F324C8N by Intel is a CMOS FPGA with 24624 logic cells and CLBs. It operates at a max clock frequency of 472.5 MHz, making it suitable for high-speed applications in various industries such as telecommunications, automotive, and aerospace. With a package style of grid array and moisture sensitivity level of 3, this FPGA offers flexibility and reliability in design implementations.
10CX220YF780I5G
Intel's 10CX220YF780I5G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it has 284 inputs/outputs and uses TSMC technology. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package.
M2S090-FCS325
Microchip Technology's M2S090-FCS325 FPGA boasts 86184 logic cells, 180 inputs/outputs, and a max supply voltage of 1.26V. Ideal for applications requiring high-performance computing in compact spaces with its thin profile grid array package style.
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5AGXFB7H4F35I3G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE;
5AGXFB5H4F35I5N
The 5AGXFB5H4F35I5N FPGA by Altera is a powerful and versatile field programmable gate array. It features 420,000 logic cells and has a maximum clock frequency of 622 MHz. With 544 inputs and outputs, it offers flexibility for various applications. The package shape is square with a grid array style and a width and length of 35 mm. It operates on a nominal supply voltage of 1.1 V and supports multiple power supplies. Its technology, CMOS, ensures efficient performance. Suitable for surface mount applications, this FPGA is a reliable choice for advanced electronic designs.
The Intel 5AGXFB5H4F35I5N is a field programmable gate array (FPGA) with 420,000 logic cells. It has a max clock frequency of 622 MHz and can operate in industrial temperature conditions. This FPGA is commonly used for applications requiring high-speed processing and customization.
5AGXFB3H4F40I5G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: HBGA; Package Shape: SQUARE;
5AGXMB1G4F31C4N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: HBGA; Package Shape: SQUARE;
5AGXBB1D4F40I5N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.13 V;
5AGXFB7K4F40C4N
The Intel 5AGXFB7K4F40C4N is a FPGA with 504,000 logic cells and 19,024 CLBs. It operates at a max clock frequency of 670 MHz and has 704 inputs/outputs. This FPGA is ideal for applications requiring high-speed processing and complex logic functions in industries like telecommunications and aerospace.
The Altera 5AGXFB7K4F40C4N FPGA has 503,500 logic cells, operates at a maximum clock frequency of 670 MHz, and has 704 inputs and outputs. It uses CMOS technology and has a maximum supply voltage of 1.13V. Its package is a square-shaped BGA with 1517 terminals. This FPGA is suitable for various applications requiring flexible and programmable digital logic circuits.
5AGXFB3H6F35C6N
The Intel 5AGXFB3H6F35C6N is a Field Programmable Gate Array (FPGA) with 362,000 logic cells. It has a max supply voltage of 1.13V and can operate at temperatures up to 85°C. This FPGA is commonly used in applications requiring high-performance programmable logic solutions.
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
5AGXMA7G4F35I5G
5AGXFA5H4F35I5G
5AGXMA5G4F35I5G
5AGXBA7D4F35C4N
5AGXFB3H4F40C5N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
5AGXFB5K4F40I5G
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