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A54SX32-1CQ208B

Microchip Technology

A54SX32-1CQ208B by Microchip Technology

A54SX32-1CQ208B by Microchip Technology is a FPGA with 2880 logic cells and 32000 gates. It operates at max frequency of 240 MHz, suitable for military applications due to MIL-STD-883 Class B screening level. With a package style of flatpack and ceramic body material, it offers high performance in harsh environments.

Median Price

$9,201.946

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Freelance Electronics

USA . 8 parts In-Stock

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$1,971.332

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$2,069.899

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$1,951.619

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8

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$1,951.619

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Nova Conductors

Japan . 300 parts In-Stock

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VNN

France . 2,822 parts In-Stock

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Vyrian

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Chip Stock

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Digiode

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Distributors (Availability)

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AZTECH Wire

Italy . 677 parts In-Stock

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$16.633

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Semicontronic

India . 739 parts In-Stock

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$33.000

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$32.175

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$32.010

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Component Stockers USA

USA . 455 parts In-Stock

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$99.990

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Advanced Electronics

New Zealand . 2,378 parts In-Stock

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$117.246

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$106.694

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$96.142

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Argo Parts USA

USA . 3,216 parts In-Stock

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$16,268.235

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$16,103.909

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$15,939.584

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$16,268.235

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$15,939.584

Continental Prestige Electronics

USA . 1,666 parts In-Stock

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Vigor

Singapore . 135,000 parts In-Stock

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Microchip USA

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Marpe Global Electronics

Taiwan . 5,360 parts In-Stock

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QualityLine Systems

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XL Components Corporation

Australia . 5,360 parts In-Stock

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Bastille Electronics

Australia . 870 parts In-Stock

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Corphita

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Overview

Unlock a world of possibilities with the A54SX32-1CQ208B by Microchip Technology, a top-quality Field Programmable Gate Array (FPGA) that offers unparalleled performance and versatility. With 2880 logic cells and 32000 equivalent gates, this FPGA is perfect for a wide range of applications. From aerospace to telecommunications, this product delivers exceptional value and benefits to customers seeking reliability and innovation. Trust in Microchip Technology's reputation for excellence and choose the A54SX32-1CQ208B for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed cofired package body material provides durability and reliability, making this FPGA suitable for harsh environments.

No. of Logic Cells: 2880

With a high number of logic cells, this FPGA can handle complex and large-scale designs efficiently.

Maximum Supply Voltage: 3.63 V

The maximum supply voltage of 3.63 V allows for flexibility in power supply options while ensuring stable operation.

Technology Used: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed performance, making this FPGA energy-efficient.

Maximum Clock Frequency: 240 MHz

The high maximum clock frequency of 240 MHz enables fast processing and execution of tasks, ideal for time-critical applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A54SX32-1CQ208B attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

2880

No. of Inputs:

246

No. of Outputs:

246

No. of CLBs:

2880

No. of Equivalent Gates:

32000

Maximum Clock Frequency:

240 MHz

CLB Maximum Delay:

0.9 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2880 CLBS, 32000 Gates

Additional Features:

48000 system gates avaiable

Power Characteristics

Nominal Supply Voltage:

3.3

Minimum Supply Voltage:

2.97 V

Maximum Supply Voltage:

3.63 V

Power Supplies:

3.3,5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Surface Mountable:

Yes

Package Style:

Flatpack

Package Code:

QFF

Package Shape:

Length:

29.21 mm

Width:

29.21 mm

Maximum Seated Height:

3.06 mm

Package Equivalence Code:

TPAK208,2.9SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

.5 mm

No. of Terminals:

208

Standards

JESD-30 Code:

S-CQFP-F208

JESD-609 Code:

e0

Qualified:

No

Screening Level:

MIL-STD-883 Class B

Trade Compliance

A54SX32-1CQ208B Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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