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Industrial FPGAs

Field Programmable Gate Arrays (FPGA)

Available Parts 998

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC5VLX85T-2FF1136I by Xilinx

XC5VLX85T-2FF1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

82944

480

480

6480

0.77 ns

Field Programmable Gate Arrays

6480 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VLX85T-2FFG1136I by Xilinx

XC5VLX85T-2FFG1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

82944

480

480

6480

0.77 ns

Field Programmable Gate Arrays

6480 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VSX35T-1FF665I by Xilinx

XC5VSX35T-1FF665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

34816

360

360

2720

0.9 ns

CMOS

Field Programmable Gate Arrays

2720 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Lead

1 mm

665

S-PBGA-B665

e0

No

XC5VSX35T-1FFG665I by Xilinx

XC5VSX35T-1FFG665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

34816

360

360

2720

0.9 ns

CMOS

Field Programmable Gate Arrays

2720 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VSX35T-2FFG665I by Xilinx

XC5VSX35T-2FFG665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

34816

360

360

2720

0.77 ns

CMOS

Field Programmable Gate Arrays

2720 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VSX50T-1FF1136I by Xilinx

XC5VSX50T-1FF1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

52224

480

480

4080

0.9 ns

CMOS

Field Programmable Gate Arrays

4080 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VSX50T-1FF665I by Xilinx

XC5VSX50T-1FF665I

Xilinx

Xilinx XC5VSX50T-1FF665I FPGA features 52224 logic cells, 4080 CLBs, and 360 inputs/outputs. Utilized in industrial applications, it operates at -40 to 100°C with a max supply voltage of 1.05V. The package style is grid array with a moisture sensitivity level of 4.

FPGA

52224

360

360

4080

0.9 ns

CMOS

Field Programmable Gate Arrays

4080 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Lead

1 mm

665

S-PBGA-B665

e0

No

XC5VSX50T-1FFG1136I by Xilinx

XC5VSX50T-1FFG1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

52224

480

480

4080

0.9 ns

CMOS

Field Programmable Gate Arrays

4080 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VSX50T-1FFG665I by Xilinx

XC5VSX50T-1FFG665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

52224

360

360

4080

0.9 ns

CMOS

Field Programmable Gate Arrays

4080 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VSX50T-2FF1136I by Xilinx

XC5VSX50T-2FF1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

52224

480

480

4080

0.77 ns

CMOS

Field Programmable Gate Arrays

4080 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VSX50T-2FF665I by Xilinx

XC5VSX50T-2FF665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

52224

360

360

4080

0.77 ns

CMOS

Field Programmable Gate Arrays

4080 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Lead

1 mm

665

S-PBGA-B665

e0

No

XC5VSX50T-2FFG665I by Xilinx

XC5VSX50T-2FFG665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

52224

360

360

4080

0.77 ns

CMOS

Field Programmable Gate Arrays

4080 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VSX95T-1FF1136I by Xilinx

XC5VSX95T-1FF1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

94208

640

640

7360

0.9 ns

CMOS

Field Programmable Gate Arrays

7360 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VSX95T-1FFG1136I by Xilinx

XC5VSX95T-1FFG1136I

Xilinx

Xilinx XC5VSX95T-1FFG1136I FPGA features 94208 logic cells, 7360 CLBs, and 640 inputs/outputs. Utilized in industrial applications for its CMOS technology, with a max operating temperature of 100°C. Package style is grid array with a square shape and ball terminals.

FPGA

94208

640

640

7360

0.9 ns

CMOS

Field Programmable Gate Arrays

7360 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VSX95T-2FF1136I by Xilinx

XC5VSX95T-2FF1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

94208

640

640

7360

0.77 ns

CMOS

Field Programmable Gate Arrays

7360 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VSX95T-2FFG1136I by Xilinx

XC5VSX95T-2FFG1136I

Xilinx

The Xilinx XC5VSX95T-2FFG1136I is a FPGA with 94208 logic cells, 7360 CLBs, and 640 inputs/outputs. It operates at voltages of 1-2.5V, has a max combinatorial delay of 0.77ns, and can withstand industrial temperatures. Ideal for applications requiring high-speed processing and customization in fields like telecommunications and aerospace.

