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XC7A15T-L1FTG256I

Xilinx

XC7A15T-L1FTG256I by Xilinx

Xilinx XC7A15T-L1FTG256I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its low profile grid array package and fine pitch terminals.

Median Price

$40.744

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 150 parts In-Stock

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Semicontronic

India . 8,021 parts In-Stock

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AZTECH Wire

Italy . 314 parts In-Stock

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One Stop Electronics

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Vigor

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Netroflash

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Continental Prestige Electronics

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Modulus Dynamics

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Texas Native Microelectronics

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Aztec Data Supply Inc.

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Kenton Components

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Qasali Group International

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Overview

Discover the power and versatility of the XC7A15T-L1FTG256I by Xilinx, a top-of-the-line Field Programmable Gate Array that offers unmatched performance and reliability. With 16640 logic cells and 1300 CLBs, this FPGA is perfect for a wide range of applications. Xilinx, known for their cutting-edge technology and innovation, ensures that you are getting the best quality product on the market. Whether you're looking to enhance your data processing capabilities or streamline your digital design projects, the XC7A15T-L1FTG256I provides the value, benefits, and advantages you need to take your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this FPGA lightweight and cost-effective.

No. of Logic Cells: 16640

With a high number of logic cells, this FPGA can handle complex calculations and tasks efficiently.

Surface Mount: YES

Being surface mountable allows for easy integration into electronic circuits and PCB designs.

Maximum Supply Voltage: 0.98 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 1300

The large number of configurable logic blocks provides flexibility in designing custom logic circuits.

No. of Inputs: 250

Having a high number of inputs allows for the FPGA to process multiple signals simultaneously.

Package Shape: SQUARE

The square package shape makes it easier to mount and align the FPGA on a PCB.

Form Of Terminal: BALL

Ball terminals improve reliability and durability by providing a secure connection to the PCB.

Nominal Supply Voltage (V): 0.95

A stable nominal supply voltage ensures consistent performance and reliability of the FPGA.

No. of Terminals: 256

The ample number of terminals facilitate easy interfacing with other components in a circuit.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA, this device offers flexibility and customization, making it suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The specific package style allows for high-density mounting and space-saving in compact electronic devices.

Minimum Supply Voltage: 0.92 V

The low minimum supply voltage enables energy-efficient operation and prolongs the lifespan of the FPGA.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions.

Pitch Of Terminal: 1 mm

The pitch of the terminals makes it compatible with standard PCB designs for easy integration.

Maximum Combinatorial Delay of a CLB: 1.27 ns

The low combinatorial delay ensures fast processing of logic operations in the FPGA.

Organization: 1300 CLBS

The organized layout of 1300 configurable logic blocks simplifies the design process for engineers.

Minimum Operating Temperature: -40 °C

The wide temperature range at which this FPGA can operate makes it suitable for extreme environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The finishing of terminals with tin, silver, and copper enhances conductivity and reliability of connections.

Position Of Terminal: BOTTOM

Having the terminals at the bottom allows for efficient PCB layout and component placement.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this FPGA can withstand moderate exposure to moisture during storage and handling.

Maximum Seated Height: 1.55 mm

The low seated height of the FPGA makes it suitable for slim and compact electronic devices.

Width: 17 mm

The compact width of the FPGA enables space-efficient integration into electronic circuits.

Maximum Clock Frequency: 1098 MHz

Operating at a high clock frequency allows for rapid processing and response times in the FPGA.

No. of Outputs: 250

The ample number of outputs allows for the FPGA to drive multiple devices or components in a circuit.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature ensures safe and effective soldering during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes this FPGA suitable for lead-free soldering processes.

Length: 17 mm

The compact length of the FPGA enables efficient use of space in electronic designs.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in demanding operating conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A15T-L1FTG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

16640

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

1300

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Organization:

1300 CLBS

Power Characteristics

Nominal Supply Voltage:

0.95

Minimum Supply Voltage:

.92 V

Maximum Supply Voltage:

.98 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Trade Compliance

XC7A15T-L1FTG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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