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A54SX16PPQ208I

Microsemi

A54SX16PPQ208I by Microsemi

Microsemi A54SX16PPQ208I FPGA features 1452 CLBs, 16000 gates, and max clock freq of 240MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. Operates at -40 to 85°C with a supply voltage range of 3-3.6V, making it versatile for various environments.

Median Price

$378.000

Lifecycle Status

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Master Electronics

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$340.510

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Chip1Stop

Japan . 256 parts In-Stock

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$378.000

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$292.000

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Verical

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Electro Sonic

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IBS Electronics

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Vyrian

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Nova Conductors

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Chip Stock

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AZTECH Wire

Italy . 1,003 parts In-Stock

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Overview

Discover the power of the A54SX16PPQ208I by Microsemi, a top-quality Field Programmable Gate Array designed to elevate your projects to new heights. With 1452 CLBs and 16000 gates, this FPGA offers unparalleled flexibility and performance. Whether you're working on aerospace, automotive, telecommunications, or any other industry, this product delivers exceptional value and benefits. Trust in Microsemi's legacy of excellence and innovation, and unlock endless possibilities with the A54SX16PPQ208I. Elevate your designs with ease and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more efficient integration onto circuit boards, saving space and enabling faster assembly.

Maximum Supply Voltage: 3.6 V

Operating within a maximum supply voltage of 3.6V ensures stable performance while protecting the components from overvoltage damage.

No. of CLBs: 1452

With 1452 Configurable Logic Blocks (CLBs), the FPGA has a high level of flexibility and adaptability to fulfill diverse logic functions.

Technology Used: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity, enhancing the efficiency of the FPGA.

Package Shape: SQUARE

Square package shape offers efficient use of space and easy alignment during assembly, contributing to a compact and reliable design.

No. of Equivalent Gates: 16000

The high number of equivalent gates allows for complex logic operations and facilitates the implementation of large-scale digital circuits.

Nominal Supply Voltage (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and promotes energy efficiency.

No. of Terminals: 208

Having 208 terminals provides sufficient connectivity options for interfacing with other components and peripherals, enhancing the versatility of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for real-time configurable hardware implementations, enabling rapid prototyping and customization.

Package Style (Meter): FLATPACK, FINE PITCH

The flatpack, fine pitch package style offers a compact form factor and allows for high-density mounting on PCBs, optimizing space utilization.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the FPGA can withstand elevated environmental temperatures without compromising performance or reliability.

Pitch Of Terminal: 0.5 mm

The small pitch of 0.5mm enables high-density packaging and facilitates intricate circuit connections, enhancing the overall functionality of the FPGA.

Maximum Combinatorial Delay of a CLB: 0.9 ns

The low combinatorial delay of 0.9ns in a Configurable Logic Block (CLB) ensures fast signal processing and reduces latency within the FPGA.

Organization: 1452 CLBS, 16000 GATES

The organized structure with 1452 CLBs and 16000 gates allows for efficient logic design, implementation, and optimization in complex digital systems.

Minimum Operating Temperature: -40 °C

Operating down to -40°C ensures reliable performance in cold environments, making the FPGA suitable for a wide range of operating conditions.

Finishing Of Terminal Used: TIN LEAD

The use of tin lead finishing on terminals enhances solderability and ensures reliable electrical connections during assembly and operation.

Position Of Terminal: QUAD

Quad terminal positioning offers improved stability and mechanical strength during PCB mounting, reducing the risk of connection failures or signal interruptions.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling precautions to prevent detrimental effects on the FPGA components.

Maximum Seated Height: 4.1 mm

The maximum seated height of 4.1mm allows for low-profile integration in space-constrained applications, enabling versatile placement on PCBs.

Width: 28 mm

With a width of 28mm, the FPGA offers a balance between compact size and functional layout, facilitating easy integration into various electronic systems.

Maximum Clock Frequency: 240 MHz

Operating at a maximum clock frequency of 240MHz enables high-speed data processing and real-time operations, making the FPGA suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 20

The maximum time of 20 seconds at the peak reflow temperature ensures proper solder reflow and thermal stability during the manufacturing process.

Peak Reflow Temperature °C: 225

With a peak reflow temperature of 225°C, the FPGA can withstand the necessary soldering temperatures for reliable assembly onto PCBs.

Length: 28 mm

The length of 28mm contributes to the overall compact design of the FPGA, allowing for efficient placement and routing within electronic systems.

Grading Of Temperature: INDUSTRIAL

Having an industrial temperature grading ensures reliable performance across a wide temperature range, making the FPGA suitable for industrial-grade applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A54SX16PPQ208I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microsemi

IC Features

Programmable IC Type:

No. of CLBs:

1452

No. of Equivalent Gates:

16000

Maximum Clock Frequency:

240 MHz

CLB Maximum Delay:

0.9 ns

Technology:

CMOS

Organization:

1452 CLBS, 16000 Gates

Additional Features:

Can also be operated at 5 V; 24000 system gates also available

Power Characteristics

Nominal Supply Voltage:

3.3

Minimum Supply Voltage:

3 V

Maximum Supply Voltage:

3.6 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

20 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Fine Pitch

Package Code:

Package Shape:

Length:

28 mm

Width:

28 mm

Maximum Seated Height:

4.1 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

.5 mm

No. of Terminals:

208

Standards

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

A54SX16PPQ208I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microsemi

Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California.

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