FPGA

94208

640

640

7360

0.77 ns

CMOS

Field Programmable Gate Arrays

7360 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

LFE2-12SE-5FN256I by Lattice Semiconductor

LFE2-12SE-5FN256I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

12000

193

193

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-20E-5FN256I by Lattice Semiconductor

LFE2-20E-5FN256I

Lattice Semiconductor

LFE2-20E-5FN256I by Lattice Semiconductor is a 20000 logic cell FPGA with 193 inputs/outputs, operating at max frequency of 311 MHz. Ideal for industrial applications due to its low combinatorial delay and wide temperature range (-40 to 85°C).

FPGA

20000

193

193

2625

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-20E-6FN484I by Lattice Semiconductor

LFE2-20E-6FN484I

Lattice Semiconductor

LFE2-20E-6FN484I by Lattice Semiconductor is a 20000 Logic Cells FPGA with 2625 CLBs, 331 Inputs/Outputs, and max clock frequency of 357 MHz. It operates at industrial temperatures (-40 to 85°C) and has a package style of Grid Array. Ideal for high-performance applications requiring fast processing speeds in compact designs.

FPGA

20000

331

331

2625

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE2-35E-6FN484I by Lattice Semiconductor

LFE2-35E-6FN484I

Lattice Semiconductor

Lattice Semiconductor's LFE2-35E-6FN484I FPGA features 35000 logic cells, 4000 CLBs, and a max clock frequency of 357 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a grid array package style.

FPGA

35000

331

331

4000

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE2-6E-6FN256I by Lattice Semiconductor

LFE2-6E-6FN256I

Lattice Semiconductor

LFE2-6E-6FN256I by Lattice Semiconductor is a 6000 logic cell FPGA with 750 CLBs and 190 inputs/outputs. Operating at up to 357 MHz, it suits industrial applications requiring high-speed processing in a compact 17x17mm grid array package.

FPGA

6000

190

190

750

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-6SE-6FN256I by Lattice Semiconductor

LFE2-6SE-6FN256I

Lattice Semiconductor

LFE2-6SE-6FN256I by Lattice Semiconductor is a 6000 logic cell FPGA with 750 CLBs, operating at max 357 MHz. Ideal for industrial applications due to its wide temperature range (-40 to 85 °C) and small form factor (17x17 mm), making it suitable for high-speed processing needs.

FPGA

6000

190

190

750

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-70SE-5FN672I by Lattice Semiconductor

LFE2-70SE-5FN672I

Lattice Semiconductor

LFE2-70SE-5FN672I by Lattice Semiconductor is a 70000 logic cell FPGA with 8500 CLBs, 500 inputs/outputs, and max clock frequency of 311 MHz. Ideal for industrial applications due to its low combinatorial delay, operating temp range of -40 to 85 °C, and MSL level of 3.

FPGA

70000

500

500

8500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE2M100E-6FN900I by Lattice Semiconductor

LFE2M100E-6FN900I

Lattice Semiconductor

LFE2M100E-6FN900I by Lattice Semiconductor is a 100000 logic cell FPGA with 416 inputs/outputs, operating at up to 357 MHz. Ideal for industrial applications requiring high-speed processing in a compact 31mm square package with a max supply voltage of 1.26V.

FPGA

100000

416

416

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

LFE2M20E-5FN256I by Lattice Semiconductor

LFE2M20E-5FN256I

Lattice Semiconductor

LFE2M20E-5FN256I by Lattice Semiconductor is a 20000 logic cell FPGA with 2375 CLBs, 140 inputs/outputs, and max clock frequency of 311 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. Operates at temperatures ranging from -40 to 85°C with a low combinatorial delay of 0.358 ns.

FPGA

20000

140

140

2375

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2M20E-5FN484I by Lattice Semiconductor

LFE2M20E-5FN484I

Lattice Semiconductor

LFE2M20E-5FN484I by Lattice Semiconductor is a 20000 Logic Cells FPGA with 2375 CLBs, 304 Inputs/Outputs, and max clock frequency of 311 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor.

