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Industrial FPGAs

Field Programmable Gate Arrays (FPGA)

Available Parts 998

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC5VSX240T-1FF1738I by Xilinx

XC5VSX240T-1FF1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

239616

960

960

18720

0.9 ns

CMOS

Field Programmable Gate Arrays

18720 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VSX240T-1FFG1738I by Xilinx

XC5VSX240T-1FFG1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

239616

960

960

18720

0.9 ns

CMOS

Field Programmable Gate Arrays

18720 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XA3S200A-4FTG256I by Xilinx

XA3S200A-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

667 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S400A-4FTG256I by Xilinx

XA3S400A-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

195

160

896

400000

667 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XC5VTX150T-1FFG1759I by Xilinx

XC5VTX150T-1FFG1759I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

148480

680

680

11600

0.9 ns

CMOS

Field Programmable Gate Arrays

11600 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1759

S-PBGA-B1759

e1

No

A54SX16PPQ208I by Microsemi

A54SX16PPQ208I

Microsemi

Microsemi A54SX16PPQ208I FPGA features 1452 CLBs, 16000 gates, and max clock freq of 240MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. Operates at -40 to 85°C with a supply voltage range of 3-3.6V, making it versatile for various environments.

FPGA

1452

16000

240 MHz

0.9 ns

CMOS

1452 CLBS, 16000 Gates

Can also be operated at 5 V; 24000 system gates also available

3.3

3 V

3.6 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

225 °C (437 °F)

20 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

Quad

Gull Wing

Tin Lead

.5 mm

208

S-PQFP-G208

e0

No

ICE40LM2K-CM49TR1K by Lattice Semiconductor

ICE40LM2K-CM49TR1K

Lattice Semiconductor

ICE40LM2K-CM49TR1K by Lattice Semiconductor is a CMOS FPGA with 256 CLBs, operating at -40 to 100 °C. It has a package style of GRID ARRAY and is suitable for industrial applications requiring low power consumption and high performance in a compact form factor.

FPGA

256

CMOS

256 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

3 mm

3 mm

1 mm

Bottom

Ball

.4 mm

49

S-PBGA-B49

XC5VFX200T-1FF1738I by Xilinx

XC5VFX200T-1FF1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

196608

960

960

15360

0.9 ns

CMOS

Field Programmable Gate Arrays

15360 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC3S1000-4FG456I by Xilinx

XC3S1000-4FG456I

Xilinx

XC3S1000-4FG456I by Xilinx is a FPGA with 17280 logic cells, 1920 CLBs, and 1000000 gates. It operates at max frequency of 630 MHz and has 333 inputs/outputs. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

17280

333

333

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC3S200-4VQ100I by Xilinx

XC3S200-4VQ100I

Xilinx

XC3S200-4VQ100I by Xilinx is a FPGA with 4320 logic cells, 480 CLBs, and 200000 equivalent gates. It operates at max frequency of 630 MHz and has a combinatorial delay of 0.61 ns per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

4320

63

63

480

200000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

100

S-PQFP-G100

e4

No

XC3S2000-4FG676I by Xilinx

XC3S2000-4FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

489

489

5120

2000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

5120 CLBS, 2000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S400-4FT256I by Xilinx

XC3S400-4FT256I

Xilinx

Xilinx XC3S400-4FT256I FPGA features 8064 logic cells, 896 CLBs, and 400000 equivalent gates. With a max clock frequency of 630 MHz, it is ideal for industrial applications requiring high-speed processing in a compact package. Operating temperature ranges from -40 to 100°C with low profile grid array packaging.

FPGA

8064

173

173

896

400000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2VP20-5FG676I by Xilinx

XC2VP20-5FG676I

Xilinx

The Xilinx XC2VP20-5FG676I is a FPGA with 20880 logic cells, 2320 CLBs, and 404 inputs/outputs. Operating at up to 1050 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range of -40 to 100°C.

