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A54SX32A-PQG208I

Microchip Technology

A54SX32A-PQG208I by Microchip Technology

A54SX32A-PQG208I by Microchip Technology is a CMOS Field Programmable Gate Array (FPGA) with 2880 logic cells and 48000 equivalent gates. It operates at a max clock frequency of 238 MHz and is commonly used in industrial applications requiring high-speed processing.

Median Price

$263.955

Lifecycle Status

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14

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Master Electronics

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Arrow

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DigiKey

USA . 30 parts In-Stock

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Verical

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Digiode

USA . 277 parts In-Stock

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Electro Sonic

Canada . 24 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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IBS Electronics

USA . 26 parts In-Stock

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VNN

France . 5,460 parts In-Stock

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Chip Stock

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Component Sense

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ACDS - Activité Composants Distribution Service

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AZTECH Wire

Italy . 1,089 parts In-Stock

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$15.087

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Vigor

Singapore . 92,000 parts In-Stock

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Semicontronic

India . 21 parts In-Stock

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$187.054

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$186.094

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Ampacity Inc.

Singapore . 16 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 9,523 parts In-Stock

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Microchip USA

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West Coast Incorporated

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Glotronic Ltd.

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Overview

Experience the power of the A54SX32A-PQG208I FPGA from Microchip Technology. With its advanced CMOS technology and 2880 logic cells, this field programmable gate array delivers exceptional performance and reliability. Whether you're creating complex digital systems, designing high-speed interfaces, or developing innovative IoT solutions, the A54SX32A-PQG208I is your go-to choice. With a maximum clock frequency of 238 MHz and 48000 equivalent gates, this FPGA offers unmatched flexibility and scalability. Trust in Microchip's expertise and choose the A54SX32A-PQG208I for your next project. Unlock endless possibilities and unleash your creativity with this superior FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product uses a durable plastic/epoxy package body material, making it resistant to various environmental conditions and ensuring its longevity.

No. of Logic Cells: 2880

With a high number of logic cells, this FPGA can handle complex logic operations and provide ample resources for designing sophisticated circuits.

Surface Mount: YES

The surface mount feature allows for easy integration and soldering onto circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 2.75 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in different operating environments.

No. of CLBs: 2880

The abundance of configurable logic blocks (CLBs) enables the implementation of various digital functions, offering versatility in circuit design.

Technology Used: CMOS

Utilizing CMOS technology, this FPGA brings low power consumption, high noise immunity, and excellent performance, making it an efficient choice.

No. of Inputs: 174

With numerous input ports, this FPGA allows for the connection of a large number of external devices and signals, enabling complex input/output configurations.

Package Shape: SQUARE

The square-shaped package makes it easy to mount and integrate the FPGA into tight spaces, optimizing the utilization of available board real estate.

Form Of Terminal: GULL WING

Featuring gull-wing terminals, this FPGA ensures reliable and strong solder connections, minimizing the chances of electrical discontinuity and ensuring better functioning.

No. of Equivalent Gates: 48000

The vast number of equivalent gates allows for the implementation of intricate digital circuits, facilitating the realization of complex functionalities.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage of 2.5V offers stable and reliable operation, guaranteeing robust performance in various applications.

Power Supplies (V): 2.5,3.3/5

With multiple power supply options, this FPGA accommodates a wide range of voltage requirements, enhancing its versatility for different designs.

No. of Terminals: 208

The numerous terminals offer ample connectivity options for external interfacing, enabling seamless integration with other components or systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array (FPGA), this product allows for flexible modification of the circuit functionality, enabling customization and adaptability.

Package Style (Meter): FLATPACK, FINE PITCH

The flatpack, fine pitch package style enables easy handling, placement, and soldering, providing convenience during assembly.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage, this FPGA can operate in power-constrained environments while maintaining optimal performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product's reliability and robustness even in demanding industrial environments.

Pitch Of Terminal: 0.5 mm

The small pitch of 0.5mm between terminals allows for compact and dense circuit board designs, maximizing space utilization.

Maximum Combinatorial Delay of a CLB: 1.2 ns

The low maximum combinatorial delay of 1.2ns in a configurable logic block (CLB) ensures efficient operation and fast signal propagation.

Organization: 2880 CLBS, 48000 GATES

The organizational structure of 2880 configurable logic blocks (CLBs) and 48000 gates provides ample resources and flexibility for advanced circuit designs.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this FPGA can function reliably in extreme temperature conditions, expanding its range of applications.

Finishing Of Terminal Used: MATTE TIN

The matte tin finishing on the terminals ensures good electrical conductivity and corrosion resistance, enhancing the overall reliability and lifespan of the product.

Position Of Terminal: QUAD

The quad position of the terminals allows for easy and secure soldering, contributing to the product's robustness during operation.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate exposure to moisture, making it suitable for various operating environments.

Maximum Seated Height: 4.1 mm

The relatively low maximum seated height facilitates compact device designs, enabling its integration in space-constrained applications.

Width: 28 mm

The width of 28mm ensures a compact form factor, enabling the efficient utilization of board space.

Maximum Clock Frequency: 238 MHz

With a high maximum clock frequency of 238MHz, this FPGA can handle fast digital operations, making it ideal for demanding real-time applications.

No. of Outputs: 174

The large number of output ports allows for the efficient transmission of signals to other devices or circuit components, enabling versatile system integration.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this FPGA can withstand the reflow soldering process, ensuring successful assembly.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C guarantees proper soldering and connection reliability during the assembly process.

Length: 28 mm

The length of 28mm ensures a compact form factor, allowing for efficient utilization of available board space.

Grading Of Temperature: INDUSTRIAL

This FPGA is graded for industrial temperature ranges, making it suitable for harsh operating conditions commonly encountered in industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A54SX32A-PQG208I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

2880

No. of Inputs:

174

No. of Outputs:

174

No. of CLBs:

2880

No. of Equivalent Gates:

48000

Maximum Clock Frequency:

238 MHz

CLB Maximum Delay:

1.2 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2880 CLBS, 48000 Gates

Additional Features:

32000 typical gates available

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.25 V

Maximum Supply Voltage:

2.75 V

Power Supplies:

2.5,3.3/5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Fine Pitch

Package Code:

Package Shape:

Length:

28 mm

Width:

28 mm

Maximum Seated Height:

4.1 mm

Package Equivalence Code:

QFP208,1.2SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

208

Standards

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

A54SX32A-PQG208I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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