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XC2S100-5PQG208C

Xilinx

XC2S100-5PQG208C by Xilinx

Xilinx XC2S100-5PQG208C FPGA features 2700 logic cells, 600 CLBs, and 100000 gates. With a max clock frequency of 263 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. The package style is flatpack with fine pitch terminals, making it suitable for compact designs in various electronic devices.

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Overview

Elevate your projects with the Xilinx XC2S100-5PQG208C FPGA, designed to deliver top-notch performance and reliability. With a reputation for excellence, Xilinx is a trusted manufacturer in the industry, ensuring that this FPGA is of the highest quality. Perfect for a wide range of applications, this FPGA offers unparalleled flexibility and customization, empowering you to bring your ideas to life. Experience the value and benefits of seamless integration, fast processing speeds, and efficient power consumption with the XC2S100-5PQG208C. Let Xilinx help you elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the FPGA easy to handle and long-lasting.

No. of Logic Cells: 2700

Having a high number of logic cells allows for complex programming and implementation of advanced algorithms.

Surface Mount: YES

Surface mount technology is efficient and helps in cost-effective assembly of the FPGA.

Maximum Supply Voltage: 2.625 V

This moderate supply voltage ensures stable operation and power efficiency.

No. of CLBs: 600

Having a large number of Configurable Logic Blocks (CLBs) provides flexibility in design and customization.

No. of Inputs: 144

The ample number of input pins allows for connecting a variety of external devices and signals.

Package Shape: SQUARE

The square shape facilitates easy placement and alignment on PCBs, optimizing space utilization.

Form Of Terminal: GULL WING

The gull-wing terminals are suitable for automated assembly and soldering processes, ensuring reliability.

No. of Equivalent Gates: 100000

With a high number of equivalent gates, the FPGA can handle complex logic operations efficiently.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage of 2.5V is commonly used in electronic systems, making integration easier.

Power Supplies (V): 1.5/3.3,2.5

Support for multiple power supply voltages enhances compatibility and flexibility in system design.

No. of Terminals: 208

A higher number of terminals allows for more connections and interfaces with external components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this device offers reprogrammability, enabling quick prototyping and iteration in designs.

Package Style (Meter): FLATPACK, FINE PITCH

The flatpack design with fine pitch terminals optimizes space on the PCB and allows for denser layouts.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures compatibility with different power sources and energy-efficient operation.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes the FPGA suitable for a variety of industrial and commercial applications.

Pitch Of Terminal: 0.5 mm

The fine pitch of terminals allows for high-density packaging and efficient routing of signals.

Maximum Combinatorial Delay of a CLB: 0.7 ns

Low combinatorial delay in the CLBs ensures fast signal processing and reduced latency in applications.

Organization: 600 CLBS, 100000 GATES

The organized structure of CLBs and gates simplifies design implementation and debugging processes.

Minimum Operating Temperature: 0 °C

The wide operating temperature range enables the FPGA to function reliably in different environmental conditions.

Finishing Of Terminal Used: Matte Tin (Sn)

The matte tin finish on terminals provides good solderability and corrosion resistance for long-term reliability.

Position Of Terminal: QUAD

The quad positioning of terminals allows for easier placement and soldering during PCB assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the FPGA can withstand some exposure to moisture during storage and assembly processes.

Maximum Seated Height: 4.1 mm

The low seated height of the package minimizes the overall profile of the FPGA on the PCB.

Width: 28 mm

The compact width of the FPGA package contributes to space-saving designs in electronic systems.

Maximum Clock Frequency: 263 MHz

The high maximum clock frequency allows for fast data processing and real-time operation in applications.

No. of Outputs: 140

A large number of output pins enable the FPGA to drive multiple external devices and deliver complex logic results.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering of the package during assembly.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance allows for reliable solder connections in lead-free assembly processes.

Length: 28 mm

The moderate length of the FPGA package contributes to a balanced form factor for easy integration in systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC2S100-5PQG208C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

2700

No. of Inputs:

144

No. of Outputs:

140

No. of CLBs:

600

No. of Equivalent Gates:

100000

Maximum Clock Frequency:

263 MHz

CLB Maximum Delay:

0.7 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

600 CLBS, 100000 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies:

1.5/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Fine Pitch

Package Code:

Package Shape:

Length:

28 mm

Width:

28 mm

Maximum Seated Height:

4.1 mm

Package Equivalence Code:

QFP208,1.2SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

208

Standards

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

XC2S100-5PQG208C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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