FPGA

20880

404

404

2320

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2VP20-6FG676I by Xilinx

XC2VP20-6FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

404

404

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2VP30-5FG676I by Xilinx

XC2VP30-5FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

416

416

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2VP30-6FG676I by Xilinx

XC2VP30-6FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

416

416

3424

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2VP40-5FG676I by Xilinx

XC2VP40-5FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2VP40-6FG676I by Xilinx

XC2VP40-6FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC3S1400A-4FT256I by Xilinx

XC3S1400A-4FT256I

Xilinx

Xilinx XC3S1400A-4FT256I FPGA offers 25344 logic cells, 2816 CLBs, and 1400000 gates. With a max clock frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. Operating b/w -40 to 100°C, this FPGA is suitable for various electronic systems.

FPGA

25344

161

148

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1400A-4FTG256I by Xilinx

XC3S1400A-4FTG256I

Xilinx

Xilinx XC3S1400A-4FTG256I is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 gates. Operating at max frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range of -40 to 100°C. Package style: Grid Array, Low Profile.

FPGA

25344

161

148

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S200A-4VQ100I by Xilinx

XC3S200A-4VQ100I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

4032

68

62

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

100

S-PQFP-G100

e4

No

XC3S50A-4VQ100I by Xilinx

XC3S50A-4VQ100I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

1584

68

62

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

100

S-PQFP-G100

e4

No

XC3S700A-4FT256I by Xilinx

XC3S700A-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

13248

161

148

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S30-5CSG144I by Xilinx

XC2S30-5CSG144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

972

92

92

216

30000

263 MHz

0.7 ns

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Silver Copper

.8 mm

144

S-PBGA-B144

e1

No

XC2S100-5FGG256I by Xilinx

XC2S100-5FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

176

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S150-5FGG256I by Xilinx

XC2S150-5FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S200-5FGG256I by Xilinx

XC2S200-5FGG256I

Xilinx

Xilinx XC2S200-5FGG256I FPGA features 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing and programmable IC solutions. The package style is grid array with a square shape and surface mount capability.

FPGA

5292

284

284

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S200-5FGG456I by Xilinx

XC2S200-5FGG456I

Xilinx

Xilinx XC2S200-5FGG456I FPGA features 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing and programmable IC solutions. The package style is grid array with a square shape and PLASTIC/EPOXY material.

FPGA

5292

284

284

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

XC2S50-5FGG256I by Xilinx

XC2S50-5FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

176

176

384

50000

263 MHz

0.7 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S150-5FGG456I by Xilinx

XC2S150-5FGG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

XC2S15-5VQG100I by Xilinx

XC2S15-5VQG100I

Xilinx

The Xilinx XC2S15-5VQG100I is a FPGA with 432 logic cells, 96 CLBs, and 15000 equivalent gates. It operates at a max frequency of 263 MHz and has a combinatorial delay of 0.7 ns per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

432

86

86

96

15000

263 MHz

0.7 ns

Field Programmable Gate Arrays

96 CLBS, 15000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

XC2S30-5VQG100I by Xilinx

XC2S30-5VQG100I

Xilinx

XC2S30-5VQG100I by Xilinx is a FPGA with 972 logic cells, 216 CLBs, and 30000 gates. Operating at max clock frequency of 263 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range (-40 to 85°C) and low combinatorial delay (0.7 ns), it offers reliable performance in demanding environments.

FPGA

972

92

92

216

30000

263 MHz

0.7 ns

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

XC2S100-5TQG144I by Xilinx

XC2S100-5TQG144I

Xilinx

The Xilinx XC2S100-5TQG144I is a FPGA with 2700 logic cells, 600 CLBs, and 100000 equivalent gates. It operates at a max frequency of 263 MHz and has 96 inputs and 92 outputs. Ideal for industrial applications requiring high-speed processing in compact form factors.

