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XC6SLX45-3FGG676I

Xilinx

XC6SLX45-3FGG676I by Xilinx

Xilinx XC6SLX45-3FGG676I FPGA features 43661 logic cells, 3411 CLBs, and 358 inputs/outputs. Operating at a max frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a temperature range of -40 to 100°C. The package style is grid array with a square shape and ball terminals.

Median Price

$185.250

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Overview

Unlock unparalleled performance and versatility with the XC6SLX45-3FGG676I by Xilinx, a top-tier manufacturer in the field programmable gate arrays (FPGA) category. Boasting 43661 logic cells and 3411 CLBs, this cutting-edge solution offers seamless integration and high-speed functionality for a wide range of applications. Experience the benefits of advanced CMOS technology, superior power efficiency, and precision engineering in a compact square package. Elevate your projects with the unbeatable value and reliability of Xilinx's premium FPGA solution, setting new standards in performance and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Good for providing protection to the internal components of the FPGA.

No. of Logic Cells: 43661

High number of logic cells allows for complex programmable logic implementations.

Surface Mount: YES

Easy to integrate into circuit boards for mass production.

Maximum Supply Voltage: 1.26 V

Operating at a low voltage for power efficiency.

Technology Used: CMOS

CMOS technology helps in reducing power consumption and heat generation.

Nominal Supply Voltage (V): 1.2

Stable supply voltage for consistent performance.

Maximum Clock Frequency: 862 MHz

High clock frequency allows for fast processing of logic operations.

Maximum Operating Temperature: 100 °C

Can operate in high temperature environments.

Minimum Operating Temperature: -40 °C

Can also operate in low temperature environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX45-3FGG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

43661

No. of Inputs:

358

No. of Outputs:

358

No. of CLBs:

3411

Maximum Clock Frequency:

862 MHz

CLB Maximum Delay:

0.21 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

3411 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX45-3FGG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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