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Industrial FPGAs

Field Programmable Gate Arrays (FPGA)

Available Parts 998

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6SLX16-2FT256I by Xilinx

XC6SLX16-2FT256I

Xilinx

XC6SLX16-2FT256I by Xilinx is a FPGA with 14579 logic cells, 1139 CLBs, and max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing, it operates at temperatures ranging from -40 to 100°C and supports a variety of power supplies including 1.2V.

FPGA

14579

186

186

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX16-2FTG256I by Xilinx

XC6SLX16-2FTG256I

Xilinx

The Xilinx XC6SLX16-2FTG256I is a FPGA with 14579 logic cells, 1139 CLBs, and 186 inputs/outputs. It operates at max frequency of 667 MHz, suitable for industrial applications requiring high-speed processing. With a package style of grid array and low profile, it offers flexibility in design while maintaining a compact form factor.

FPGA

14579

186

186

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX16-3CPG196I by Xilinx

XC6SLX16-3CPG196I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

14579

106

106

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX16-3CSG225I by Xilinx

XC6SLX16-3CSG225I

Xilinx

XC6SLX16-3CSG225I by Xilinx is a CMOS-based FPGA with 14579 logic cells and 1139 CLBs. It operates at a max clock frequency of 862 MHz and is commonly used in industrial applications requiring high-performance programmable ICs.

FPGA

14579

160

160

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-3CSG324I by Xilinx

XC6SLX16-3CSG324I

Xilinx

The Xilinx XC6SLX16-3CSG324I is a FPGA with 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. It operates at a max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factors due to its low profile grid array package style.

FPGA

14579

232

232

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-3FT256I by Xilinx

XC6SLX16-3FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

14579

186

186

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX16-3FTG256I by Xilinx

XC6SLX16-3FTG256I

Xilinx

The Xilinx XC6SLX16-3FTG256I FPGA features 14579 logic cells, 1139 CLBs, and a max clock frequency of 862 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs with a package style of grid array for compact designs.

FPGA

14579

186

186

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX16-L1CSG225I by Xilinx

XC6SLX16-L1CSG225I

Xilinx

XC6SLX16-L1CSG225I by Xilinx is a FPGA with 14579 logic cells, 1139 CLBs, and 160 inputs/outputs. Operating at 1.05V, it uses CMOS technology and has a max combinatorial delay of 0.46ns. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

14579

160

160

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-L1CSG324I by Xilinx

XC6SLX16-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

14579

232

232

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-L1FT256I by Xilinx

XC6SLX16-L1FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

14579

186

186

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX16-L1FTG256I by Xilinx

XC6SLX16-L1FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

14579

186

186

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX25-2CSG324I by Xilinx

XC6SLX25-2CSG324I

Xilinx

Xilinx XC6SLX25-2CSG324I FPGA features 24051 logic cells, 1879 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

24051

226

226

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-2FG484I by Xilinx

XC6SLX25-2FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

24051

266

266

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX25-2FGG484I by Xilinx

XC6SLX25-2FGG484I

Xilinx

Xilinx XC6SLX25-2FGG484I FPGA features 24051 logic cells, 1879 CLBs, and 266 inputs/outputs. With a max clock frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The device operates b/w -40 to 100°C and supports supply voltages of 1.14V to 1.26V, making it versatile for various electronic designs.

FPGA

24051

266

266

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX25-2FT256I by Xilinx

XC6SLX25-2FT256I

Xilinx

Xilinx XC6SLX25-2FT256I FPGA features 24051 logic cells, 1879 CLBs, and max clock freq of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

24051

186

186

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX25-2FTG256I by Xilinx

XC6SLX25-2FTG256I

Xilinx

Xilinx XC6SLX25-2FTG256I FPGA features 24051 logic cells, 1879 CLBs, and max clock frequency of 667MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style: Grid Array, Low Profile.

FPGA

24051

186

186

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX25-3CSG324I by Xilinx

XC6SLX25-3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

24051

226

226

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-3FG484I by Xilinx

XC6SLX25-3FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

24051

266

266

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX25-3FGG484I by Xilinx

XC6SLX25-3FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

24051

266

266

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX25-3FT256I by Xilinx

XC6SLX25-3FT256I

Xilinx

Xilinx XC6SLX25-3FT256I FPGA features 24051 logic cells, 1879 CLBs, and max clock frequency of 862 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temp of 100°C.

FPGA

24051

186

186

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX25-3FTG256I by Xilinx

XC6SLX25-3FTG256I

Xilinx

Xilinx XC6SLX25-3FTG256I FPGA features 24051 logic cells, 1879 CLBs, and max clock frequency of 862 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

24051

186

186

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX25-L1CSG324I by Xilinx

XC6SLX25-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

24051

226

226

1879

0.46 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-L1FTG256I by Xilinx

XC6SLX25-L1FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

24051

186

186

1879

0.46 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX25T-2CSG324I by Xilinx

XC6SLX25T-2CSG324I

Xilinx

Xilinx XC6SLX25T-2CSG324I FPGA features 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. Utilized in industrial applications, it operates at a max frequency of 667 MHz with a combinatorial delay of 0.26 ns per CLB. The package style is grid array with low profile and fine pitch terminals.

FPGA

24051

190

190

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-2FG484I by Xilinx

XC6SLX25T-2FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

24051

250

250

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX25T-2FGG484I by Xilinx

XC6SLX25T-2FGG484I

Xilinx

Xilinx XC6SLX25T-2FGG484I FPGA features 24051 logic cells, 1879 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact package with a grid array style.

