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A54SX32A-CQ208B

Microchip Technology

A54SX32A-CQ208B by Microchip Technology

A54SX32A-CQ208B by Microchip: 2880 logic cells, 48000 gates, max. clock freq. of 238 MHz. Ideal for military applications due to MIL-STD-883 Class B screening level and ceramic, metal-sealed co-fired package body material. Operates in temp range of -55 to 125 °C with supply voltage of 2.25V to 2.75V.

Median Price

$12,785.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Nova Conductors

Japan . 89 parts In-Stock

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Vyrian

USA . 6,157 parts In-Stock

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VNN

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Chip Stock

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Digiode

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AZTECH Wire

Italy . 1,507 parts In-Stock

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$19.100

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Ampacity Inc.

Singapore . 1,405 parts In-Stock

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Advanced Electronics

New Zealand . 31 parts In-Stock

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Vigor

Singapore . 94,000 parts In-Stock

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Semicontronic

India . 1 parts In-Stock

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Continental Prestige Electronics

USA . 9,340 parts In-Stock

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Argo Parts USA

USA . 8,444 parts In-Stock

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$12,401.557

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Netroflash

USA . 3,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Fulton Briggs Corp.

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Glotronic Ltd.

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Authorized Procurement Solutions

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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Corphita

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Futuretech Components

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Overview

Unlock the power of cutting-edge technology with the A54SX32A-CQ208B by Microchip Technology. This top-of-the-line Field Programmable Gate Array boasts unmatched quality and reliability, making it a standout choice for a wide range of applications. With 2880 logic cells and 48000 equivalent gates, this FPGA delivers exceptional performance and flexibility. Whether you're designing advanced electronics or pushing the boundaries of innovation, the A54SX32A-CQ208B offers unparalleled value, benefits, and advantages that will elevate your projects to new heights. Experience the difference with Microchip Technology.

Feature Benefit Bullets

No. of Logic Cells: 2880

Large number of logic cells allows for complex designs and high functionality in the FPGA.

Maximum Supply Voltage: 2.75 V

Higher supply voltage allows for better performance and stability in the FPGA.

Technology Used: CMOS

CMOS technology is known for low power consumption and high noise immunity, making this FPGA energy efficient and reliable.

Maximum Clock Frequency: 238 MHz

High clock frequency allows for fast processing and operation of the FPGA.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures the FPGA can be used in a variety of environmental conditions.

No. of Terminals: 208

Sufficient number of terminals for connectivity and integration with other components in a system.

Package Style (Meter): FLATPACK

Flatpack package style offers compact and space-saving design for efficient PCB layout and assembly.

Organization: 2880 CLBS, 48000 GATES

Organized structure of CLBs and gates allows for easy design implementation and optimization in the FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A54SX32A-CQ208B attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

2880

No. of Inputs:

174

No. of Outputs:

174

No. of CLBs:

2880

No. of Equivalent Gates:

48000

Maximum Clock Frequency:

238 MHz

CLB Maximum Delay:

1.2 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2880 CLBS, 48000 Gates

Additional Features:

32000 typical gates available

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.25 V

Maximum Supply Voltage:

2.75 V

Power Supplies:

2.5,3.3/5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Surface Mountable:

Yes

Package Style:

Flatpack

Package Code:

QFF

Package Shape:

Length:

29.21 mm

Width:

29.21 mm

Maximum Seated Height:

3.3 mm

Package Equivalence Code:

TPAK208,2.9SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

.5 mm

No. of Terminals:

208

Standards

JESD-30 Code:

S-CQFP-F208

JESD-609 Code:

e0

Qualified:

No

Screening Level:

MIL-STD-883 Class B

Trade Compliance

A54SX32A-CQ208B Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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