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XC3S200AN-4FT256I

Xilinx

XC3S200AN-4FT256I by Xilinx

The Xilinx XC3S200AN-4FT256I is a FPGA with 4032 logic cells, 448 CLBs, and 195 inputs. Operating at max clock frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and low profile, it offers versatility in design while maintaining reliability under varying temperatures.

Median Price

$79.625

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Mouser Electronics

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Rochester

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Digiode

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Nova Conductors

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Kenton Components

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Vigor

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Advanced Electronics

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Continental Prestige Electronics

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Netroflash

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Overview

Unlock limitless possibilities with the Xilinx XC3S200AN-4FT256I Field Programmable Gate Array. Manufactured by Xilinx, a renowned leader in FPGA technology, this high-quality product offers 4032 logic cells and 448 CLBs for unmatched performance. Ideal for a wide range of applications, from industrial automation to telecommunications, this FPGA provides customers with exceptional value, flexibility, and reliability. Experience the advantages of cutting-edge technology and elevate your projects to new heights with the XC3S200AN-4FT256I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various applications.

No. of Logic Cells: 4032

With a high number of logic cells, this FPGA offers versatile and complex programmable capabilities.

Surface Mount: YES

Being surface mountable makes installation and integration of this FPGA easier and more efficient in electronic circuits.

Maximum Supply Voltage: 1.26 V

The ability to work with a maximum supply voltage of 1.26V allows for low power consumption in applications.

No. of CLBs: 448

The high number of Configurable Logic Blocks provides flexibility for designing custom logic circuits.

Technology Used: CMOS

Complementary Metal-Oxide-Semiconductor technology ensures low power consumption and high noise immunity.

No. of Inputs: 195

The ample number of inputs allows for complex input configurations and data processing.

Package Shape: SQUARE

The square shape of the package offers efficient use of space and easy integration into circuit layouts.

Form Of Terminal: BALL

The ball form of terminals makes it suitable for high-density mounting and ensures reliable connections.

No. of Equivalent Gates: 200000

With a large number of equivalent gates, this FPGA can handle complex logic operations and designs.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures compatibility with standard power sources and efficient power usage.

Power Supplies (V): 1.2, 1.2/3.3, 3.3

Support for multiple power supply voltages offers flexibility in different applications and system designs.

No. of Terminals: 256

The ample number of terminals allows for multiple connections and ease of integration in a circuit.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, this FPGA offers flexibility for customization and reprogramming as needed.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style offers space-saving and efficient heat dissipation characteristics.

Minimum Supply Voltage: 1.14 V

The ability to operate at a minimum supply voltage of 1.14V ensures compatibility with low-power applications.

Maximum Operating Temperature: 100 °C

The high operating temperature range of 100°C enables this FPGA to be used in a variety of environments.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for high-density mounting and efficient use of space on a PCB.

Maximum Combinatorial Delay of a CLB: 0.71 ns

The low combinatorial delay ensures quick response and high-speed operation in logic circuits.

Organization: 448 CLBS, 200000 GATES

With a well-organized structure of CLBs and gates, this FPGA offers efficient logic design and implementation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for use in harsh environmental conditions.

Finishing Of Terminal Used: TIN LEAD

The use of tin-lead finishing on terminals ensures good solderability and reliable connections.

Position Of Terminal: BOTTOM

The terminal position at the bottom of the package enables easy and secure mounting on a PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this FPGA has a moderate level of moisture sensitivity, suitable for standard handling and storage conditions.

Maximum Seated Height: 1.55 mm

The low seated height of 1.55mm makes this FPGA suitable for compact electronic device designs.

Width: 17 mm

The width of 17mm provides a compact form factor for easy integration into electronic systems.

Maximum Clock Frequency: 667 MHz

With a high maximum clock frequency, this FPGA can handle high-speed data processing and logic operations.

No. of Outputs: 160

The ample number of outputs allows for diverse output configurations and data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this FPGA can withstand soldering processes easily.

Peak Reflow Temperature °C: 240

The peak reflow temperature of 240°C ensures proper soldering and reliability of connections.

Length: 17 mm

The length of 17mm offers a compact dimension for efficient PCB layout and space-saving designs.

Grading Of Temperature: INDUSTRIAL

Designed to operate in industrial temperature ranges, this FPGA is suitable for robust and demanding applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S200AN-4FT256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

4032

No. of Inputs:

195

No. of Outputs:

160

No. of CLBs:

448

No. of Equivalent Gates:

200000

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.71 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

448 CLBS, 200000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

240 °C (464 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC3S200AN-4FT256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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