FPGA

24051

250

250

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX25T-3CSG324I by Xilinx

XC6SLX25T-3CSG324I

Xilinx

Xilinx XC6SLX25T-3CSG324I FPGA features 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The device operates b/w -40 to 100°C and supports supply voltages ranging from 1.14V to 2.5/3.3V, making it versatile for various electronic designs.

FPGA

24051

190

190

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-3FG484I by Xilinx

XC6SLX25T-3FG484I

Xilinx

XC6SLX25T-3FG484I by Xilinx is a CMOS-based FPGA with 24051 logic cells and 1879 CLBs. It operates at a max clock frequency of 862 MHz and is commonly used in industrial applications requiring high-performance programmable ICs.

FPGA

24051

250

250

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX25T-3FGG484I by Xilinx

XC6SLX25T-3FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

24051

250

250

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX4-2CPG196I by Xilinx

XC6SLX4-2CPG196I

Xilinx

Xilinx XC6SLX4-2CPG196I FPGA features 3840 logic cells, 300 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a package style of grid array, thin profile, and fine pitch.

FPGA

3840

100

100

300

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX4-2CSG225I by Xilinx

XC6SLX4-2CSG225I

Xilinx

Xilinx XC6SLX4-2CSG225I is a FPGA with 3840 logic cells, 300 CLBs, and 120 inputs/outputs. Operating at max frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range from -40 to 100°C.

FPGA

3840

120

120

300

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-2TQG144I by Xilinx

XC6SLX4-2TQG144I

Xilinx

The Xilinx XC6SLX4-2TQG144I is a FPGA with 3840 logic cells, 300 CLBs, and max clock frequency of 667 MHz. It operates at temperatures ranging from -40 to 100 °C and is ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

3840

100

100

300

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC6SLX4-3CPG196I by Xilinx

XC6SLX4-3CPG196I

Xilinx

XC6SLX4-3CPG196I by Xilinx is a FPGA with 3840 logic cells, 300 CLBs, and 106 inputs/outputs. Operating at max frequency of 862 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range of -40 to 100°C.

FPGA

3840

106

106

300

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX4-3CSG225I by Xilinx

XC6SLX4-3CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

3840

132

132

300

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-3TQG144I by Xilinx

XC6SLX4-3TQG144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

3840

102

102

300

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC6SLX4-L1CSG225I by Xilinx

XC6SLX4-L1CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

3840

120

120

300

0.46 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-L1TQG144I by Xilinx

XC6SLX4-L1TQG144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

3840

100

100

300

0.46 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC6SLX45-2CSG484I by Xilinx

XC6SLX45-2CSG484I

Xilinx

The Xilinx XC6SLX45-2CSG484I is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at industrial temperature range (-40 to 100°C) and uses CMOS technology. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

43661

310

310

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45-2FG484I by Xilinx

XC6SLX45-2FG484I

Xilinx

Xilinx XC6SLX45-2FG484I FPGA features 43661 logic cells, 3411 CLBs, and max clock freq of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.

FPGA

43661

316

316

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX45-2FG676I by Xilinx

XC6SLX45-2FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43661

358

358

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC6SLX45-2FGG484I by Xilinx

XC6SLX45-2FGG484I

Xilinx

Xilinx XC6SLX45-2FGG484I FPGA features 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range from -40 to 100°C and low power consumption at 1.2V, this FPGA offers versatile programmability for various electronic systems.

FPGA

43661

316

316

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX45-2FGG676I by Xilinx

XC6SLX45-2FGG676I

Xilinx

Xilinx XC6SLX45-2FGG676I FPGA features 43661 logic cells, 3411 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact 27x27 mm grid array package with bottom-positioned terminals.

FPGA

43661

358

358

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC6SLX45-3CSG324I by Xilinx

XC6SLX45-3CSG324I

Xilinx

Xilinx XC6SLX45-3CSG324I FPGA features 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. Operating temperature ranges from -40 to 100°C, making it suitable for various environments.

FPGA

43661

218

218

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45-3CSG484I by Xilinx

XC6SLX45-3CSG484I

Xilinx

The Xilinx XC6SLX45-3CSG484I is a FPGA with 43661 logic cells, 3411 CLBs, and 320 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factor with a grid array package style.

FPGA

43661

320

320

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45-3FG484I by Xilinx

XC6SLX45-3FG484I

Xilinx

The Xilinx XC6SLX45-3FG484I is a FPGA with 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. It operates at a voltage range of 1.14V to 1.26V and has a max combinatorial delay of 0.21ns per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

43661

316

316

3411

0.21 ns

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX45-3FG676I by Xilinx

XC6SLX45-3FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43661

358

358

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC6SLX45-3FGG484I by Xilinx

XC6SLX45-3FGG484I

Xilinx

Xilinx XC6SLX45-3FGG484I is a FPGA with 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. It operates at max frequency of 862 MHz, suitable for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and moisture sensitivity level of MSL3, it offers reliable performance in harsh environments.

FPGA

43661

316

316

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX45-3FGG676I by Xilinx

XC6SLX45-3FGG676I

Xilinx

Xilinx XC6SLX45-3FGG676I FPGA features 43661 logic cells, 3411 CLBs, and 358 inputs/outputs. Operating at a max frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a temperature range of -40 to 100°C. The package style is grid array with a square shape and ball terminals.

FPGA

43661

358

358

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No