FPGA

2700

96

92

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC2S15-5TQG144I by Xilinx

XC2S15-5TQG144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

432

86

86

96

15000

263 MHz

0.7 ns

Field Programmable Gate Arrays

96 CLBS, 15000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC2S30-5TQG144I by Xilinx

XC2S30-5TQG144I

Xilinx

Xilinx XC2S30-5TQG144I is a FPGA with 972 logic cells, 216 CLBs, and 30000 gates. Operating at max frequency of 263 MHz, it's ideal for industrial applications requiring high-speed processing in compact form factor. With a wide temperature range (-40 to 85°C), it offers versatility in various environments.

FPGA

972

92

92

216

30000

263 MHz

0.7 ns

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC2S100-5PQG208I by Xilinx

XC2S100-5PQG208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

2700

144

140

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

208

S-PQFP-G208

e3

No

XC2S150-5PQG208I by Xilinx

XC2S150-5PQG208I

Xilinx

Xilinx XC2S150-5PQG208I FPGA features 3888 logic cells, 864 CLBs, and 150000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing and programmable IC flexibility. The package style is flatpack with fine pitch terminals, making it suitable for surface mount assembly in various electronic systems.

FPGA

3888

260

260

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

208

S-PQFP-G208

e3

No

XC2S200-5PQG208I by Xilinx

XC2S200-5PQG208I

Xilinx

Xilinx XC2S200-5PQG208I FPGA offers 5292 logic cells, 1176 CLBs, and 200000 gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing in a compact package. The device operates b/w -40 to 85°C with a supply voltage range of 2.375V to 2.625V, making it suitable for various embedded systems.

FPGA

5292

144

140

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

208

S-PQFP-G208

e3

No

XC2S50-5PQG208I by Xilinx

XC2S50-5PQG208I

Xilinx

Xilinx XC2S50-5PQG208I FPGA features 1728 logic cells, 384 CLBs, and 50000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing in a compact package with a square shape and gull wing terminals.

FPGA

1728

176

176

384

50000

263 MHz

0.7 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

208

S-PQFP-G208

e3

No

XA3S1000-4FGG456I by Xilinx

XA3S1000-4FGG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

391

391

1920

1000000

125 MHz

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

TQFP100,.63SQ

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

AEC-Q100

XA3S200-4PQG208I by Xilinx

XA3S200-4PQG208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

4320

173

173

480

200000

125 MHz

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XA3S400-4PQG208I by Xilinx

XA3S400-4PQG208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

8064

264

264

896

400000

125 MHz

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XA3S50-4PQG208I by Xilinx

XA3S50-4PQG208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

1728

124

124

192

50000

125 MHz

Field Programmable Gate Arrays

192 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XC4VFX60-10FF672I by Xilinx

XC4VFX60-10FF672I

Xilinx

XC4VFX60-10FF672I by Xilinx is a FPGA with 56880 logic cells, 6320 CLBs, and 352 inputs/outputs. It operates at max frequency of 1028 MHz and supports industrial temperature range. Ideal for high-performance applications requiring fast processing speeds in compact designs.

FPGA

56880

352

352

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC3S100E-4TQ144I by Xilinx

XC3S100E-4TQ144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

2160

108

80

240

100000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC3S100E-4VQ100I by Xilinx

XC3S100E-4VQ100I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

2160

66

59

240

100000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

100

S-PQFP-G100

e4

No

XC3S100E-4VQG100I by Xilinx

XC3S100E-4VQG100I

Xilinx

XC3S100E-4VQG100I by Xilinx is a CMOS FPGA with 2160 logic cells, 240 CLBs, and 100000 gates. Operating at 572 MHz, it's ideal for industrial applications requiring high-speed processing and programmable ICs in compact form factors. With a max operating temperature of 100°C, this FPGA offers versatility in various electronic designs.

FPGA

2160

66

59

240

100000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

XC3S1200E-4FG320I by Xilinx

XC3S1200E-4FG320I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

250

194

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No