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A54SX32APQG208I

Microsemi

A54SX32APQG208I by Microsemi

A54SX32APQG208I by Microsemi is a CMOS FPGA with 2880 CLBs and 48000 gates. It operates at a max clock frequency of 238 MHz, suitable for industrial applications requiring high-speed processing. With a package style of flatpack and fine pitch, it offers versatile programmable IC capabilities in a compact form factor.

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$263.955

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Verical

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the A54SX32APQG208I by Microsemi! As a leader in Field Programmable Gate Arrays, Microsemi delivers unmatched quality and reliability. With 2880 logic cells and 48000 equivalent gates, this FPGA offers endless possibilities for applications in various industries. Whether you're designing advanced electronic systems or pushing the boundaries of innovation, this versatile product provides the performance and flexibility you need to succeed. Trust Microsemi's expertise and experience to take your projects to the next level with the A54SX32APQG208I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the FPGA, making it suitable for long-term use in various applications.

No. of Logic Cells: 2880

Having a high number of logic cells allows for complex programming and customization, making this FPGA versatile for a wide range of functions.

Surface Mount: YES

Being surface mountable makes installation and integration easier, saving time and effort in the assembly process.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V provides a stable power source for the FPGA, ensuring consistent performance.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this FPGA energy-efficient and reliable in noisy environments.

No. of Inputs: 174

Having a high number of inputs allows for a greater degree of input/output flexibility, enabling more complex functionality in the design.

Package Shape: SQUARE

The square package shape provides a compact form factor, saving space and making it suitable for applications with limited real estate.

Form Of Terminal: GULL WING

Gull wing terminals provide a reliable connection and ease of soldering during assembly, ensuring a secure electrical connection.

No. of Equivalent Gates: 48000

The large number of equivalent gates allows for the implementation of complex digital designs, offering a high level of functionality and performance.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage of 2.5 V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Power Supplies (V): 2.5, 3.3/5

Support for multiple power supplies provides flexibility in power management, allowing for optimal performance in various voltage scenarios.

No. of Terminals: 208

Having a high number of terminals enables a greater degree of connectivity and functionality, making this FPGA suitable for complex designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a programmable FPGA allows for customization and reconfiguration of logic functions, making it adaptable to changing requirements.

Package Style (Meter): FLATPACK, FINE PITCH

The flatpack, fine pitch package style offers high-density packaging and precise pin spacing, enabling compact designs and high-speed signal routing.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures reliable operation even at lower voltage levels, providing flexibility in power management.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this FPGA can withstand harsh environmental conditions and high-temperature applications.

Pitch Of Terminal: 0.5 mm

The small pitch of terminals allows for high-density packaging and precise connection, enabling efficient signal routing and minimizing signal interference.

Maximum Combinatorial Delay of a CLB: 1.2 ns

The low combinatorial delay of 1.2 ns ensures fast signal processing and minimal latency, making this FPGA suitable for high-speed applications.

Organization: 2880 CLBS, 48000 GATES

The organization of 2880 CLBs and 48000 gates provides a high level of logic capacity and flexibility, allowing for the implementation of complex designs.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this FPGA can operate in cold environments and withstand extreme temperature variations.

Finishing Of Terminal Used: MATTE TIN

The use of matte tin finishing on the terminals provides corrosion resistance and ensures a reliable electrical connection, enhancing the longevity of the FPGA.

Position Of Terminal: QUAD

The quad position of terminals allows for efficient signal routing and connectivity, enabling easy integration into complex circuit designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA is suitable for standard soldering processes and can withstand typical manufacturing and assembly environments.

Maximum Seated Height: 4.1 mm

The maximum seated height of 4.1 mm provides a low-profile design, making it suitable for applications with height constraints or compact spaces.

Width: 28 mm

The width of 28 mm offers a compact form factor, allowing for easy integration into PCB layouts and saving space in the overall system design.

Maximum Clock Frequency: 238 MHz

With a high maximum clock frequency of 238 MHz, this FPGA can handle high-speed data processing and complex calculations, making it suitable for real-time applications.

No. of Outputs: 174

Having a high number of outputs enables the FPGA to drive multiple external devices and interface with various components, increasing the versatility of the design.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and assembly, preventing overheating and damage to the FPGA during manufacturing.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, this FPGA can withstand high-temperature soldering processes and ensure a reliable solder joint for long-term use.

Length: 28 mm

The length of 28 mm offers a compact size, making it suitable for applications with space constraints and enabling easy integration into existing systems.

Grading Of Temperature: INDUSTRIAL

With an industrial temperature grading, this FPGA is designed to operate reliably in a wide range of temperature conditions, making it suitable for industrial and automotive applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A54SX32APQG208I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microsemi

IC Features

Programmable IC Type:

No. of Logic Cells:

2880

No. of Inputs:

174

No. of Outputs:

174

No. of CLBs:

2880

No. of Equivalent Gates:

48000

Maximum Clock Frequency:

238 MHz

CLB Maximum Delay:

1.2 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2880 CLBS, 48000 Gates

Additional Features:

32000 typical gates available

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.25 V

Maximum Supply Voltage:

2.75 V

Power Supplies:

2.5,3.3/5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Fine Pitch

Package Code:

Package Shape:

Length:

28 mm

Width:

28 mm

Maximum Seated Height:

4.1 mm

Package Equivalence Code:

QFP208,1.2SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

208

Standards

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

A54SX32APQG208I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microsemi

Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California.

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