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A54SX32A-CQ208M

Microchip Technology

A54SX32A-CQ208M by Microchip Technology

A54SX32A-CQ208M by Microchip Technology is a CMOS FPGA with 2880 logic cells and 48000 gates. It operates at a max clock frequency of 238 MHz, making it ideal for military-grade applications requiring high-speed processing in harsh environments. With a package style of flatpack and ceramic, metal-sealed cofired body material, this FPGA offers reliability and durability in compact designs.

Median Price

$7,776.860

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Microchip Technology

USA . 55 parts In-Stock

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$7,776.860

100+ parts

$7,560.820

1k+ parts

$4,904.320

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55

$7,776.860

$7,560.820

$4,904.320

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Distributors (In-Stock)

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NAC Semi

USA . 44 parts In-Stock

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$7,258.400

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$6,638.780

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44

$7,258.400

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Nova Conductors

Japan . 591 parts In-Stock

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$8,243.480

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Vyrian

USA . 6,804 parts In-Stock

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VNN

France . 3,713 parts In-Stock

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Chip Stock

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Digiode

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ComSIT Distribution GmbH

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AZTECH Wire

Italy . 1,596 parts In-Stock

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$10.753

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Semicontronic

India . 217 parts In-Stock

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$13.000

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$12.675

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$12.610

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$13.000

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$12.610

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Ampacity Inc.

Singapore . 1,008 parts In-Stock

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$29.000

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Component Stockers USA

USA . 706 parts In-Stock

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$99.990

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Vigor

Singapore . 99,550 parts In-Stock

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$5,328.010

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Continental Prestige Electronics

USA . 3,838 parts In-Stock

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$8,243.480

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$8,078.611

3,838

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Argo Parts USA

USA . 3,399 parts In-Stock

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$8,243.480

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$8,161.046

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$8,078.611

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$7,996.176

3,399

$8,243.480

$8,161.046

$8,078.611

$7,996.176

Netroflash

USA . 2,500 parts In-Stock

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$8,243.480

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$8,078.611

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$8,078.611

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QUARKTWIN TECHNOLOGY LTD

USA . 9,207 parts In-Stock

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Fulton Briggs Corp.

USA . 7,340 parts In-Stock

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Microchip USA

USA . 6,134 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Unleash the power of innovation with the A54SX32A-CQ208M by Microchip Technology, a top-tier manufacturer in the field programmable gate arrays (FPGA) category. Boasting 2880 logic cells and 48000 equivalent gates, this FPGA offers unparalleled flexibility for your design needs. With a maximum clock frequency of 238 MHz and operating temperatures ranging from -55 to 125°C, this versatile product is ideal for a wide range of applications. Elevate your projects to new heights with the cutting-edge technology and reliable performance of the A54SX32A-CQ208M.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability to the FPGA, making it suitable for rugged applications.

No. of Logic Cells: 2880

With a high number of logic cells, this FPGA can handle complex logic functions and designs efficiently.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures that the FPGA operates within safe voltage limits, enhancing its reliability.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this FPGA energy-efficient and reliable.

Maximum Clock Frequency: 238 MHz

The high maximum clock frequency enables fast processing and data transfer rates in applications that require real-time operation.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A54SX32A-CQ208M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

2880

No. of Inputs:

174

No. of Outputs:

174

No. of CLBs:

2880

No. of Equivalent Gates:

48000

Maximum Clock Frequency:

238 MHz

CLB Maximum Delay:

1.2 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2880 CLBS, 48000 Gates

Additional Features:

32000 typical gates available

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.25 V

Maximum Supply Voltage:

2.75 V

Power Supplies:

2.5,3.3/5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

20 s

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Surface Mountable:

Yes

Package Style:

Flatpack

Package Code:

QFF

Package Shape:

Length:

29.21 mm

Width:

29.21 mm

Maximum Seated Height:

3.3 mm

Package Equivalence Code:

TPAK208,2.9SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Tin/Lead

Terminal Pitch:

.5 mm

No. of Terminals:

208

Standards

JESD-30 Code:

S-CQFP-F208

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

A54SX32A-CQ208M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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