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XC2S200-5FGG256I

Xilinx

XC2S200-5FGG256I by Xilinx

Xilinx XC2S200-5FGG256I FPGA features 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing and programmable IC solutions. The package style is grid array with a square shape and surface mount capability.

Median Price

$129.490

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Overview

Unlock the limitless possibilities with the Xilinx XC2S200-5FGG256I Field Programmable Gate Array. Crafted with precision by Xilinx, this FPGA boasts 5292 logic cells and 1176 CLBs, offering unparalleled performance and flexibility. From industrial automation to telecommunications, this powerful device is the heart of cutting-edge technologies. Experience seamless integration and blazing-fast speeds with a maximum clock frequency of 263 MHz. Elevate your projects to new heights with the Xilinx XC2S200-5FGG256I, where innovation meets reliability.

Feature Benefit Bullets

No. of Logic Cells: 5292

Having a high number of logic cells allows for greater complexity and functionality in the design of the FPGA.

Maximum Supply Voltage: 2.625 V

The higher maximum supply voltage provides flexibility in powering the FPGA and allows for compatibility with various power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand challenging environmental conditions and maintain reliable performance.

Maximum Clock Frequency: 263 MHz

A high maximum clock frequency enables fast processing speeds, making this FPGA suitable for applications requiring rapid data processing.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this FPGA is resilient to moisture exposure during handling and storage.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC2S200-5FGG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

5292

No. of Inputs:

284

No. of Outputs:

284

No. of CLBs:

1176

No. of Equivalent Gates:

200000

Maximum Clock Frequency:

263 MHz

CLB Maximum Delay:

0.7 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

1176 CLBS, 200000 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies:

1.5/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC2S200-5FGG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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