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Industrial FPGAs

Field Programmable Gate Arrays (FPGA)

Available Parts 998

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC3S1400AN-4FG676I by Xilinx

XC3S1400AN-4FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

25344

502

408

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S1400AN-4FGG676I by Xilinx

XC3S1400AN-4FGG676I

Xilinx

The Xilinx XC3S1400AN-4FGG676I is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 equivalent gates. It operates at a max frequency of 667 MHz and has a combinatorial delay of 0.71 ns per CLB. Ideal for industrial applications requiring high-speed processing and programmable logic capabilities.

FPGA

25344

502

408

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S200AN-4FT256I by Xilinx

XC3S200AN-4FT256I

Xilinx

The Xilinx XC3S200AN-4FT256I is a FPGA with 4032 logic cells, 448 CLBs, and 195 inputs. Operating at max clock frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and low profile, it offers versatility in design while maintaining reliability under varying temperatures.

FPGA

4032

195

160

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400AN-4FG400I by Xilinx

XC3S400AN-4FG400I

Xilinx

The Xilinx XC3S400AN-4FG400I is a FPGA with 8064 logic cells, 896 CLBs, and 400000 equivalent gates. It operates at max clock frequency of 667 MHz and has a combinatorial delay of 0.71 ns per CLB. Ideal for industrial applications requiring high-speed processing and programmable logic capabilities.

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S400AN-4FGG400I by Xilinx

XC3S400AN-4FGG400I

Xilinx

Xilinx XC3S400AN-4FGG400I FPGA offers 8064 logic cells, 896 CLBs, and 400000 gates. With a max clock frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. The package style is grid array with a square shape and ball terminals, making it suitable for surface mount assembly.

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S50AN-4TQ144I by Xilinx

XC3S50AN-4TQ144I

Xilinx

Xilinx XC3S50AN-4TQ144I FPGA features 176 CLBs, 50000 gates, and max clock freq of 280 MHz. Ideal for industrial applications with temp range -40 to 85°C. Utilizes CMOS tech with supply voltage range of 1.14-1.26 V for versatile performance in various electronic systems.

FPGA

176

50000

280 MHz

4.97 ns

CMOS

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC3S700AN-4FG484I by Xilinx

XC3S700AN-4FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S700AN-4FGG484I by Xilinx

XC3S700AN-4FGG484I

Xilinx

The Xilinx XC3S700AN-4FGG484I is a FPGA with 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. It operates at a max frequency of 667 MHz and has a combinatorial delay of 0.71 ns. Ideal for industrial applications requiring high-speed processing in compact form factors.

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XA3S1000-4FTG256I by Xilinx

XA3S1000-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

17280

391

391

1920

1000000

125 MHz

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

TQFP100,.63SQ

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S1500-4FGG456I by Xilinx

XA3S1500-4FGG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

29952

487

487

3328

1500000

125 MHz

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

AEC-Q100

XA3S1600E-4FGG484I by Xilinx

XA3S1600E-4FGG484I

Xilinx

XA3S1600E-4FGG484I by Xilinx is a FPGA with 33192 logic cells, 3688 CLBs, and 1600000 gates. Operating at 572 MHz, it's ideal for industrial applications requiring high-speed processing and low power consumption. With a max supply voltage of 1.26V and operating temperature range from -40 to 85°C, it offers reliable performance in various environments.

FPGA

33192

376

294

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA3S200-4TQG144I by Xilinx

XA3S200-4TQG144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

4320

173

173

480

200000

125 MHz

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

XA3S250E-4PQG208I by Xilinx

XA3S250E-4PQG208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

5508

158

126

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XA3S400-4FGG456I by Xilinx

XA3S400-4FGG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

264

264

896

400000

125 MHz

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

AEC-Q100

XA3S500E-4PQG208I by Xilinx

XA3S500E-4PQG208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

10476

158

126

1164

500000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XA3S1500-4FGG676I by Xilinx

XA3S1500-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

29952

487

487

3328

1500000

125 MHz

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

AEC-Q100

XC6VHX250T-1FF1154I by Xilinx

XC6VHX250T-1FF1154I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

251904

320

320

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VHX250T-2FFG1154I by Xilinx

XC6VHX250T-2FFG1154I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1154; Package Code: BGA; Package Shape: SQUARE;

FPGA

251904

320

320

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1154

S-PBGA-B1154

e1

No

XC6VHX380T-2FFG1154I by Xilinx

XC6VHX380T-2FFG1154I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1154; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