FPGA

20000

304

304

2375

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE2M35E-5FN256I by Lattice Semiconductor

LFE2M35E-5FN256I

Lattice Semiconductor

LFE2M35E-5FN256I by Lattice Semiconductor is a 35000 Logic Cells FPGA with 4250 CLBs, 140 Inputs/Outputs, and max clock frequency of 311 MHz. Ideal for industrial applications requiring high-speed processing in compact form factor with operating temp range -40 to 85°C.

FPGA

35000

140

140

4250

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S1400A-4FG484I by Xilinx

XC3S1400A-4FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

25344

375

288

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S1400A-4FG676I by Xilinx

XC3S1400A-4FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

25344

502

408

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S1400A-4FGG484I by Xilinx

XC3S1400A-4FGG484I

Xilinx

Xilinx XC3S1400A-4FGG484I FPGA offers 25344 logic cells, 2816 CLBs, and 1400000 gates. Ideal for industrial applications with a max clock frequency of 667 MHz, operating temperature range from -40 to 100°C, and a compact package size of 23x23 mm.

FPGA

25344

375

288

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S1400A-4FGG676I by Xilinx

XC3S1400A-4FGG676I

Xilinx

Xilinx XC3S1400A-4FGG676I is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 gates. It operates at max frequency of 667 MHz and has 502 inputs and 408 outputs. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

25344

502

408

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S200A-4FG320I by Xilinx

XC3S200A-4FG320I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

4032

248

192

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC3S200A-4FGG320I by Xilinx

XC3S200A-4FGG320I

Xilinx

The Xilinx XC3S200A-4FGG320I is a FPGA with 4032 logic cells, 448 CLBs, and 200000 equivalent gates. It operates at a max clock frequency of 667 MHz and has a combinatorial delay of 0.71 ns per CLB. Ideal for industrial applications requiring high-speed processing and programmable logic capabilities.

FPGA

4032

248

192

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S200A-4FT256I by Xilinx

XC3S200A-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S200A-4FTG256I by Xilinx

XC3S200A-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S400A-4FG320I by Xilinx

XC3S400A-4FG320I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

251

192

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC3S400A-4FG400I by Xilinx

XC3S400A-4FG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S400A-4FGG320I by Xilinx

XC3S400A-4FGG320I

Xilinx

Xilinx XC3S400A-4FGG320I is a FPGA with 8064 logic cells, 896 CLBs, and 400000 gates. It operates at max frequency of 667 MHz and supports industrial temperature range. Ideal for applications requiring high-speed processing in compact form factors.

FPGA

8064

251

192

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S400A-4FGG400I by Xilinx

XC3S400A-4FGG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S400A-4FT256I by Xilinx

XC3S400A-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

195

160

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S50A-4FT256I by Xilinx

XC3S50A-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1584

144

112

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S50A-4FTG256I by Xilinx

XC3S50A-4FTG256I

Xilinx

Xilinx XC3S50A-4FTG256I is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at max frequency of 667 MHz and supports industrial temperature range. Ideal for applications requiring high-speed processing in compact form factors.

FPGA

1584

144

112

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S50A-4TQ144I by Xilinx

XC3S50A-4TQ144I

Xilinx

Xilinx XC3S50A-4TQ144I FPGA features 1584 logic cells, 176 CLBs, and 50000 equivalent gates. With a max clock frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package.

FPGA

1584

108

101

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC3S50A-4TQG144I by Xilinx

XC3S50A-4TQG144I

Xilinx

Xilinx XC3S50A-4TQG144I FPGA features 1584 logic cells, 176 CLBs, and 50000 equivalent gates. With a max clock frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact package with low power consumption.

FPGA

1584

108

101

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC3S700A-4FG400I by Xilinx

XC3S700A-4FG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

311

248

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S700A-4FG484I by Xilinx

XC3S700A-4FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S700A-4FGG400I by Xilinx

XC3S700A-4FGG400I

Xilinx

Xilinx XC3S700A-4FGG400I FPGA features 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. It operates at a max clock frequency of 667 MHz with a combinatorial delay of 0.71 ns per CLB. Ideal for industrial applications requiring high-speed processing and programmable IC solutions.

FPGA

13248

311

248

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S700A-4FGG484I by Xilinx

XC3S700A-4FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No