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XC2S600E-6FGG456I

Xilinx

XC2S600E-6FGG456I by Xilinx

Xilinx XC2S600E-6FGG456I FPGA features 15552 logic cells, 864 CLBs, and 52000 equivalent gates. With a max clock frequency of 357 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

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Overview

Unlock limitless possibilities with the Xilinx XC2S600E-6FGG456I Field Programmable Gate Array (FPGA). Manufactured by industry leader Xilinx, this FPGA offers unparalleled quality and reliability for a wide range of applications. With 15552 logic cells and 52000 equivalent gates, this FPGA delivers high performance and flexibility. Ideal for a variety of projects, this FPGA provides customers with the value and benefits they need to succeed in today's competitive market. Experience innovation like never before with the Xilinx XC2S600E-6FGG456I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, making it suitable for various applications.

No. of Logic Cells: 15552

With a high number of logic cells, this FPGA offers ample resources for complex designs and processing tasks.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, making installation and assembly more efficient.

Maximum Supply Voltage: 1.89 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making it energy-efficient.

No. of CLBs: 864

The large number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic functions.

Technology Used: CMOS

The use of CMOS technology results in low power consumption, high noise immunity, and fast operation speeds.

No. of Inputs: 514

With a high number of inputs, this FPGA can handle a wide range of input signals and data sources.

Package Shape: SQUARE

The square package shape ensures efficient use of PCB space and facilitates placement on the circuit board.

Form Of Terminal: BALL

The ball form of terminals simplifies the soldering process and enhances the reliability of connections.

No. of Equivalent Gates: 52000

The abundance of equivalent gates allows for the implementation of complex logic functions and algorithms.

Nominal Supply Voltage (V): 1.8

The nominal supply voltage of 1.8V is a commonly used standard, ensuring compatibility with various power sources and other components.

Power Supplies (V): 1.2/3.6,1.8

The multiple power supply options provide flexibility in voltage selection for different operating conditions.

No. of Terminals: 456

The high number of terminals enables easy connectivity to other components and peripherals in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for customization and reconfiguration, making it adaptable to changing requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved thermal performance and signal integrity, enhancing overall system reliability.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures reliable operation even in low-power scenarios, extending the device's usability.

Pitch Of Terminal: 1 mm

The small pitch of terminals enables high-density mounting and enables compact circuit designs.

Maximum Combinatorial Delay of a CLB: 0.47 ns

The low combinatorial delay helps in achieving high-speed operation and minimal signal propagation delays within the FPGA.

Organization: 864 CLBS, 52000 GATES

The organizational structure of 864 CLBs and 52000 gates provides a balanced combination of flexibility and processing power.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

The use of Tin/Silver/Copper finishing enhances the terminal's durability and conductivity, ensuring reliable connections.

Position Of Terminal: BOTTOM

The bottom position of terminals facilitates efficient heat dissipation and simplifies PCB layout for better signal integrity.

Moisture Sensitivity Level (MSL): 3

The MSL level 3 indicates that this FPGA can withstand moderate exposure to moisture during storage and assembly processes.

Maximum Seated Height: 2.6 mm

The compact seated height makes this FPGA suitable for space-constrained applications without sacrificing performance.

Width: 23 mm

The moderate width size allows for easy integration into standard PCB layouts and facilitates overall system design.

Maximum Clock Frequency: 357 MHz

The high maximum clock frequency enables fast processing speeds, making it ideal for real-time applications and high-performance computing.

No. of Outputs: 514

The ample number of outputs allows for driving multiple external devices and processing a large volume of data simultaneously.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and connection reliability during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature capability of 250°C guarantees robust and reliable solder joints in various assembly processes.

Length: 23 mm

The compact length size offers flexibility in PCB placement and saves valuable board space in cramped environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC2S600E-6FGG456I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

15552

No. of Inputs:

514

No. of Outputs:

514

No. of CLBs:

864

No. of Equivalent Gates:

52000

Maximum Clock Frequency:

357 MHz

CLB Maximum Delay:

0.47 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

864 CLBS, 52000 Gates

Additional Features:

Maximum usable gates = 150000

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.71 V

Maximum Supply Voltage:

1.89 V

Power Supplies:

1.2/3.6,1.8 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA456,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Pitch:

1 mm

No. of Terminals:

456

Standards

JESD-30 Code:

S-PBGA-B456

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC2S600E-6FGG456I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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