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1SD280PT1F55I1VG

Intel

1SD280PT1F55I1VG by Intel

1SD280PT1F55I1VG by Intel is a Field Programmable Gate Array (FPGA) with 2.8M logic cells, 816 inputs/outputs, and operates in industrial temperature range (-40 to 100°C). It features a square package style with ball terminals suitable for surface mount applications.

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Vyrian

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Digiode

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Nova Conductors

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Ampacity Inc.

Singapore . 1,022 parts In-Stock

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AZTECH Wire

Italy . 248 parts In-Stock

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MARBEL Systems

Belgium . 87 parts In-Stock

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Texas Native Microelectronics

USA . 1,837 parts In-Stock

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Kenton Components

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Microchip USA

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Qasali Group International

UK . 30,376 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Overview

Unleash the power of innovation with the 1SD280PT1F55I1VG by Intel. This cutting-edge Field Programmable Gate Array (FPGA) offers unparalleled quality and reliability, thanks to Intel's reputation as a leading manufacturer in the technology industry. From robotics to artificial intelligence, this FPGA is versatile and adaptable, making it ideal for a wide range of applications. Experience the value of increased performance, flexibility, and efficiency that only Intel can provide. Elevate your projects to new heights with the 1SD280PT1F55I1VG by Intel.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Use of plastic/epoxy material makes the package lightweight and cost-effective.

No. of Logic Cells: 2800000

Large number of logic cells allow for complex logic operations and designs to be implemented efficiently.

Surface Mount: YES

Surface mount capability allows for easy installation and integration on PCBs.

No. of Inputs: 816

High number of inputs provide flexibility and support for diverse input requirements.

Package Shape: SQUARE

Square shape provides uniformity in design and layout considerations.

Form Of Terminal: BALL

Ball terminals offer reliable connections and support for high-speed data transfers.

No. of Terminals: 2912

Large number of terminals allow for connectivity with various other components and devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology enables reconfigurability and flexibility in hardware designs.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates easy mounting and soldering on PCBs.

Maximum Operating Temperature: 100 °C

High operating temperature range makes it suitable for industrial applications with demanding environmental conditions.

Pitch Of Terminal: 1 mm

Narrow pitch of terminals allows for compact layout and space-saving in design.

Minimum Operating Temperature: -40 °C

Low operating temperature range ensures reliable performance in cold environments.

Position Of Terminal: BOTTOM

Bottom terminal positioning offers convenient access and connectivity in PCB assemblies.

Maximum Seated Height: 3.881 mm

Low seated height enables slim and compact designs with reduced overall profile.

Width: 55 mm

Standard width dimension for easy integration and compatibility in various systems and enclosures.

No. of Outputs: 816

Balanced number of outputs complement the high input count for comprehensive signal processing capabilities.

Length: 55 mm

Equal length and width dimensions provide a square form factor for consistent layout planning.

Grading Of Temperature: INDUSTRIAL

Industrial grade temperature rating ensures reliable operation in harsh industrial environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 1SD280PT1F55I1VG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

2800000

No. of Inputs:

816

No. of Outputs:

816

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

55 mm

Width:

55 mm

Maximum Seated Height:

3.881 mm

Package Equivalence Code:

BGA2912,54X54,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B2912

Trade Compliance

1SD280PT1F55I1VG Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.A

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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