320

320

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1154

S-PBGA-B1154

e1

No

XC6VHX380T-2FFG1923I by Xilinx

XC6VHX380T-2FFG1923I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

720

720

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No

XC6VHX380T-2FFG1924I by Xilinx

XC6VHX380T-2FFG1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

640

640

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1924,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1924

S-PBGA-B1924

e1

No

XC6VLX130T-1FF1156I by Xilinx

XC6VLX130T-1FF1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VLX130T-1FF484I by Xilinx

XC6VLX130T-1FF484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6VLX130T-1FFG1156I by Xilinx

XC6VLX130T-1FFG1156I

Xilinx

Xilinx XC6VLX130T-1FFG1156I FPGA features 128,000 logic cells, 600 inputs/outputs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a package style of grid array and operating temperature range from -40 to 100°C.

FPGA

128000

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VLX130T-1FFG484I by Xilinx

XC6VLX130T-1FFG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX130T-1FFG784I by Xilinx

XC6VLX130T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX130T-2FF1156I by Xilinx

XC6VLX130T-2FF1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

600

600

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VLX130T-2FF784I by Xilinx

XC6VLX130T-2FF784I

Xilinx

Xilinx XC6VLX130T-2FF784I FPGA features 128000 logic cells, 400 inputs/outputs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.

FPGA

128000

400

400

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX130T-2FFG1156I by Xilinx

XC6VLX130T-2FFG1156I

Xilinx

Xilinx XC6VLX130T-2FFG1156I is a 128000 logic cell FPGA with CMOS technology. It operates at max 1.05V, has 600 inputs/outputs, and supports clock frequency up to 1286MHz. Ideal for industrial applications requiring high-speed processing in compact form factor.

FPGA

128000

600

600

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VLX130T-2FFG484I by Xilinx

XC6VLX130T-2FFG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX130T-2FFG784I by Xilinx

XC6VLX130T-2FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX130T-L1FF1156I by Xilinx

XC6VLX130T-L1FF1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

600

600

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VLX130T-L1FF784I by Xilinx

XC6VLX130T-L1FF784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX130T-L1FFG784I by Xilinx

XC6VLX130T-L1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX195T-1FF1156I by Xilinx

XC6VLX195T-1FF1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VLX195T-1FFG1156I by Xilinx

XC6VLX195T-1FFG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VLX195T-1FFG784I by Xilinx

XC6VLX195T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX195T-2FF1156I by Xilinx

XC6VLX195T-2FF1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

600

600

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VLX195T-2FFG1156I by Xilinx

XC6VLX195T-2FFG1156I

Xilinx

Xilinx XC6VLX195T-2FFG1156I FPGA features 199680 logic cells, 600 inputs/outputs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact package with CMOS technology.

FPGA

199680

600

600

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VLX195T-2FFG784I by Xilinx

XC6VLX195T-2FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX195T-L1FF784I by Xilinx

XC6VLX195T-L1FF784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX195T-L1FFG784I by Xilinx

XC6VLX195T-L1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX240T-1FF1156I by Xilinx

XC6VLX240T-1FF1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

241152

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VLX240T-1FF1759I by Xilinx

XC6VLX240T-1FF1759I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

241152

720

720

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin Lead

1 mm

1759

S-PBGA-B1759

e0

No

XC6VLX240T-1FF784I by Xilinx

XC6VLX240T-1FF784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

241152

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX240T-1FFG1156I by Xilinx

XC6VLX240T-1FFG1156I

Xilinx

Xilinx XC6VLX240T-1FFG1156I FPGA features 241152 logic cells, 600 inputs/outputs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact package with CMOS technology.

FPGA

241152

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VLX240T-1FFG784I by Xilinx

XC6VLX240T-1FFG784I

Xilinx

The Xilinx XC6VLX240T-1FFG784I is a FPGA with 241152 logic cells, 400 inputs/outputs, and max clock frequency of 1098 MHz. It operates at -40 to 100 °C and uses CMOS technology. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

241152

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX240T-2FF1156I by Xilinx

XC6VLX240T-2FF1156I

Xilinx

XC6VLX240T-2FF1156I by Xilinx is a FPGA with 241152 logic cells, 600 inputs/outputs, and max clock frequency of 1286 MHz. It operates at industrial temperatures, suitable for high-performance applications like telecommunications and data processing.

FPGA

241152

600

600

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No